Claims
- 1. A curable pressure-sensitive adhesive resist remover, comprising
- a curable pressure-sensitive adhesive polymer, obtained by copolymerizing a monomer containing a carboxyl group or a hydroxyl group,
- compounded with a non-volatile compound having at least one unsaturated double bond curable by light and having a good affinity with a resist material, and further being compatible with the pressure-sensitive adhesive polymer,
- and further containing a photopolymerization initiator,
- further containing a polyfunctional compound,
- with the pressure-sensitive adhesive resist remover having a post-curing modulus of elasticity at least 5 times its pre-curing modulus of elasticity.
- 2. The curable pressure-sensitive adhesive resist remover as claimed in claim 1, wherein the curable pressure-sensitive adhesive contains metal impurities in an amount of 10 ppm or less.
- 3. The curable pressure-sensitive adhesive resist remover as claimed in claim 1, wherein the non-volatile compound is contained in an amount of from 20 to 200 parts by weight per 100 parts by weight of the pressure-sensitive adhesive polymer.
- 4. The curable pressure-sensitive adhesive resist remover as claimed in claim 1, wherein the non-volatile compound is used as a mixture of two or more thereof.
- 5. The curable pressure-sensitive adhesive resist remover as claimed in claim 1, wherein the curable pressure-sensitive adhesive contains a polyfunctional compound in an amount of 20 parts by weight or less per 100 parts by weight of the pressure-sensitive adhesive polymer.
- 6. The curable pressure-sensitive adhesive resist remover as claimed in claim 1, wherein the pressure-sensitive adhesive polymer comprises an acrylic polymer comprising a (meth)acrylic acid alkyl ester as the main monomer.
- 7. The curable pressure-sensitive adhesive resist remover as claimed in claim 6, wherein the acrylic polymer is a copolymer of a (meth)acrylic acid alkyl ester and a monomer having a carboxyl group or a hydroxyl group.
- 8. The curable pressure-sensitive adhesive resist remover as claimed in claim 6, wherein the acrylic polymer has a glass transition point of 250.degree. K. or less.
Parent Case Info
This is a continuation of application Ser. No. 08/528,229, filed Sep. 14, 1995, now abandoned, which is a divisional of application Ser. No. 08/288,988, filed Aug. 11, 1994, now U.S. Pat. No. 5,466,325, which is a continuation of application Ser. No. 08/070,299, filed Jun. 2, 1993, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (1)
Number |
Date |
Country |
59-157162 |
Sep 1984 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
288988 |
Aug 1994 |
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Continuations (2)
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Number |
Date |
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Parent |
528229 |
Sep 1995 |
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Parent |
070299 |
Jun 1993 |
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