Patent Application
20210162470
The subject matter herein generally relates to wire bonding machines, and more particularly to a self-cleaning wire bonding machine.
Generally, a main function of a wire bonding machine is to bond wafers and circuit boards through metal wires (such as gold wires, copper wires and aluminum wires) under a certain temperature, pressure, and power, so as to realize transmission of electronic signals. However, the metal wires are prone to contamination due to the long-term exposure to the air, and pollutants are likely to cause the wire to become stuck in an outlet path, which may cause the wires to break.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. Additionally, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other word that “substantially” modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
The spool 10 includes a substantially cylindrical rotating body 101 and a metal wire 102 wound around the rotating body 101. The rotating body 101 is located on a support base 11 and rotates on the support base 11. Rotation of the rotating body 101 enables the metal wire 102 to be wound on the spool 10. The metal wire 102 may be a gold wire, a copper wire, or an aluminum wire. In one embodiment, the metal wire 102 is a gold wire.
Referring to
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In one embodiment, one end of the fixing rod 23 is connected to the tank body 21, and another end of the fixing rod 23 is connected to the drying element 40 so that the cleaning tank 20 is connected to the drying element 40.
In one embodiment, a dryer (not shown) is provided in the drying element 40, and the dryer quickly blows the cleaning solution off the surface of the metal wire 102.
The tensioner 50 is configured to make the metal wire 102 have a proper tension, so that the metal wire 102 can pass through the wire clamp 60 and the nozzle 70 smoothly. In one embodiment, the tensioner 50 is an air tensioner.
The wire clamp 60 is configured to control a speed at which the metal wire 102 exits.
A heater (not shown) is provided in the nozzle 70, and the heater heats the metal wire 102 passing through the nozzle 70 to melt the metal wire 102. During operation, the metal wire 102 on the rotating body 101 passes through the cleaning tank 20, the drying element 40, the tensioner 50, and the wire clamp 60 in sequence, and is ejected from the nozzle 70, thereby soldering the product to be processed. In one embodiment, the nozzle 70 is a steel nozzle.
The wire bonding machine 100 provided by the present disclosure includes the cleaning tank 20 to remove pollutants from the surface of the metal wire 102, thereby preventing accumulation of pollutants, preventing breakage of the metal wire 102, and improving a working efficiency of the wire bonding machine 100.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201911199564.1 | Nov 2019 | CN | national |
