Claims
- 1. An accelerometer, comprising:
- a semiconductor substrate defining a semiconductor substrate plane;
- a proof mass formed in a proof mass plane above and parallel to said semiconductor substrate plane;
- a first resonant tuning fork connected to said proof mass, said first resonant tuning fork being formed on said semiconductor substrate;
- a second resonant tuning fork connected to said proof mass, said second resonant tuning fork being formed on said semiconductor substrate; and
- a flexural lever leverage system supporting said proof mass above said semiconductor substrate, said flexural lever leverage system enhancing an acceleration force applied to said proof mass to cause a tensile force in said first resonant tuning fork which raises the resonant frequency of said first resonant tuning fork, and a compressive force in said second resonant tuning fork which lowers the resonant frequency of said second resonant tuning fork.
- 2. The accelerometer of claim 1 wherein said flexural lever leverage system includes a first flexural lever pivot and a second flexural lever pivot to support said proof mass above said semiconductor substrate.
- 3. The accelerometer of claim 2 wherein said flexural lever leverage system includes a first flexural lever arm connected to said first flexural lever pivot and a second flexural lever arm connected to said second flexural lever pivot; said first flexural lever arm flexing with respect to said first flexural lever pivot and said second flexural lever arm flexing with respect to said second flexural lever pivot in response to said acceleration force to enhance the force of said proof mass on said first resonant tuning fork and said second resonant tuning fork.
- 4. The accelerometer of claim 1 wherein said semiconductor substrate is silicon.
- 5. The accelerometer of claim 1 wherein said proof mass is polysilicon.
- 6. An accelerometer, comprising:
- a semiconductor substrate;
- a proof mass positioned above said semiconductor substrate;
- a flexural lever pivot formed in said semiconductor substrate and connected to said proof mass;
- a first tuning fork;
- a second tuning fork; and
- a lever arm connected between said first tuning fork and said flexural lever pivot, and between said second tuning fork and said flexural lever pivot, wherein an acceleration force causes said proof mass to drive said lever arm with respect to said flexural lever pivot and thereby apply a tensile force to said first tuning fork and a compressive force to said second tuning fork.
- 7. The accelerometer of claim 6 wherein said semiconductor substrate is silicon.
- 8. The accelerometer of claim 6 wherein said proof mass is polysilicon.
- 9. An accelerometer, comprising:
- a first tuning fork;
- a first flexural lever pivot;
- a first lever arm connected to said first flexural lever pivot and said first tuning fork such that said first lever arm flexes about said first flexural lever pivot in the presence of an acceleration force and thereby applies a tensile force to said first tuning fork;
- a second tuning fork;
- a second flexural lever pivot;
- a second lever arm connected to said second flexural lever pivot and said second tuning fork such that said second lever arm flexes about said second flexural lever pivot in the presence of said acceleration force and thereby applies a compressive force to said second tuning fork; and
- a proof mass connected to said first lever arm and said second lever arm to enhance said acceleration force.
- 10. The accelerometer of claim 9 wherein said first flexural lever pivot and said second flexural lever pivot are formed as protrusions on a semiconductor substrate and operate to support said proof mass above said semiconductor substrate.
- 11. The accelerometer of claim 9 wherein said proof mass is formed of polysilicon.
Parent Case Info
This application claims priority to the provisional patent application entitled "Resonant Accelerometer with Flexural Lever Levarage System", filed May 7, 1997, Serial No. 60/045,812.
Government Interests
This invention was made with Government support under Grant (Contract) No. DABT63-93-C-0065 awarded by ARPA. The Government has certain rights to this invention.
US Referenced Citations (5)