Selective deposition of metal oxides on metal surfaces

Abstract

Methods for selective deposition of metal oxide films on metal or metallic surfaces relative to oxide surfaces are provided. An oxide surface of a substrate may be selectively passivated relative to the metal or metallic surface, such as by exposing the substrate to a silylating agent. A metal oxide is selectively deposited from vapor phase reactants on the metal or metallic surface relative to the passivated oxide surface.

Description

BACKGROUND

Field

The present disclosure relates generally to selective deposition of metal oxides on a first metal or metallic surface of a substrate relative to a second dielectric surface of the substrate.

Description of the Related Art

The shrinking device dimensions in semiconductor manufacturing call for new innovative processing approaches. Conventionally, patterning in semiconductor processing involves subtractive processes, in which blanket layers are deposited, masked by photolithographic techniques, and etched through openings in the mask. Additive patterning is also known, in which masking steps precede deposition of the materials of interest, such as patterning using lift-off techniques or damascene processing. In most cases, expensive multi-step lithographic techniques are applied for patterning.

Patterning could be simplified by selective deposition, which has received increasing interest among semiconductor manufacturers. Selective deposition would be highly beneficial in various ways. Significantly, it could allow a decrease in lithography steps, reducing the cost of processing. Selective deposition could also enable enhanced scaling in narrow structures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic cross section of a portion of a substrate having first metal surface and a second adjacent oxide surface, in accordance with a first embodiment.

FIG. 1B is a schematic cross section of the substrate of FIG. 1A after a selective passivation of the oxide surface.

FIG. 1C is a schematic cross section of the substrate of FIG. 1B after selective deposition of metal oxide on the metal surface.

FIG. 1D is a schematic cross section of the substrate of FIG. 1C after removal of the passivation material from the oxide surface.

SUMMARY

In some aspects, methods of selectively depositing metal oxide on a metal surface of a substrate relative to an dielectric surface, such as an oxide surface, are provided. In some embodiments the dielectric surface is selectively passivated relative to the metal surface and the metal oxide is selectively deposited on the metal surface relative to the passivated dielectric surface from vapor phase reactants. In some embodiments the metal surface comprises Al, Cu, Co, Ni, W, Nb, Fe or Mo. In some embodiments the dielectric surface comprises a dielectric transition metal oxide. In some embodiments the dielectric surface comprises aluminum oxide, zirconium oxide, hafnium oxide, titanium oxide, tantalum oxide, yttrium oxide, or lanthanum oxide.

In some embodiments selectively passivating the dielectric surface, such as an oxide surface, comprises exposing the dielectric surface to a silylation agent. In some embodiments the silylation agent is an alkylaminosilane. In some embodiments the silylation agent is a silane. In some embodiments the silylation agent comprises allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA).

In some embodiments the dielectric surface comprises aluminum oxide. The aluminum oxide may be deposited using an aluminum precursor comprising trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl₃), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA). In some embodiments the aluminum oxide is deposited using a heteroleptic aluminum compound comprising an alkyl group and a different ligand, such as a halide. In some embodiments aluminum oxide is deposited by ALD using an aluminum precursor and water.

In some embodiments a passivation blocking layer is formed on the metal surface prior to selectively passivating the dielectric surface. Such a passivation blocking layer may comprise, for example, a self-assembled monolayer (SAM).

DETAILED DESCRIPTION

Metal oxide can be selectively deposited over a first metal (or metallic) surface relative to a second dielectric surface, such as an oxide surface. In some embodiments the oxide surface is adjacent to the metal surface. In embodiments described herein, the oxide surface may be selectively passivated relative to the metal surface, for example by silylation. Subsequently, a metal oxide layer is selectively deposited on the metal surface relative to the passivated oxide surface. The metal oxide layer may be deposited by a vapor deposition process, such as an atomic layer deposition process. In some embodiments an oxide surface on a substrate is silylated with a silylating agent such as allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA), and a metal oxide is subsequently selectively deposited on a metal surface of the substrate relative to the passivated oxide surface. In some embodiments the metal oxide layer may be an aluminum oxide layer, such as an Al₂O₃ layer. For example, an aluminum oxide layer may be selectively deposited by an ALD process, for example using an aluminum reactant such as trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl₃), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA) and water as reactants.

In some embodiments a metal or metallic surface of a substrate comprises an elemental metal or metal alloy, while a second, different surface of the substrate comprises a dielectric material, such as an oxide. Examples include silicon oxide-based materials, including grown or deposited silicon dioxide, doped and/or porous oxides, native oxide on silicon, etc. The surface of the dielectric layer is selectively passivated relative to the metal or metallic surface, such as by selective silylation. Subsequently, a metal oxide layer is selectively deposited on the metal or metallic surface relative to the passivated dielectric surface. Examples of the metal oxide that may be deposited include dielectrics, such as zirconium oxide (e.g., ZrO₂), hafnium oxide (e.g., HfO₂), aluminum oxide (e.g. Al₂O₃), titanium nitride (e.g., TiN) and titanium oxide (e.g., TiO₂). In some embodiments the metal or metallic surface on which the metal oxide is selectively deposited is at least partially adjacent to the dielectric surface that is selectively passivated. For example, at least one portion of a metal or metallic surface may be adjacent to an oxide surface.

In some embodiments, prior to forming the passivation layer on the dielectric surface, such as an oxide surface, the metal or metallic surface can be provided with a passivation blocking layer, such as a self-assembled monolayer (SAM). The passivation blocking layer may facilitate selectivity for the silylation of the dielectric surface, and can be removed thereafter to permit selective deposition of a metal oxide on the metal or metallic surface relative to the silylated dielectric surface.

The passivation layer (silylation) may be removed from the dielectric surface, such as from an oxide surface, following selective deposition of the metal oxide layer over the metal or metallic surface. Conditions may be chosen to avoid damage to surrounding materials on the substrate.

Examples of suitable reactors that may be used in the selective deposition processes described herein include commercially available ALD equipment. In addition to ALD reactors, many other kinds of reactors capable growth of organic passivation layers, including CVD reactors, VDP reactors, and MLD reactors, can be employed.

Substrate Surfaces

According to some aspects of the present disclosure, selective deposition can be used to deposit films of interest, such as metal oxide films, on a metal or metallic surface preferentially relative to an oxide surface, or other dielectric surface. In some embodiments the two surfaces are at least partially adjacent to each other on the substrate. Selective passivation of the oxide surface, such as selective silylation of the oxide surface, relative to the metal or metallic surface, facilitates subsequent selective deposition of a layer of interest, such as a metal oxide layer, on the metal or metallic surface relative to the silylated oxide surface.

For example, one of the surfaces can be a conductive metal or metallic surface of a substrate, while the other surface can be a non-conductive oxide surface of the substrate. In some embodiments, the non-conductive surface comprises —OH groups, such as a silicon oxide-based surface (e.g., low-k materials, including grown and deposited silicon-oxide materials and native oxide over silicon). The oxide surface can be selectively passivated relative to the metal or metallic surface by exposure to a silylating agent and a metal oxide can be subsequently selectively deposited on the metal or metallic surface relative to the silylated oxide surface.

The material differences between the two substrate surfaces are such that vapor deposition methods can selectively passivate the oxide surface relative to the metal or metallic surface. In some embodiments, cyclical vapor deposition is used, for example, cyclical CVD or atomic layer deposition (ALD) processes. In some embodiments, selectivity for the passivation layer can be achieved without passivation/blocking agents on the metal or metallic surface (to receive less of the passivation layer), and/or without catalytic agents on the surface of the oxide layer to receive more of the passivation layer. For example, in embodiments where the first surface is metallic and the second surface is an oxide, the oxide layer can be selectively silylated relative to the metal or metallic surface without pretreatment of the oxide surface or the metal or metallic surface. In other embodiments, the metal or metallic surface is first treated to inhibit passivation (such as silylation) of that surface. For example, a passivation blocking self-assembled monolayer (SAM) can be first formed over a metal or metallic surface relative to an oxide surface, facilitating selective deposition of a passivation layer on the oxide surface relative to the SAM-covered metallic surface. The passivation inhibitor can be removed after selective passivation and prior to deposition of the metal oxide. After selective deposition of the passivation layer is completed, selective deposition of materials of interest, such as metal oxide, can be conducted on the non-passivated metal or metallic surface relative to the passivated surface.

As used herein, unless otherwise specified if a surface is referred to as a metal surface herein, it may be a metal surface or a metallic surface. In some embodiments, the metal or metallic surface may comprise surface oxidation. In some embodiments, the material of the metal surface is electrically conductive with or without surface oxidation. In some embodiments, a metal surface comprises one or more transition metals. In some embodiments, a metal surface comprises one or more of Al, Cu, Co, Ni, W, Nb, Fe, or Mo. In some embodiments a metal surface comprises Cu. In some embodiments a metal surface is a copper surface. In some embodiments, a metallic surface comprises titanium nitride. In some embodiments, the metal surface comprises one or more noble metals, such as Ru. In some embodiments, the metal surface comprises a metal oxide, such as a conductive metal oxide, metal nitride, carbide, boride, or combination thereof. For example, the metal or metallic surface may comprise one or more of RuO_x, NbC_x, NbB_x, NiO_x, CoO_x, NbO_x, MoO_x, WO_x, WNC_x, TaN, or TiN.

In some embodiments, the metal or metallic surface is a surface that can accept or coordinate with a precursor utilized in a selective deposition process of the layer of interest, such as a metal oxide, as described herein.

As mentioned above, in some embodiments, the metal or metallic surface may comprise a passivation block layer thereover. That is, in some embodiments, the metal or metallic surface may comprise a material that inhibits formation of a passivation layer on the metal or metallic surface, for example a self-assembled monolayer (SAM). In some embodiments a deposition process includes forming the passivation block layer on the metal or metallic surface but not on the surface to be passivated.

Passivation of Substrate Surfaces

In some embodiments the oxide (or other dielectric) surface may be passivated. In some embodiments, the passivation is selective for the oxide surface relative to another surface, such as a metal or metallic surface on the same substrate. In some embodiments the oxide surface is silylated by exposure to a vapor phase silylation agent one or more times. For example, in a passivation step a silylation agent may be conducted in to the reaction space and contacted with the oxide surface. The silylating agent may be, for example, a chlorosilane, alkoxysilane, silylhalide, silylcyanate, silylazide, silylisocyanate, silylisothiocyanate, silylsulfonate, silylacetamide, silylcarbodiimide, allysilane, or nitrogen-bearing silane such as a silazane, imidazole or amine. In some embodiments the silylation agent is allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA) and silylation comprises exposing the substrate to one or more pulses of the silylating agent. In some embodiments both the metal or metallic surface and oxide surface are contacted with the silylation agent, such as allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA). In some embodiments the oxide surface of a substrate is selectively silylated relative to a metal or metallic surface of the substrate.

In some embodiments the silylation agent is an alkylaminosilane. For example, the oxide surface of the substrate may be contacted with an alkylaminosilane having the formula (R^I)₃Si(NR^IIR^III), wherein R^I is a linear or branched C1-C5 alkyl group or a linear or branched C1-C4 alkyl group, R^II is a linear or branched C1-C5 alkyl group, a linear or branched C1-C4 alkyl group, or hydrogen, and R^III is a linear or branched C1-C5 alkyl group or a linear or branched C1-C4 alkyl group.

In some embodiments the silylation agent is a silane. For example, the oxide surface may be contacted with a silane having the general formula (R^I)₃SiA, wherein R^I is a linear or branched C1-C5 alkyl group or a linear or branched C1-C4 alkyl group, and A is any ligand which is reactive with a silicon containing surface.

The silylation agent may be provided to the reaction chamber holding the substrate in a single pulse or in a sequence of multiple pulses. In some embodiments the silylation agent is provided in a single long pulse or in multiple shorter pulses. The pulses may be provided sequentially. In some embodiments the silylation agent is provided in 1 to 25 pulses of from about 0.1 to about 60 seconds. In between pulses, the silylation agent may be removed from the reaction space. For example, the reaction chamber may be evacuated and/or purged with an inert gas. The purge may be, for example for about 1 to 30 seconds or more.

In some embodiments, the temperature of the silylation process may be, for example, from about 50 to 500° C., or about 100 to about 300° C. The pressure during the silylation process may be, for example, from about 10⁻⁵ to about 760 Torr, or in some embodiments from about 1 to 10 Torr or about 0.1 to about 10 Torr.

In some embodiments, the silylation process may be carried out in situ, that is in the same reaction chamber as a subsequent deposition process, for example selective deposition of a metal oxide, such as aluminum oxide, on the non-silylated surface relative to the silylated surface. However, in some embodiments the silylation may be carried out in a separate reaction chamber. In some embodiments the reaction chamber in which the silylation is carried out is part of a cluster tool, including one or more additional reaction chambers. For example, such a cluster tool may include additional reaction chambers for the deposition of the metal oxide, and/or for etching one or more layers. In some embodiments a cluster tool includes separate modules for pretreatment, silylation of the oxide surface, selective deposition of a metal oxide and subsequent post-deposition treatment, such as etching or plasma post-deposition cleaning. In some embodiments the same module can be used for two or more processes.

