the device being completely enclosed

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H01L23/3107

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3107the device being completely enclosed

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame rolling
- Patent number 12,368,054
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 12,368,085
- Issue date Jul 22, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS resonator integrated cicruit fabrication
- Patent number 12,365,582
- Issue date Jul 22, 2025
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, semiconductor device and method of fabricating t...
- Patent number 12,360,321
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) and electronic apparatus
- Patent number 12,362,265
- Issue date Jul 15, 2025
- Nuvoton Technology Corporation
- Uri Trichter
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,331
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,283
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,362,342
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,752
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Yoshikatsu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and measurement device
- Patent number 12,347,757
- Issue date Jul 1, 2025
- Lapis Semiconductor Co., Ltd.
- Toshihisa Sone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of three-dimensional integrated circuit by encapsulation...
- Patent number 12,347,763
- Issue date Jul 1, 2025
- Rockley Photonics Limited
- Seungjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tip connection portion of terminal member and associated semiconduc...
- Patent number 12,347,750
- Issue date Jul 1, 2025
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with direct attach to circuit boards
- Patent number 12,347,782
- Issue date Jul 1, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package antenna structure and its manufacturing method
- Patent number 12,347,919
- Issue date Jul 1, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,341,025
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,341,122
- Issue date Jun 24, 2025
- Kabushiki Kaisha Toshiba
- Yoko Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating layer disposed on a plurality of conductive particles betwe...
- Patent number 12,336,396
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Sang Hyeon Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,334,407
- Issue date Jun 17, 2025
- Mitsubishi Electric Corporation
- Takuya Shiratsuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 12,334,445
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including vent openings and associated methods
- Patent number 12,334,405
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Michael Stadler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated fan-out package
- Patent number 12,334,457
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density substrate routing in package
- Patent number 12,327,807
- Issue date Jun 10, 2025
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a lead and a sealing resin
- Patent number 12,327,780
- Issue date Jun 10, 2025
- Rohm Co., Ltd.
- Tomonori Tanioka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250233085
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250233110
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juhong SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERTER
- Publication number 20250233080
- Publication date Jul 17, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Shibo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING STRUCT...
- Publication number 20250233096
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- SOYEON MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250233099
- Publication date Jul 17, 2025
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226360
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226274
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Younjeong CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250226314
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- JEEWOONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BLOCKING ELEMENT FORMED ON A SURFACE O...
- Publication number 20250226272
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...
- Publication number 20250226327
- Publication date Jul 10, 2025
- HYGON INFORMATION TECHNOLOGY CO., LTD.
- Xiaodi Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
- Publication number 20250226264
- Publication date Jul 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- George CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250226281
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250226299
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- TAE OH HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226361
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Dawoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250226285
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Myungsung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250218887
- Publication date Jul 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20250219009
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Allen Marfil Descartin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BO...
- Publication number 20250218800
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPEC...
- Publication number 20250218920
- Publication date Jul 3, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT PACKAGE
- Publication number 20250218927
- Publication date Jul 3, 2025
- PANJIT INTERNATIONAL INC.
- YUNG-HUI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250210440
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Minjung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR DEVICE
- Publication number 20250210473
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Shintaro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210489
- Publication date Jun 26, 2025
- Innolux Corporation
- Ker-Yih Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210567
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungdon Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210566
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250210531
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Kyungkyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210430
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- DAE HYUN KIM
- H01 - BASIC ELECTRIC ELEMENTS

the device being completely enclosed

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame rolling

Integration of semiconductor device assemblies with thermal dissipa...

MEMS resonator integrated cicruit fabrication

IPD modules with flexible connection scheme in packaging

Electronic package comprising conductive layer connected electrode...

Method of manufacturing multi-die semiconductor devices and corresp...

Package structure, semiconductor device and method of fabricating t...

Integrated circuit (IC) and electronic apparatus

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor package

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor device and measurement device

Packaging of three-dimensional integrated circuit by encapsulation...

Tip connection portion of terminal member and associated semiconduc...

Microelectronic assemblies with direct attach to circuit boards

Semiconductor package antenna structure and its manufacturing method

Semiconductor device and manufacturing method thereof

Microelectronic assemblies

Semiconductor device

Package with tilted interface between device die and encapsulating...

Coating layer disposed on a plurality of conductive particles betwe...

Semiconductor device and method of manufacturing semiconductor device

Method of fabricating a semiconductor package

Electronic devices including vent openings and associated methods

Integrated fan-out package

3D system integration

High density substrate routing in package

Semiconductor device including a lead and a sealing resin

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

POWER MODULE AND POWER CONVERTER

WIRING STRUCTURE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING STRUCT...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE WITH A BLOCKING ELEMENT FORMED ON A SURFACE O...

CHIP ASSEMBLY, CHIP INTERPOSER AND FABRICATING METHOD FOR CHIP ASSE...

FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

HYBRID BALL/BUMP AND WIREBOND SEMICONDUCTOR DEVICE PACKAGING

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BO...

Semiconductor Packages And Methods Of Forming The Same

APPARATUS FORMED FROM ELECTRONIC COMPONENTS HAVING DIFFERENT RESPEC...

FLAT PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

LEAD FRAME AND SEMICONDUCTOR DEVICE

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME