Claims
- 1. A flat-shape semiconductor device comprising a semiconductor chip, a metallic flat support plate for said semiconductor chip, a first plurality of electric contacts formed by metal-sheet strips which are arranged at one side of said support plate in a first plane substantially comprising said support plate and which are electrically connected to said chip by respective thin wires, a second plurality of electric contacts formed by metal-sheet strips arranged at said one side of said support plate in a second plane substantially parallel to that of said first plurality of contacts and electrically connected to said chip by respective thin wires, said planes being superimposed to one another, an insulating layer of adhesive material interposed between said first and second pluralities of electric contacts, and an insulating outer package having opposite major surfaces and formed in such a way as to allow only portions of said first and second pluralities of electric contacts to emerge from said outer package at respective ones of said opposite major surfaces of said outer package.
- 2. A semiconductor device as in claim 1 wherein the semiconductor chip is encapsulated in resin.
- 3. A semiconductor device as in claim 1 wherein the adhesive is epoxy glue.
- 4. A semiconductor device as in claim 1 wherein the insulating outer package is formed of epoxy resin.
Priority Claims (1)
Number |
Date |
Country |
Kind |
19963 A/83 |
Mar 1983 |
ITX |
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Parent Case Info
This is a continuation of application Ser. No. 06/505,327, filed Jun. 17, 1983, which was abandoned upon the filing hereof.
US Referenced Citations (6)
Continuations (1)
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Number |
Date |
Country |
Parent |
505327 |
Jun 1983 |
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