In some embodiments, the substrate may be pretreated or cleaned prior to or at the beginning of the passivation and/or selective deposition processes. In some embodiments, the substrate may be subjected to a plasma cleaning process prior to or at the beginning of the selective passivation and/or selective deposition processes. In some embodiments, a plasma cleaning process may not include ion bombardment, or may include relatively small amounts of ion bombardment. In some embodiments the substrate surfaces may be exposed to plasma, radicals, excited species, and/or atomic species prior to or at the beginning of the passivation process, and/or the selective metal oxide deposition process. In some embodiments, the substrate surface may be exposed to hydrogen plasma, radicals, or atomic species prior to or at the beginning of the selective passivation process and/or the selective metal oxide deposition process.

Selective Deposition of Metal Oxide on Metal or Metallic Surfaces Relative to Passivated Oxide Surfaces

Metal oxide can be selectively deposited on a metal or metallic surface of a substrate relative to a passivated oxide surface of the substrate. After selectively forming a passivation layer on the oxide surface, in some embodiments a metal oxide is selectively deposited on the second surface by contacting the substrate alternately and sequentially with a first reactant comprising a metal of the metal oxide and a second reactant comprising oxygen. In some embodiments, the second reactant is water. In some embodiments the substrate is contacted sequentially with the first and second reactants, such that metal oxide is selectively deposited on or over the metal or metallic surface (see, e.g., FIGS. 1A-1D).

In some embodiments the metal reactant is a hydrophobic reactant, comprising one or more hydrophobic ligands. In some embodiments, the hydrophobic reactant comprises two to four hydrophobic ligands. In the case of hydrophobic reactants comprising a metal with a valence/oxidation state of n, in some embodiments, the hydrophobic precursor comprises n−1 or n−2 hydrophobic ligands.

In some embodiments, at least one hydrophobic ligand comprises only C and H. In some embodiments, at least one hydrophobic ligand comprises C, H and Si or Ge, but no additional elements.

In some embodiments, a hydrocarbon ligand comprises one or more of the following:

• • C1-C10 hydrocarbon (single, double or triple bonded)
    • Alkyls
      • C1-C5 alkyls
        • Me, Et, Pr, ⁱPr, Bu, ^tBu
    • Alkenyls
      • C1-C6 alkenyls
    • Cyclic hydrocarbons
      • C3-C8
        • Cyclopentadienyl
        • Cycloheptadienyl
        • Cycloheptatrienyl
        • Cyclohexyl
        • Derivatives of those
    • Aromatic
      • C6 aromatic ring and derivatives of those

In some embodiments, a hydrophobic metal reactant comprises no hydrophilic ligands. However, in some embodiments the hydrophobic metal reactant may comprise one or two hydrophilic ligands. In some embodiments, a hydrophilic ligand comprises nitrogen, oxygen and/or a halogen group.

In some embodiments, a hydrophilic ligand is an alkylamine (—NR₂, where each R can be alkyl, hydrogen). In some embodiments, the hydrophilic ligand can be —NMe₂, —NEtMe, or —NEt₂.

In some embodiments, a hydrophilic ligand is an alkoxide, for example —OMe, —OEt, —OⁱPr, —O^tBu.

In some embodiments, a hydrophilic ligand comprises a halide, such as a chloride, fluoride or other halide.

In some embodiments, a hydrophobic precursor comprises the formula:

• L_nMX_y, in which
  • In some embodiments n is from 1-6;
    • In some embodiments n is from 1-4 or 3-4.
  • In some embodiments y is from 0-2;
    • In some embodiments y is from 0-1.
  • L is a hydrophobic ligand;
    • In some embodiments L is Cp or a C1-C4 alkyl ligand.
  • X is hydrophilic ligand;
    • In some embodiments X is an alkylamine, alkoxide or halide ligand.
  • M is metal (including group 13 elements, B, and Ga);
    • In some embodiments M has an oxidation state of +I up to +VI.
      • In some embodiments M has an oxidation state of +IV to +V.
    • In some embodiments M can be a transition metal.
      • In some embodiments M is Ti, Ta, Nb, W, Mo, Hf, Zr, V, or Cr.
        • In some embodiments M is Hf, Zr, Ta or Nb.
        •  In some embodiments M is Zr.
      • In some embodiments M is Co, Fe, Ni, Cu, or Zn.
      • In some embodiments the metal is not W or Mo.
    • In some embodiments M can be a rare earth metal.
      • In some embodiments M is La, Ce, or Y.
    • In some embodiments M can be a metal from groups of 2-13.
      • In some embodiments M is Ba, Sr, Mg, Ca, or Sc.
    • In some embodiments M is not a noble metal.

