RFID tag with redundant non-volatile memory cell

Abstract

Two floating gate devices are arranged in a redundant configuration in a non-volatile memory (NVM) of a Radio Frequency Identification (RFID) tag such that stress induced leakage current (SILC) or other failures do not result in a complete loss of memory storage. The redundant NVM may be arranged as a series configuration, a parallel configuration, a single-ended device, a differential device, a simple logic circuit function, and/or a complex logic circuit function.

Description

FIELD OF THE INVENTION

The present invention generally relates to Radio Frequency Identification (RFID) tag using non-volatile memory (NVM). More particularly, the present invention is related to RFID tags with NVMs that may be arranged in a redundant configuration for improved reliability.

BACKGROUND

Many electronic system applications require non-volatile memory (NVM) to provide a variety of functions. Example applications for NVM include storing: security settings, serial numbers, RFID data, system configurations, calibration settings, trim settings, parameters, computer instructions (e.g., firmware), as well as others. The reprogramming of an NVM is very useful in the field of electronic tags such as RFID tags. Information that is stored in an NVM of an RFID tag can be remotely sensed for various system purposes such as electronic inventory control, electronic security systems, data logging applications, as well as others.

Reliability of NVM devices is important in field based applications, where failures are prone to occur as a result of built-in defect in materials, misuse, environmental abuse, or some other mechanically, electrically, or electro-mechanically induced failure may occur. There are several methods that can be used to increase the reliability in the NVM including error correction code (ECC) methods and various redundant NVM architectures, which have been evaluated in pursuit of the instant disclosure.

Error correction code (ECC) methodologies use software and/or hardware based error checking algorithms to evaluate data that is stored in the NVM to determine if the data is error free. Example ECC methods include odd/even parity checking, odd/even checksum, cyclic redundancy codes (CRC), as well as others. A problem that has been reviewed in consideration of the present disclosure is that additional memory bits and additional circuits may be necessary in the NVM to allow for ECCs. The number of additional memory bits depends on the configuration of the memory, i.e., word size. The additional circuitry is necessary to decode the information stored in the NVM. ECC topologies can usually only correct for single bit failures. Higher order ECC topologies can be used to correct for multiple bit failures but also need additional area and additional circuit complexity.

An example redundant NVM architecture that has been evaluated in consideration of the present disclosure is to use additional data bits (e.g., 2 bits) as a backup for each single bit of data. Although this is a fully redundant solution, the resulting NVM is very inefficient in the use of area (e.g., 200% greater than the original area for 2 additional data bits) in implementing a solution.

BRIEF DESCRIPTION OF THE DRAWINGS

Non-limiting and non-exhaustive embodiments are described with reference to the following drawings:

FIG. 1A is a schematic diagram of a non-volatile memory (NVM) circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 1B is another schematic diagram of a NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 1C is yet another schematic diagram of an NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 2 is a schematic diagram of a NVM circuit that employs redundant n-type transistors in a parallel configuration;

FIG. 3 is a schematic diagram of a differential NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 4 is a schematic diagram of a differential NVM circuit that employs redundant n-type transistors in a parallel configuration;

FIG. 5 is a schematic diagram of example cell selection circuits for a NVM circuit;

FIG. 6 is a schematic illustration of adding and removing electrons from a floating gate in a NVM circuit with a capacitive based charge control circuit;

FIG. 7 is a block diagram illustrating example array structures for redundant NVM circuits;

FIG. 8 is a schematic diagram illustrating a configurable differential NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 9 is schematic diagram illustrating another configurable differential NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 10 is schematic diagram illustrating still another configurable differential NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 11 is a schematic diagram illustrating yet another NVM circuit that employs redundant p-type transistors in a parallel configuration;

FIG. 12 is a schematic diagram illustrating another NVM circuit that employs redundant n-type transistors in a series configuration;

FIG. 13 is a schematic diagram illustrating an inverter circuit that includes redundant p-type transistors and redundant n-type transistors in parallel and series configurations;

FIG. 14 is a schematic diagram illustrating the conversion of a floating gate NAND circuit to a redundant floating gate NAND circuit;

FIG. 15 is a diagram illustrating components of a radio frequency identification tag (RFID tag); and

FIG. 16 is a block diagram illustrating example electronics for the RFID tag illustrated in FIG. 15, where the electronics include a redundant NVM circuit.

