Apparatus for connecting with wire connectors

Industry

CPC
H01L24/78

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/78Apparatus for connecting with wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
- Patent number 12,308,588
- Issue date May 20, 2025
- Yageo Nexensos GmbH
- Matthias Muziol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond capillary design
- Patent number 12,308,341
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding capillary
- Patent number 12,269,109
- Issue date Apr 8, 2025
- CRAFTSTECH, INC.
- Jeffrey C. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,261,148
- Issue date Mar 25, 2025
- Shinkawa Ltd.
- Shigeru Hayata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,109
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting bonding between a bonding wire and a bonding l...
- Patent number 12,255,172
- Issue date Mar 18, 2025
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooperative bonding method for a bonding head of a wire bonding mac...
- Patent number 12,237,298
- Issue date Feb 25, 2025
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Jian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of detecting connection issues between a wire bonding tool...
- Patent number 12,235,302
- Issue date Feb 25, 2025
- Kulicke and Soffa Industries, Inc.
- Dominick Albert DeAngelis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding wire
- Patent number 12,154,883
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Daewoong Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of calibrating an ultrasonic characteristic on a wire bondi...
- Patent number 12,113,043
- Issue date Oct 8, 2024
- Kulicke and Soffa Industries, Inc.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,428
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon wire bond
- Patent number 11,975,400
- Issue date May 7, 2024
- Texas Instruments Incorporated
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 11,978,718
- Issue date May 7, 2024
- Kulicke and Soffa Industries, Inc,.
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic material and wire bonding capillary
- Patent number 11,964,915
- Issue date Apr 23, 2024
- Industrial Technology Research Institute
- Tien-Heng Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
- Patent number 11,935,864
- Issue date Mar 19, 2024
- Kulicke and Soffa Industries, Inc.
- Hui Xu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding for semiconductor devices
- Patent number 11,901,327
- Issue date Feb 13, 2024
- Western Digital Technologies, Inc.
- Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RE...
- Publication number 20250162093
- Publication date May 22, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Kumar Manoj Venna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE
- Publication number 20250140737
- Publication date May 1, 2025
- Mitsubishi Electric Corporation
- Koichi TOKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE BONDING TOOLS AND METHODS OF FORMING WIRE BONDS
- Publication number 20250125303
- Publication date Apr 17, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Tyler Ownby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20250118704
- Publication date Apr 10, 2025
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL
- Publication number 20250100025
- Publication date Mar 27, 2025
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B08 - CLEANING
Information Patent Application
Wire Bonding Method and Apparatus
- Publication number 20250096195
- Publication date Mar 20, 2025
- INFINEON TECHNOLOGIES AG
- Stefan Tophinke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING APPARATUS FOR A WIRE CLAMP CONFIGURED TO CLAMP A WIRE USED...
- Publication number 20250091096
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Junsuk LIM
- B24 - GRINDING POLISHING
Information Patent Application
WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME
- Publication number 20250066154
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Doojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20250022837
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Doojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING A CRACK IN A SEMICONDUCTOR ELEMENT, AND RELATE...
- Publication number 20250022122
- Publication date Jan 16, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Aashish Shah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND
- Publication number 20250015040
- Publication date Jan 9, 2025
- Western Digital Technologies, Inc.
- Jingyun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...
- Publication number 20240404986
- Publication date Dec 5, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Jon W. Brunner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20240395765
- Publication date Nov 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...
- Publication number 20240363581
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING
- Publication number 20240347500
- Publication date Oct 17, 2024
- ASMPT Singapore Pte. Ltd.
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240335901
- Publication date Oct 10, 2024
- Mitsubishi Electric Corporation
- Erubi SUZUKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING FOR SEMICONDUCTOR DEVICES
- Publication number 20240290746
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON WIRE BOND
- Publication number 20240269764
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amin Ahmad Sijelmassi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240234331
- Publication date Jul 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...
- Publication number 20240203933
- Publication date Jun 20, 2024
- SHINKAWA LTD.
- Hikaru MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
- Publication number 20240194634
- Publication date Jun 13, 2024
- ASMPT SINGAPORE PTE. LTD
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240136302
- Publication date Apr 25, 2024
- RENESAS ELECTRONICS CORPORATION
- Ryusei TAKAISHI
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for connecting with wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature-stable composite of a stranded wire having a contact pad

Wire bond capillary design

Methods of forming wire interconnect structures and related wire bo...

Wire bonding capillary

Wire bonding apparatus

Methods of detecting bonding between a bonding wire and a bonding l...

Methods of detecting bonding between a bonding wire and a bonding l...

Cooperative bonding method for a bonding head of a wire bonding mac...

Methods of detecting connection issues between a wire bonding tool...

Package-on-package assembly with wire bond vias

Semiconductor device

Apparatus for bonding wire

In-process wire bond testing using wire bonding apparatus

Apparatus and methods for tool mark free stitch bonding

Methods of calibrating an ultrasonic characteristic on a wire bondi...

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus, method for measuring opening amount of clam...

Bonding apparatus and alignment method

Methods of forming wire interconnect structures and related wire bo...

Wire bonding apparatus

Wire bonding apparatus

Ultrasonic horn and manufacturing apparatus of semiconductor device

Ribbon wire bond

Ribbon bonding tools and methods of using the same

Ceramic material and wire bonding capillary

Wire bonding apparatus

Methods of optimizing clamping of a semiconductor element against a...

Wire bonding apparatus

Wire bonding for semiconductor devices

Patents Applicationslast 30 patents

WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR DEVICE

WEDGE BONDING TOOLS AND METHODS OF FORMING WIRE BONDS

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

ELECTRONIC COMPONENT AND METHOD FOR CLEANING BONDING TOOL

Wire Bonding Method and Apparatus

CLEANING APPARATUS FOR A WIRE CLAMP CONFIGURED TO CLAMP A WIRE USED...

WIRE SUPPLY MODULE AND WIRE BONDING MACHINE INCLUDING THE SAME

SEMICONDUCTOR DEVICE

WIRE BONDING APPARATUS

METHODS OF DETECTING A CRACK IN A SEMICONDUCTOR ELEMENT, AND RELATE...

ANNULAR STRUCTURE FOR AN ELECTRONIC FLAME OFF WAND

SELECTIVE WIRE COATING DURING WIRE BONDING

METHODS OF CALIBRATING AN ULTRASONIC CHARACTERISTIC ON A WIRE BONDI...

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

WIRE PATH PLATE HAVING ENHANCED DURABILITY FOR WIRE BONDING

WEDGE TOOL AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

BALL BONDING FOR SEMICONDUCTOR DEVICES

RIBBON WIRE BOND

CAPILLARY FOR STITCH BOND

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...

HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE