Kulesza et al. (1992) "Solderless Flip Chip Technology--Electrical Conductive Polymer Plays Key Role" Hybrid Circuit Technology, pp. 24-27. |
Brefeldt et al. (1989) "Evaluation of Conductive Adhesives as a Medium to Attach Surface Mount Components and Tab Parts to Printed Circuit Boards" Proc. Tech. PGM, Nepcon West, vol. 1, pp. 496-506. |
Honore et al. (1992) "Reliability Testing of Conductive Adhesives", Nepcon West '92, pp. 1372-1380. |
Chang et a al. (1992) "Design Considerations for the Implementation of Anisotropic Conductive Adhesive Interconnection" Nepcon West '92, pp. 1381-1389. |
Chang et al. (1993) "Accelerated Life Test of Z-Axis Conductive Adhesives" IEEE Transactions on Componets, Hybrids, and Manufacturing Technology, vol. 16 No. 8, pp. 836-842. |
Chang et al. (1993) "An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly" IEEE Transations on Components, Hybrids, and Manufacturing Technology, vol. 16, No. 8, pp. 828-835. |
Basavanhally et al. "Direct Chip Interconnect with adhesive-Connector Films" (1992), pp. 487-491. |