DETAILED DESCRIPTION

Various embodiments of the present invention will be described in detail with reference to the drawings, where like reference numerals represent like parts and assemblies throughout the several views. Reference to various embodiments does not limit the scope of the invention, which is limited only by the scope of the claims attached hereto. Additionally, any examples set forth in this specification are not intended to be limiting and merely set forth some of the many possible embodiments for the claimed invention.

Throughout the specification and claims, the following terms take at least the meanings explicitly associated herein, unless the context clearly dictates otherwise. The meanings identified below are not intended to limit the terms, but merely provide illustrative examples for the terms. The meaning of “a,” “an,” and “the” includes plural reference, the meaning of “in” includes “in” and “on.” The term “connected” means a direct electrical connection between the items connected, without any intermediate devices. The term “coupled” means either a direct electrical connection between the items connected or an indirect connection through one or more passive or active intermediary devices. The term “circuit” means either a single component or a multiplicity of components, either active and/or passive, that are coupled together to provide a desired function. The term “signal” means at least one current, voltage, charge, temperature, data, or other signal.

Briefly stated, two or more floating gate devices are arranged in a redundant configuration in a non-volatile memory (NVM) such that stress induced leakage current (SILC) or other failures do not result in a complete loss of memory storage. The redundant NVM may be arranged as a series configuration, a parallel configuration, a single-ended device, a differential device, a simple logic circuit function, a complex logic circuit function, and/or as part of an RFID tag system.

The present disclosure applies generally to redundant NVM architectures, and has particular application in both low-density and high-density NVM. An example redundant NVM might be found in an embedded CMOS application. Such embedded CMOS applications include (but are not limited to) storing: serial numbers (i.e. chip tags), configuration information in ASICs (application specific integrated circuits), product, package and/or asset data in radio frequency identification (RFID) integrated circuits, code or data in embedded processors (e.g., microprocessors, microcontrollers, etc), analog trim information, digital trim information, FPGA configuration information, and a host of other applications as will now be apparent to those skilled in the art.

NVM devices store information by changing the physical attributes of a transistor or other circuit element in the NVM. In the case of floating-gate memories (e.g. Flash or EEPROM), a quantity of electrons stored on an electrically isolated (floating) gate of a silicon MOSFET (metal oxide semiconductor field effect transistor) is changed to store information. All NVM devices wear out, meaning that after a certain number of write/erase cycles the NVM memory will no longer meet its retention requirement (e.g., 10-yr retention). In the case of floating-gate memories, wear out may occur because the process of moving electrons through the insulating oxide surrounding an electrically isolated gate eventually damages the insulating oxide.

Information is stored in a floating-gate type NVM by changing the amount of electronics that are stored on the floating gate. Adding or removing electrons from the floating gate (e.g., a floating gate in a MOSFET device) results in a change in the threshold voltage associated with the device. To read data from the NVM memory cell, the channel current (or currents in the case of the differential NVM cell) associated with the device is measured. Depending on the quantity of electrons present on the floating gate, the MOSFET device will either be biased active (e.g., “on”) or inactive (e.g., “off”). The measured channel current is interpreted as either a logical “1” or a logical “0” based on the relative on/off state of the floating-gate transistors.

The operation of various redundant NVM cells will be described in further detail by way of examples found below. The described redundant NVM architecture may be applied to single-ended NVM cells, differential NVM cells, and configurable NVM cells that may be configured for either single ended or differential operation. Moreover, the redundant NVM architecture concepts may be applied to logic cell architectures such as, for example, NAND arrays, NOR arrays, AND arrays, OR arrays, and INVERTER cells, as well as embedded NVM devices such as for RFID tags.

In one example redundant NVM cell configuration, an “on” state associated with an original floating gate device may leak such that the original floating gate device changes from an “on” state to an “off” state, For this example, a redundant floating gate device is effectively provided in parallel with the original floating gate device such that the redundant circuit as a whole appears as a device that is maintained in the “on” state.

In another example redundant NVM cell configuration, an “off” state associated with an original floating gate device may leak such that the original floating gate device changes from an “off” state to an “on” state, For this example, a redundant floating gate device may be effectively provided in series with the original floating gate device such that the redundant circuit as a whole appears as a device that is maintained in the “off” state.

