Claims
- 1-20 (Cancelled)
- 21. A method of acquiring seismic survey data comprising the steps of:
(a) distributing a plurality of circuitry housing units over a survey grid, said housing units having a cavity therein for confining an electronic motherboard unit; (b) providing an electronic motherboard unit for at least some of said housing units, each said motherboard unit being interchangeable among similar housing units and having substantially contiguous handling protection for each motherboard unit; and, (c) providing a selectively connected conduit between said motherboard units and respective signal carrier elements.
- 22. A method of acquiring seismic survey data as described by claim 21 wherein said motherboard unit is positioned within said cavity after the distribution of said housing units over said survey grid.
- 23. A method of acquiring seismic survey data as described by claim 21 wherein said motherboard units are transferred from a first survey grid to a second survey grid independently of said housing units.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims the benefit of U.S. Provisional Application Ser. No. 60/344,384 filed Dec. 28, 2001.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60344384 |
Jan 2002 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
10328472 |
Dec 2002 |
US |
Child |
10836990 |
Apr 2004 |
US |