More generally, in some embodiments, a selective ALD process employs a metal precursor. In some embodiments, the metal of the metal precursor may be selected from the group comprising Al, Ti, Ta, Nb, W, Mo, Hf, Zr, V, Cr, Co, Fe, Ni, Cu, Zn, La, Ce, Y, Ba, Sr, Mg, Ca, or Sc, or mixtures thereof. In some embodiments, the metal may be Al.

In some embodiments, aluminum oxide is selectively deposited and the selective ALD process employs an Al precursor. Examples of Al precursors include trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl₃), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA). In some embodiments the aluminum precursor is a heteroleptic aluminum compound. In some embodiments the heteroleptic aluminum compound comprises an alkyl group and another ligand, such as a halide, for example Cl. In some embodiments the aluminum compound is dimethylaluminumchloride. In some embodiments the aluminum precursor is an alkyl precursor comprising two different alkyl groups as ligands. In some embodiments the aluminum precursor is a metalorganic compound. In some embodiments the aluminum precursor is an organometallic compound.

In some embodiments, zirconium oxide is selectively deposited using Bis(methylcyclopentadienyl) methoxymethyl zirconium (IV) ((CpMe)₂-Zr—(OMe)Me).

In some embodiments, hafnium oxide is deposited using bis(methylcyclopentadienyl) methoxymethyl hafnium (IV) ((CpMe)₂-Hf—(OMe)Me).

In some embodiments, the second reactant contributes one or more elements to the material that is selectively deposited. For example, the second reactant can be an oxygen precursor used to deposit a metal oxide.

In some embodiments, the second reactant comprises an oxygen precursor. In some embodiments, the second reactant comprises H₂O, O₃, H₂O₂, oxygen plasma, ions, radicals, atomic O or excited species of oxygen.

In some embodiments, other reactants can be utilized that contribute elements other than O to the deposited material. These reactants may be used in addition to a second oxygen reactant, or may themselves serve as a second reactant and contribute oxygen and another element to the deposited film. For example, in some embodiments a nitrogen reactant can be used to contribute nitrogen, a sulfur reactant may be used to contribute sulfur, a carbon reactant may be used to contribute carbon or a silicon reactant may be used to contribute silicon.

In some embodiments a metal oxide thin film, such as aluminum oxide (e.g., Al₂O₃) is selectively deposited on one or more metal or metallic surfaces, such as a copper, cobalt, titanium nitride or tungsten surfaces, relative to one or more oxide surfaces. In a first step, a substrate comprising the metal surface and the oxide surface is treated to form a passivation layer on the oxide surface by silylation, as described above. For example, in some embodiments the substrate surface(s) may be exposed to a silylating agent, such as allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA), which selectively silylates the oxide surface(s). Following formation of the passivation layer on the oxide surface a metal oxide is selectively deposited on the metal or metallic surface relative to the passivated oxide surfaces by a vapor deposition process. Selective deposition may be as described herein. For example, in some embodiments aluminum oxide is selectively deposited by alternately and sequentially contacting the substrate with an aluminum reactant and an oxygen precursor. The aluminum reactant may comprise, for example, trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl₃), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA). The oxygen precursor may comprise, for example, water. In some embodiments aluminum oxide may be deposited by an atomic layer deposition process in which the substrate is alternately and sequentially contacted with an aluminum reactant and water. In some embodiments the temperature in the reaction chamber during aluminum oxide deposition is from about 150 to about 350° C. In some embodiments the pulse time for the reactants may be from about 0.1 to about 10 seconds, and the purge time between reactant pulses may also be from about 0.1 to about 10 seconds. In some embodiments the reaction chamber pressure may be, for example, from about 10⁻⁵ to about 760 Torr, or in some embodiments from about 1 to 10 Torr.