FIG. 1A is a schematic diagram of a non-volatile memory (NVM) circuit (100) that employs redundant p-type transistors in a parallel configuration. The example redundant NVM circuit includes a cell selection circuit, a first charge control circuit, a second charge control circuit, two p-type floating gate MOSFET devices, and a current sense circuit. The two p-type floating gate MOSFET devices are coupled together in parallel, where each has a separate floating gate (FG11, FG12) that may be separately controlled by a respective one of the charge control circuits. The cell selection circuit is arranged to activate a particular NVM cell for operation (e.g., program or readout), and the current sense circuit is arranged to sense the operating currents (e.g., I11, I12) of the NVM cell during a readout operation to provide signal OUT100.

FIG. 1B is another schematic diagram of a NVM circuit (100′) that employs redundant p-type transistors in a parallel configuration. FIG. 1B is substantially similar to FIG. 1A in general operation in that charge control circuits are provided to the floating gates (FG11, FG12) of the p-type MOSFET devices.

The cell selection circuit illustrated in FIG. 1B is a switch circuit that includes a p-type MOSFET transistor that is series coupled between a power terminal (e.g., VDD) and the source terminals of the parallel coupled p-type MOSFET devices. The switch circuit is responsive to a control signal (NSEL) such that the source terminals of the parallel coupled p-type floating gate MOSFET devices are: coupled to the power terminal when the switch circuit is operated in a closed circuit condition and isolated from the power terminal when the switch circuit is operated in an open circuit condition.

An example current sense circuit is illustrated in FIG. 1B by a sense amplifier circuit and a current source circuit. The current source circuit is coupled between the drain terminals of the parallel coupled p-type floating gate MOSFET devices and another power terminal (e.g., VSS or GND). The current source circuit, which is illustrated as an n-type MOSFET transistor, is biased by a bias signal to draw current I100 from the drain terminals of the p-type floating gate MOSFET devices. When either of the p-type floating gate MOSFET devices is active, current I100 is non-zero and the sense amplifier appropriately asserts OUT100 to a first condition (e.g., logic “1”). When both of the p-type floating gate MOSFET devices are inactive, current I100 is zero and the current source pulls the signal associated with the drain terminals to the other power terminal voltage (e.g., VSS or GND), and the sense amplifier asserts OUT100 to a second condition (e.g., logic “0”).

FIG. 1C is yet another schematic diagram of an NVM circuit (100″) that employs redundant p-type transistors in a parallel configuration. NVM circuit 100″ includes two pairs of p-type floating gate MOSFET devices, a pair of current source circuits, a switch circuit, a pair of charge control circuits (CCC), and a sense circuit. The first pair of p-type floating gate MOSFET devices are coupled together in parallel, where each has a separate floating gate (FG11, FG12) that may be separately controlled by a respective one of the charge control circuits (CCC). The drain terminals of the first pair of p-type floating gate MOSFET devices are coupled to an injection voltage level (VINJ). The source terminals of the first pair of p-type floating gate MOSFET devices are selectively coupled to a power supply level (e.g., VDD) via the series coupled switch circuit and current source circuit. The second pair of p-type floating gate MOSFET devices are coupled together in parallel, where each has a separate floating gate that is separately controlled by a respective one of the charge control circuits (CCC). The drain terminals of the second pair of p-type floating gate MOSFET devices are coupled to the sense circuit. The source terminals of the second pair of p-type floating gate MOSFET devices are selectively coupled to a power supply level (e.g., VDD) via the second current source circuit.

Failures for floating gate NVM cells are dominated by stress induced leakage current (SILC), which is due to random defects. When the density of defects is small, there is no correlation between the presence/absence of SILC related leakage on adjacent NVM cells. The NVM memory cell has two states. In one state, the read transistor is normally conductive (“on” or “active”) and the other state (or complementary state) the read transistor is normally non-conductive or only weakly conducting (“off” or “inactive”).

Each p-type floating gate MOSFET device is operated in one of two states “active” and “inactive” (or “on” and “off”) based on the quantity of electrons that are stored on their respective floating gate. For this example, the “on” states of the p-type floating gate MOSFET devices have more electrons on the floating gate than the “off” states. As a consequence, the “on” state may be susceptible to leakage mechanisms such as stress induced leakage current (SILC), and could lose its excess of electrons and transition from the “on” state to the “off” state. Since the two p-type MOSFET devices are effectively in parallel with one another, the failure of one p-type MOSFET is mitigated by the operation of the other p-type MOSFET. By adding a second, “redundant”, floating gate (FG1) and readout transistor to the cell, the current path from the cell selection circuitry to the current sensing circuitry will not be broken off by the leakage. The two floating gate p-type MOSFET devices can optionally be arranged in a shared n-well region as illustrated by common bulk connection (see e.g., B10, B20, etc.) such that the area consumed by the NVM cell is dramatically reduced.

