Number | Date | Country | Kind |
---|---|---|---|
1-141478 | Jun 1989 | JPX |
Number | Name | Date | Kind |
---|---|---|---|
3361354 | Johnston | Jul 1968 | |
3977605 | Sheldon | Aug 1976 | |
3993123 | Chu et al. | Nov 1976 | |
4153107 | Antonetti et al. | May 1979 | |
4193445 | Chu et al. | Mar 1980 | |
4274585 | Lestradet | Jun 1981 | |
4349154 | Pacht | Sep 1982 | |
4373669 | Swanson | Feb 1983 | |
4639829 | Ostergren et al. | Jan 1987 | |
4697739 | McCraoken et al. | Oct 1987 | |
4908695 | Morihara et al. | Mar 1990 | |
4925096 | Gill | May 1990 |
Number | Date | Country |
---|---|---|
0206148 | Dec 1983 | JPX |
Entry |
---|
IBM Tech. Disclosure, "Designs for Providing Thermal Interface Material . . . ," R. C. Chu, vol. 20, No. 7, 12/77, p. 2761. |