FIG. 1 is a front view of a RF electrode for a process tube of semiconductor manufacturing apparatus showing our new design;
FIG. 2 is a back view thereof;
FIG. 3 is a plan view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is an enlarged sectional view taken along with line VI—VI of FIG. 1;
FIG. 7 is an enlarged sectional view taken along with line VII—VII of FIG. 1;
FIG. 8 is a perspective view as seen from the front side thereof;
FIG. 9 is a reference drawing showing a state of use of a RF electrode; and,
FIG. 10 is a reference drawing showing a state of use of a RF electrode.