FIG. 2 is a schematic diagram of a NVM circuit (200) that employs redundant n-type transistors in a parallel configuration. NVM circuit 200 is substantially similar to that described with respect to NVM circuit 100 of FIG. 1A, except that the floating gate devices are n-type floating gate MOSFET devices.

FIG. 3 is a schematic diagram of a differential NVM circuit (300) that employs redundant p-type transistors in a parallel configuration. NVM circuit 300 includes a cell selection circuit, a first charge control circuit, a second charge control circuit, a third charge control circuit, a fourth charge control circuit, four p-type floating gate MOSFET devices, and a differential current sense circuit. Two p-type floating gate MOSFET devices are coupled together in parallel, where each has a separate floating gate (FG31, FG32) that may be separately controlled by a respective one of the charge control circuits. Another two p-type floating gate MOSFET devices are coupled together in parallel, where each has a separate floating gate (FG33, FG34) that may be separately controlled by a respective one of the charge control circuits. The cell selection circuit is arranged to activate a particular NVM cell for operation (e.g., program or readout), and the differential current sense circuit is arranged to sense the operating currents (e.g., I300, I301) of the NVM cell during a readout operation to provide signal OUT300.

FIG. 4 is a schematic diagram of a differential NVM circuit (400) that employs redundant n-type transistors in a parallel configuration. Differential NVM circuit 400 is substantially similar in operation to NVM circuit 300 from FIG. 3.

FIG. 5 is a schematic diagram of example cell selection circuits (500) for an NVM circuit. In one example (510), the selection circuit comprises the series combination of a resistor and a switch circuit. In another example (520), the selection circuit comprises the series combination of a current source and a switch circuit. In yet another example (530), the selection circuit comprises the series combination of a biased transistor current source and a transistor switch circuit. In still another example (540), a selectable current source is provided by a transistor that is selectively biased or disabled for operation by a set of transistor switching circuits.

FIG. 6 is a schematic illustration (600) of adding (610) and removing (620) electrons from a floating gate device in a NVM circuit with a capacitive based charge control circuit. The capacitor devices described herein are merely example devices that are provided to illustrate of the overall concept. However, capacitor Cc corresponds to a control transistor, while capacitor Ct corresponds to a tunneling transistor. A voltage is provided across the oxide of a floating gate device by applying a voltage (Vc) across Cc or by applying another voltage (Vt) across Ct. Capacitor Cc and Ct are not equal in value such that the floating gate voltage is more strongly coupled to the control voltage Vc than Vt.

The floating gate devices described herein can be implemented as single polysilicon based devices with an injection transistor and a tunneling transistor, where the injection transistor is also the read-out transistor. The electron removal may be accomplished by Fowler-Nordheim (FN) tunneling and electron addition is by hot electron injection. In one example, the charge injection/remove circuitry is a p-type MOSFET with its source/drain and n-well tied together to a tunneling signal (e.g. Vt).

In another embodiment, the floating gate devices may be implemented as double polysilicon based devices. In this case, the charge injection/remove circuitry and the read-out transistor may be a single double poly based p-type MOSFET.

In yet another embodiment, a one time programmable cell can be implemented where the charge injection and removal circuitry can be omitted. The readout of the p-type MOSFET an initially be erased by exposure to UV light, and subsequently programmed by hot electron injection.

In still another embodiment, the floating gate devices are single poly devices, and the charge injection and removal circuitry is composed of a control gate and a tunneling junction. The electron removal and injection for this example may be accomplished with bi-directional FN tunneling.

The procedure for adding electrons (610) in this example results in a drop of the floating gate voltage from 0V to −2V. At time t0, capacitors Cc and Ct have 0V across them and the floating gate voltage is 0V. At time t1, Vc=10V and a large electric field is provided to the oxide of the tunneling device (Ct) and at time t2 electrons begin tunneling through the oxide towards the floating gate. At time t3 the field is removed from the tunneling device and the floating gate has a voltage of −2V.