Following selective deposition of the metal oxide, the substrate may be subjected to a post-deposition cleaning step to remove the passivation layer from the oxide surfaces, as mentioned above. In some embodiments the cleaning step may comprise H₂ plasma treatment. In some embodiments the cleaning step is carried out at a temperature of about room temperature to about 400° C. In some embodiments plasma power of about 25 to 250 W may be used to generate a plasma in flowing H₂, for example at a flow rate of about 10 to 500 sccm. The clean time after deposition of the metal oxide layer may be, for example, from about 0.1 to 600 seconds or more in some embodiments.

In some embodiments a thin metal oxide film, such as aluminum oxide (e.g., Al₂O₃) is selectively deposited on a metal or metallic surface of a three-dimensional structure relative to one or more passivated oxide surfaces. The three-dimensional structure may comprise, for example, a via or a trench. In some embodiments oxide surfaces may be selectively passivated prior to depositing the metal oxide film. Vapor deposition is then carried out to deposit the metal oxide on the metal surfaces that are not passivated.

Passivation Blocking Layer

A passivation blocking layer can facilitate selective formation of a passivation layer on dielectric material relative to the passivation blocking layer. As noted above, a self-assembled monolayer (SAM) can serve to inhibit silylation of a metal or metallic surface, thus facilitating selective passivation of dielectric surfaces. The term “blocking” is thus merely a label and need not imply 100% deactivation of the organic passivation layer deposition. As noted elsewhere herein, even imperfect selectivity can suffice to obtain a fully selective structure after an etch back process.

Selectivity

Selective passivation and/or selective deposition can be fully selective or partially selective. A partially selective process can be followed by a post-deposition etch that removes all of the deposited material from over one surface without removing all of the deposited material from over a second surface, resulting in a fully selective layer. Thus, in some embodiments the selective deposition need not be fully selective in order to obtain the desired benefits.

Selectivity of deposition (or passivation) on a first surface, here referred to as surface A, relative to a second surface, referred to as surface B, can be given as a percentage calculated by [(deposition on surface A)−(deposition on surface B)]/(deposition on the surface A). Deposition can be measured in any of a variety of ways. For example, deposition may be given as the measured thickness of the deposited material, or may be given as the measured amount of material deposited. In embodiments described herein, an oxide surface (A) can be selectively passivated relative to a metal or metallic surface (B). With respect to passivation, if the passivation results from treatment of the substrate surface rather than deposition of a layer, the amount of passivation can be a measure of available reactive sites on the substrate surface that have reacted with the passivating agent. Subsequently, a metal oxide layer can be selectively deposited on the metal or metallic surface (B) relative to the passivation layer over the oxide surface (A).

In some embodiments, selectivity for the selective formation of the passivation layer on an oxide surface (relative to a metal or metallic surface) is greater than about 10%, greater than about 50%, greater than about 75%, greater than about 85%, greater than about 90%, greater than about 93%, greater than about 95%, greater than about 98%, greater than about 99% or even greater than about 99.5%.

In some embodiments, selectivity of deposition of a metal oxide on the metal or metallic surface (relative to the passivated oxide surface) is greater than about 10%, greater than about 50%, greater than about 75%, greater than about 85%, greater than about 90%, greater than about 93%, greater than about 95%, greater than about 98%, greater than about 99% or even greater than about 99.5%.

In some embodiments, deposition only occurs on one surface and does not occur on the other surface.

In some embodiments, passivation of an oxide surface by silylation relative to a metal or metallic surface of the substrate is at least about 80% selective. In some embodiments, the passivation process is at least about 50% selective. In some embodiments the passivation process is at least about 10% selective. The skilled artisan will appreciate that a partially selective process can result in a fully selective passivation of the oxide surface by a post-deposition etch that removes any silylation from the metal or metallic surface.

In some embodiments, deposition of a metal oxide on a metal or metallic surface of the substrate relative to a silylated oxide surface of the substrate is at least about 80% selective. In some embodiments, deposition of a metal oxide on a metal or metallic surface of the substrate relative to a silylated oxide surface of the substrate is at least about 50% selective. In some embodiments deposition of a metal oxide on a metal or metallic surface of the substrate relative to a silylated oxide surface of the substrate is at least about 10% selective. The skilled artisan will appreciate that a partially selective process can be followed by a post-deposition etch (or other treatment) that removes substantially all of the deposited material from over the silylated oxide surface. Furthermore, the post-deposition treatment can also aid in tailoring the position and/or profile of the selectively deposited layer.

