Number | Name | Date | Kind |
---|---|---|---|
4254445 | Ho | Mar 1981 | |
4480288 | Gazdik et al. | Oct 1984 | |
4489364 | Chance et al. | Dec 1984 | |
5220490 | Weigler et al. | Jun 1993 | |
5224022 | Weigler et al. | Jun 1993 | |
5243140 | Bhatia et al. | Sep 1993 | |
5258236 | Arjavalingam et al. | Nov 1993 | |
5518674 | Powell | May 1996 | |
5747095 | McAllister | May 1998 | |
5757079 | McAllister | May 1998 | |
5795378 | Sakamoto | Aug 1998 | |
5854302 | Foster | Dec 1998 | |
5883437 | Maruyama | May 1999 | |
6165328 | Lorimer | Dec 2000 |
Entry |
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IBM Technical Disclousure Bulletin, vol. 20, No. 9, Feb. 1978 Planar Wiring Repair Technique For The Thin-Film Metal Package Via Solder Evaporation . |