The procedure for removing electrons (620) in this example results in an increase in the floating gate voltage from 0V to 2V. At time t0, capacitors Cc and Ct have 0V across them and the floating gate voltage is 0V. At time t1, Vt=10V and a large electric field is provided to the oxide of the tunneling device (Ct) and at time t2 electrons begin tunneling through the oxide away from the floating gate. At time t3 the field is removed from the tunneling device and the floating gate has a voltage of 2V.

FIG. 7 is a block diagram illustrating example array structures (700) for redundant NVM circuits. A linear array (or 1-D array) is illustrated (710) as a set of redundant NVM circuits that are all coupled to a selection circuit and a sense circuit. A matrix array (or 2-D array) is illustrated (720) as an N×M array of rows and columns, where each row is responsive to a row select circuit, and each column is response to a column select circuit, where each activated row and column has an X, Y coordinate in the matrix that is coupled to the sense circuit.

FIG. 8 is a schematic diagram illustrating a configurable differential NVM circuit (800) that employs redundant p-type transistors in a parallel configuration. The configurable differential NVM circuit (800) includes two half-circuits that are selectively coupled together for differential operation via a switch circuit that is responsive to a differential selection signal (NDIFFSEL).

A first half circuit includes two charge injection circuits that are arranged to control charge to a respective gate terminal for two p-type floating gate transistors that share common drains and sources. Each charge injection circuits comprises a control transistor and a tunneling transistor, where the gates of the control and tunneling transistors are coupled to the floating gate terminal, and where each of the control and tunneling transistor has a common connection for their respective drain, source, and bulk connections to one of Vc0 and Vt. A current source is coupled between Vc0 and the source of the parallel coupled p-type floating gate transistors. The drain of the parallel coupled floating gate transistors are arranged to provide a first half of the output current from drain terminal d0.

A second half circuit includes two more charge injection circuits are arranged to control charge to a respective gate terminal for two more p-type floating gate transistors that share common drains and sources. Each charge injection circuits comprises a control transistor and a tunneling transistor, where the gates of the control and tunneling transistors are coupled to the floating gate terminal, and where each of the control and tunneling transistor has a common connection for their respective drain, source, and bulk connections to one of Vc1 and Vt. Another current source is coupled between Vc1 and the source of the parallel coupled p-type floating gate transistors. The drain of the parallel coupled floating gate transistors are arranged to provide a second half of the output current from drain terminal d1.

FIG. 9 is schematic diagram illustrating another configurable differential NVM circuit (900) that employs redundant p-type transistors in a parallel configuration similar to FIG. 8. However, the drain terminals of each of the p-type floating gate transistors of FIG. 9 are maintained as separate terminals (d0, d0R, d1 and d1R).

FIG. 10 is schematic diagram illustrating another configurable differential NVM circuit (1000) that employs redundant p-type transistors in a parallel configuration similar to FIG. 8. However, the source terminals of each of the p-type floating gate transistors of FIG. 9 are maintained as separate terminals that are individually coupled to a respective control voltage (Vc0, Vc1) through a respective current source. An additional pair of switches are arranged to selectively short together the current sources and source terminals of the redundant p-type transistors that are coupled together in parallel in response to the differential selection signal (NDIFFSEL).

FIG. 11 is a schematic diagram illustrating yet another NVM circuit (1100) that employs redundant p-type transistors in a parallel configuration. A first p-type floating gate transistor includes a gate that is designated as FG111, while a second p-type floating gate transistor includes a gate that is designated as FG112. The source terminals of the p-type floating gate transistors is coupled to an enable signal (REN), while the drain terminals are coupled together to a series switching device that provides signal DL0 when signal RSB is low. Each of the p-type floating gate transistor devices has a respective charge control circuit that comprises a capacitive control device (e.g., a capacitor) and a capacitive tunneling device (e.g., a transistor).

FIG. 12 is a schematic diagram illustrating another NVM circuit (1200) that employs redundant n-type transistors in a series configuration. The example redundant NVM circuit (1200) includes a cell selection circuit, a first charge control circuit, a second charge control circuit, two n-type floating gate MOSFET devices, and a current sense circuit. The two n-type floating gate MOSFET devices are coupled together in series, where each has a separate floating gate (FG121, FG122) that may be separately controlled by a respective one of the charge control circuits. The cell selection circuit is arranged to activate a particular NVM cell for operation (e.g., program or readout), and the current sense circuit is arranged to sense the operating currents (e.g., I1200) of the NVM cell during a readout operation to provide signal OUT1200.