Selective Deposition of Metal Oxide on Metal or Metallic Surfaces

FIGS. 1A-1D schematically illustrate an embodiment for selective passivation of a first oxide surface relative to a second metal or metallic surface, followed by selective deposition of metal oxide on the second metal or metallic surface relative to the passivated first oxide surface.

FIG. 1A illustrates a substrate having materially different surfaces exposed. For example, the first surface can comprise or be defined by a metal, such as cobalt (Co), copper (Cu), tungsten (W) or molybdenum (Mo). The second surface can comprise or be defined by an oxide, such as a silicon oxide-based layer or a silicon surface having native oxide formed thereover.

FIG. 1B shows the substrate of FIG. 1A after selective passivation of the oxide surface, such as by silylation. For example, a passivation layer may be formed selectively on the oxide surface by exposing the substrate to a silylating agent, such as allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA).

FIG. 1C shows the substrate of FIG. 1B following selective deposition of a metal oxide on the metal surface relative to the passivation layer on the oxide surface. The metal oxide can be, for example, a metal oxide such as aluminum oxide, zirconium oxide, hafnium oxide, titanium oxide, tantalum oxide, yttrium oxide, lanthanum oxide, or other transition metal oxide or mixtures thereof. In some embodiments the metal oxide is aluminum oxide. In some embodiments the metal oxide is selectively deposited by a vapor deposition process, such as an atomic layer deposition process. In some ALD processes for selective deposition of the metal oxide the substrate is alternately and sequentially contacted with a metal reactant and an oxygen reactant. For example, aluminum oxide may be selectively deposited on the metal or metallic surface relative to the passivated surface by an ALD process comprising alternately and sequentially contacting the substrate with an aluminum reactant, such as trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl₃), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA), and an oxygen reactant, such as water.

As noted above, any metal oxide deposited on the passivation layer can be removed by a post deposition treatment, such as an etch back process. Because the metal oxide is deposited selectively on the metal surface, any metal oxide left on the passivation surface will be thinner than the metal oxide formed on the metal surface. Accordingly, the post deposition treatment can be controlled to remove all of the metal oxide over the surface comprising the passivation layer without removing all of the metal oxide from over the metal surface. Repeated selective deposition and etching back in this manner can result in an increasing thickness of the metal oxide on the metal surface with each cycle of deposition and etch. Repeated selective deposition and etching back in this manner can also result in increased overall selectivity of the metal oxide on the metal or metallic surface, as each cycle of deposition and etch leaves a clean passivation layer over which the selective metal oxide deposition nucleates poorly. In other embodiments, metal oxide material can be removed during subsequent removal of the passivation layer. For example, either a direct etch or a lift-off method can be used to remove metal oxide from the passivation layer surface in a cyclical selective deposition and removal.

FIG. 1D shows the substrate of FIG. 1C after a post deposition treatment to remove the passivation layer from the oxide surface, such as by an etch process. In some embodiments, the etch process may comprise exposing the substrate to a plasma. In some embodiments, the plasma may comprise oxygen atoms, oxygen radicals, oxygen plasma, or combinations thereof. In some embodiments, the plasma may comprise hydrogen atoms, hydrogen radicals, hydrogen plasma, or combinations thereof. In some embodiments, the plasma may comprise noble gas species, for example Ar or He species. In some embodiments the plasma may consist essentially of noble gas species. In some instances, the plasma may comprise other species, for example nitrogen atoms, nitrogen radicals, nitrogen plasma, or combinations thereof. In some embodiments, the etch process may comprise exposing the substrate to an etchant comprising oxygen, for example O₃. In some embodiments, the substrate may be exposed to an etchant at a temperature of between about 30° C. and about 500° C., or between about 100° C. and about 400° C. In some embodiments, the etchant may be supplied in one continuous pulse or may be supplied in multiple pulses. As noted above, the passivation layer removal can be used to lift-off any remaining metal oxide from over the oxide layer, either in a complete removal of the passivation layer or in a partial removal of the passivation layer in a cyclical selective deposition and removal.