The n-type floating gate MOSFET device acts as a readout transistor and has two states, “on” or “off”. The “off” state has more electrons on the floating gate than the “on” states. As a consequence, the “off” state is susceptible to leakage mechanisms such as SILC, and could lose its excess of electrons and become “on”. By adding a second, “redundant”, floating gate and readout transistor to the cell, the current path from the cell selection circuitry to the current sensing circuitry will conduct by the leakage. The two n-type floating gate devices can optionally be arranged in a shared p-well region such that the area consumed by the NVM cell is dramatically reduced.

FIG. 13 is a schematic diagram illustrating an inverter circuit (1300) that includes redundant p-type floating gate transistors and redundant n-type floating gate transistors in parallel and series configurations. The p-type floating gate transistors have source terminals (and optionally bulk or substrate terminals) that are coupled together to VDD, and drain terminals that are coupled together to the output terminal (OUT1300). The n-type floating gate transistors have drain and source terminals (and optionally common bulk or substrate terminals) that are coupled in series between OUT1300 and VDD. A first capacitor circuit is coupled between IN1300 and a common point for a first p-type floating gate transistor and a first n-type floating gate transistor. A second capacitor circuit is coupled between IN1300 and another common point for a second p-type floating gate transistor and a second n-type floating gate transistor.

In one alternative embodiment one of the redundant n-type floating gate transistors is eliminated from FIG. 13. In another alternative embodiment one of the redundant p-type floating gate transistors is eliminated from FIG. 13.

FIG. 14 is a schematic diagram (1400) illustrating the conversion of a floating gate NAND circuit (1410) to a redundant floating gate NAND circuit (1420). The floating gate NAND circuit (1410) includes a stack of series coupled n-type floating gate transistors, with a common bitline connection, each of the transistors having a separate gate control signal (CG1 . . . CGN), and series switches designated by SG1 and SG2. After converting the floating gate NAND circuit (1410) to a redundant floating gate structure (1420), each of the floating gate transistor devices is replaced by a series coupled floating gate device with a common gate connection to a control signal (CG1′ . . . SGN′). The memory transistors (or floating gate transistors) could be implemented as either n-type or p-type floating gate devices.

FIG. 15 is a diagram illustrating components of a radio frequency identification tag (RFID tag 1500) that may be adapted for use with a redundant NVM circuit. The RFID tag RF tag electronics that are in electrical communication with an antenna such as a dipole, microstrip, or stripline antenna.

FIG. 16 is a block diagram illustrating example electronics (1600) for the RFID tag illustrated in FIG. 15, where the electronics include a redundant NVM circuit. The RF tag electronics may include a signal routing circuit that is arranged to switch signals between the antenna(s) and other components such as a demodulator, a modulator, and a power management unit. The demodulator, modulator, and power management unit are also in electrical communication with the processing circuit. The processing circuit includes a memory circuit, and additional circuits such as an input conditioning circuit, a processing circuit, an output conditioning circuit, a decoder, and an encoder. The memory circuit may include both volatile and non-volatile memory types, where the non-volatile memory is a redundant memory such as described in the present disclosure.

The above specification, examples and data provide a complete description of the manufacture and use of the composition of the invention. Since many embodiments of the invention can be made without departing from the spirit and scope of the invention, the invention resides in the claims hereinafter appended.

Claims

1. A radio frequency identification (RFID) tag that receives a wave, the RFID tag comprising: an antenna that is arranged to receive the wave and provide a signal responsive to the received wave;a processing circuit coupled to the antenna and configured to receive the signal, the processing circuit including a redundant non-volatile memory (NVM) circuit, wherein the NVM circuit includes: a first field effect transistor (FET) circuit of a first type, wherein the first FET circuit includes a first floating gate terminal configured to be programmed to an “on” state or an “off” state; anda second FET circuit of the first type, wherein the first FET circuit is arranged in a redundant circuit configuration with respect to the second FET circuit the second FET circuit includes a second floating gate terminal configured to be programmed to an “on” state or an “off” state, and wherein the redundant circuit configuration is configured to cause the first and second FET circuit to assume the same “on” or “off” state upon programming.