Additional treatments, such as heat or chemical treatment, can be conducted prior to, after or between the foregoing processes. For example, treatments may modify the surfaces or remove portions of the metal, silicon oxide, passivation and metal oxide surfaces exposed at various stages of the process. In some embodiments the substrate may be pretreated or cleaned prior to or at the beginning of the process. In some embodiments, the substrate may be subjected to a plasma cleaning process, as mentioned above.

Although certain embodiments and examples have been discussed, it will be understood by those skilled in the art that the scope of the claims extend beyond the specifically disclosed embodiments to other alternative embodiments and/or uses and obvious modifications and equivalents thereof.

Claims

1. A method of selectively depositing a metal oxide on a metal surface of a substrate relative to a transition metal oxide surface of the substrate, wherein the metal surface is an Al, Cu, Co, Ni, W, Nb, Fe, or Mo surface, the method comprising, in order: forming a passivation blocking layer on the metal surface;selectively passivating the transition metal oxide surface relative to the metal surface, wherein selectively passivating the transition metal oxide surface comprises exposing the transition metal oxide surface to a silylation agent;removing the passivation blocking layer from the metal surface; andselectively depositing the metal oxide from vapor phase reactants on the metal surface relative to the passivated transition metal oxide surface,wherein the vapor phase reactants comprise a hydrophobic metal reactant comprising one or more hydrophobic ligands, andwherein at least one of the hydrophobic ligands comprises C.

2. The method of claim 1, wherein the silylation agent comprises allyltrimethylsilane (TMS-A), chlorotrimethylsilane (TMS-Cl), N-(trimethylsilyl)imidazole (TMS-Im), octadecyltrichlorosilane (ODTCS), hexamethyldisilazane (HMDS), or N-(trimethylsilyl)dimethylamine (TMSDMA).

3. The method of claim 1, wherein the silylation agent comprises an alkylaminosilane.

4. The method of claim 3, wherein the alkylaminosilane has a formula (RI)3Si(NRIIRIII), wherein RI is a linear or branched C1-C5 alkyl group, RII is hydrogen or a linear or branched C1-C5 alkyl group, and RIII is a linear or branched C1-C5 alkyl group.

5. The method of claim 1, wherein the silylation agent comprises a silane.

6. The method of claim 5, wherein the silane has a general formula (RI)3SiA, wherein RI a linear or branched C1-C5 alkyl group, and A is any ligand which is reactive with a silicon containing surface.

7. The method of claim 1, wherein the metal oxide comprises a dielectric transition metal oxide.

8. The method of claim 1, wherein the metal oxide comprises aluminum oxide, zirconium oxide, hafnium oxide, titanium oxide, tantalum oxide, yttrium oxide, lanthanum oxide, or other transition metal oxide or mixtures thereof.

9. The method of claim 8, wherein the metal oxide comprises aluminum oxide.

10. The method of claim 9, wherein the aluminum oxide is deposited using an aluminum precursor comprising trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl3), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA).

11. The method of claim 10, wherein the aluminum oxide is deposited using an aluminum precursor comprising dimethylaluminum isopropoxide (DMAI).

12. The method of claim 9, wherein the aluminum oxide is deposited using an aluminum precursor comprising a heteroleptic aluminum compound comprising an alkyl group and a different ligand.

13. The method of claim 12, wherein the different ligand is a halide.

14. The method of claim 9, wherein the aluminum oxide is deposited using an aluminum precursor comprising an aluminum alkyl compound comprising two different alkyl groups as ligands.

15. The method of claim 9, wherein the aluminum oxide is deposited using an aluminum precursor comprising a metalorganic aluminum compound or an organometallic aluminum compound.

16. The method of claim 9, wherein the aluminum oxide is deposited by an ALD process comprising alternately and sequentially contacting the substrate with a first reactant comprising trimethyl aluminum (TMA), dimethylaluminumchloride, aluminum trichloride (AlCl3), dimethylaluminum isopropoxide (DMAI), tris(tertbutyl)aluminum (TTBA), tris(isopropoxide)aluminum (TIPA) or triethyl aluminum (TEA) and a second reactant comprising water.

17. The method of claim 1, wherein the metal oxide is selectively deposited by an atomic layer deposition (ALD) process.

18. The method of claim 17, wherein the ALD process comprises alternately and sequentially contacting the substrate with the hydrophobic metal reactant and a second oxygen reactant.

19. The method of claim 1, wherein the passivation blocking layer comprises a self-assembled monolayer (SAM).

20. The method of claim 1, wherein the at least one of the hydrophobic ligands consists of C and H.