2. The RFID tag of claim 1, wherein the redundant NVM circuit configuration comprises at least one of: a parallel configuration and a series configuration.

3. The RFID tag of claim 1, wherein the first type corresponds to at least one of a p-type and an n-type.

4. The RFID tag of claim 1, wherein the first and second FET arrangement is configured to operate as a portion of at least one of: a one-dimensional NVM array, a two-dimensional NVM array, a NAND circuit, a NOR circuit, a NAND NVM array circuit, a NOR NVM array circuit, an inverter NVM circuit, and a logic circuit.

5. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises a cell selection circuit that is coupled to the first FET circuit and the second FET circuit.

6. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises a cell selection circuit that is coupled to at least one of the first FET circuit and the second FET circuit.

7. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises a first cell selection circuit and a second cell selection circuit, wherein the first cell selection circuit is coupled to the first FET circuit and the second cell selection circuit is coupled to the second FET circuit.

8. The RFID tag of claim 1, wherein a first floating gate associated with the first FET circuit and a second floating gate associated with the second FET circuit each comprises at least one of: a polysilicon material from a single poly process, and a polysilicon material from a double poly process.

9. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises a cell selection circuit that is arranged to select at least one of the first FET circuit and the second FET circuit for operation.

10. The RFID tag of claim 9, wherein the cell selection circuit is coupled between a power terminal and at least one of the first and second FET circuits, and wherein the cell selection circuit comprises at least one of: a resistor, a first current source, a selectable current source, a first switching circuit, a second current source in series with a second switching circuit, and a biased transistor in series with a third switching circuit.

11. The RFID tag of claim 1, wherein the first FET circuit and the second FET circuit are arranged in a shared region of material of a second type that is different from the first type.

12. The RFID tag of claim 11, wherein the region of material corresponds to at least one of: a substrate region of the second type, and a well region of a second type that is formed on a substrate of the first type.

13. The RFID tag of claim 11, wherein the first type is associated with a type material and the second type is associated with an n-type material.

14. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises: a current sense circuit that is arranged to sense an output associated with at least one of the first FET circuit and second FET circuit.

15. The RFID tag of claim 14, wherein the redundant NVM circuit further comprises: a third FET circuit of the first type that is coupled to the first floating gate terminal; anda fourth FET circuit of the first type that is coupled to the second floating gate terminal, wherein the third FET circuit is arranged in the redundant circuit configuration with the fourth FET circuit.

16. The RFID tag of claim 14, wherein the redundant NVM circuit further comprises: a third FET circuit of the first type that is coupled to the first floating gate terminal;a fourth FET circuit of the first type that is coupled to the second floating gate terminal;a current source circuit that is coupled to the third and fourth FET circuits; anda sense circuit that is coupled to the third and fourth FET circuits.

17. The RFID tag of claim 14, wherein the redundant NVM circuit further comprises: a third FET circuit of the first type, wherein the third FET circuit includes a first sense gate terminal that is coupled to the first floating gate terminal; anda FET circuit of the first type, wherein the fourth FET circuit includes a second sense gate terminal that is coupled to the second floating gate terminal.

18. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises: a first charge control circuit that is arranged to adjust charge associated with the first floating gate terminal; anda second charge control circuit that is arranged to adjust charge associated with the second floating gate terminal.

19. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit each comprise a capacitor circuit.

20. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit each comprise a capacitor circuit that share a common input.

21. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit each comprise a capacitor circuit that is arranged to tunnel electrons to a respective one of the floating gate terminals.

22. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit are arranged to provide at least one of: Fowler-Nordheim (FN) tunneling, and direct tunneling.

23. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit each comprise a capacitor circuit that corresponds to at least one of: a polysilicon over substrate based capacitor, a polysilicon over polysilicon based capacitor, a metal over substrate based capacitor, a metal over metal based capacitor, and a FET based capacitor.

24. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit each comprise a charge injection circuit that is configured for at least one of: hot electron injection, hot hole injection, channel hot electron injection, channel hot hole injection, substrate hot electron injection, substrate hot hole injection, impact ionization generated hot electron injection, and impact ionization generated hot hole injection.

25. The RFID tag of claim 18, wherein the first charge control circuit and the second charge control circuit are combined into a shared charge control circuit.

26. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises: a third FET circuit coupled to a third floating gate terminal and configured to be programmed to an “on” state or an “off” state; anda fourth FET circuit coupled to a fourth floating gate terminal and configured to be programmed to an “on” state or an “off” state, wherein the third FET circuit is arranged in a redundant circuit configuration with respect to the fourth FET circuit configured to be programmed to an “on” state or an “off” state, and wherein the redundant circuit configuration is configured to cause the third and fourth FET circuit to assume the same “on” or “off” state upon programming.

27. The RFID tag of claim 26, wherein the first FET circuit and the second FET circuit are further arranged as a first half of a differential NVM circuit, and wherein the third FET circuit and the fourth FET circuit are further arranged as a second half of the differential NVM circuit.

28. The RFID tag of claim 18, wherein the redundant NVM circuit further comprises: a fifth FET circuit configured to selectively couple the first and second FET arrangement to the third and fourth FET arrangement for differential operation, and also arranged to decouple the first and second FET arrangement from the third and fourth FET arrangement for non-differential operation.

29. The RFID tag of claim 18, wherein the redundant NVM circuit further comprises: a differential current sense circuit that is coupled to the first, second, third, and fourth FET circuits.

30. The RFID tag of claim 18, wherein the first and second FET arrangement is configured to operate with the third and fourth FET arrangements as a portion of at least one of: a one-dimensional NVM array, a two-dimensional NVM array, a NAND circuit, a NOR circuit, a NAND array circuit, a NOR array circuit, an inverter circuit, and a logic circuit.

31. The RFID tag of claim 18, wherein the third and fourth FET circuits are of a second type that is one of: the same as the first type, and a different from the first type.

32. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises: a third FET circuit of the first type, wherein the third FET circuit is arranged in a redundant circuit configuration with respect to the first and second FET circuits, and wherein the third FET circuit includes a third floating gate terminal.

33. The RFID tag of claim 1, wherein at least one of the first and second FET circuits includes a charge trapping structure that comprises at least one of: a silicon nano-crystal device, and a SONOS device.

34. The RFID tag of claim 1, wherein the redundant NVM circuit further comprises: a first floating gate field effect transistor (FET) circuit of a first type configured to be programmed to an “on” state or an “off” state, wherein the first FET circuit includes a first floating gate terminal;a second floating gate FET circuit of the first type configured to be programmed to an “on” state or an “off” state, wherein the second FET circuit includes a second floating gate terminal; anda redundant configuration circuit for configuring the first FET circuit in a redundant circuit configuration with respect to the second FET circuit, wherein the redundant configuration means is configured to cause the first and second FET circuit to assume the same “on” or “off” state.

35. The RFID tag of claim 34, wherein the redundant NVM circuit further comprises: a charge control circuit that is coupled to at least one of the first and second floating gate terminals, wherein the charge control circuit is arranged to selectively program at least one of the first and second FET circuits.

36. The RFID tag of claim 34, wherein the redundant configuration circuit is arranged to selectively configure the NVM circuit for operation as one of: a single ended NVM circuit and a differential NVM circuit.

37. A radio frequency identification (RFID) tag comprising: an antenna means; andan RF tag electronics means coupled to the antenna means to receive a signal responsive to a received wave by the antenna means, wherein the RF tag electronics means includes a redundant non-volatile memory means (NVM), the redundant NVM means comprising: a first field effect transistor (FET) circuit of a first type, wherein the first FET circuit includes a first floating gate terminal configured to be programmed to an “on” state or an “off” state;a second FET circuit of the first type, wherein the first FET circuit is arranged in a redundant circuit configuration with respect to the second FET circuit the second FET circuit includes a second floating gate terminal configuration to be programmed to an “on” state or an “off” state, and wherein the redundant circuit configured is configured to cause the first and second FET circuit to assume the same “on” or “off” state upon programming; anda redundant configuration means for configuring the first FET circuit in the redundant circuit configuration with respect to the second FET circuit, wherein the redundant configuration means is configured to cause the first and second FET circuit to assume the same “on” or “off” state.

38. The RFID tag of claim 37, wherein the redundant configuration means further comprises: a charge control means that is coupled to at least one of the first and second floating gate terminals, wherein the charge control means is arranged to selectively program at least one of the first and second FET circuits.

39. The RFID tag of claim 37, wherein the redundant configuration means is arranged to selectively configure the NVM circuit for operation as one of: a single ended NVM circuit and a differential NVM circuit.