Semiconductor device and its manufacturing method

Abstract

A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, and the sealing member is disposed so that the sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view illustrating an example of the present invention.

FIG. 2 is a schematic top view illustrating an example of the present invention.

FIG. 3 is a schematic cross-sectional view illustrating an example of the present invention.

FIG. 4 is a schematic top view illustrating a manufacturing process according to an example of the present invention.

FIG. 5 is a schematic top view illustrating a manufacturing process according to an example of the present invention.

FIG. 6 is a schematic top view illustrating a manufacturing process according to an example of the present invention.

FIG. 7 is a schematic cross-sectional view illustrating a manufacturing process according to an example of the present invention.

FIG. 8 is a schematic cross-sectional view illustrating a manufacturing process according to an example of the present invention.

FIG. 9 is a schematic cross-sectional view illustrating a manufacturing process according to an example of the present invention.

FIG. 10 is a schematic cross-sectional view illustrating a manufacturing process according to an example of the present invention.

FIG. 11 is a schematic cross-sectional view illustrating a manufacturing process according to an example of the present invention.

FIG. 12 is a partially sectional view schematically showing an example of the present invention.

FIG. 13 is a schematic perspective view illustrating a manufacturing process according to an example of the present invention.

FIG. 14 is a schematic cross-sectional view illustrating a conventional semiconductor device.

FIG. 15 is a schematic perspective view illustrating a modified example of the present invention.

FIG. 16 is a schematic perspective view illustrating a modified example of the present invention.

FIG. 17 is a schematic perspective view illustrating a modified example of the present invention.

FIG. 18 is a schematic perspective view illustrating a modified example of the present invention.

Claims

1. A semiconductor device comprising: a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate; anda sealing member covering a semiconductor element arranged on said support member;wherein said support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, andsaid sealing member is disposed so that said sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.

2. A semiconductor device comprising: a support member having a pair of first conductive materials and a pair of second conductive materials which are different from the first conductive materials on an insulating substrate; anda sealing member covering a semiconductor element arranged on said support member;wherein shapes of regions of the pair of the first conductive materials are symmetrical to each other in plan view,shapes of regions of the pair of the second conductive materials are symmetrical to each other across a symmetry axis of the shapes of the regions of the first conductive materials in the plan view, andsaid sealing member is disposed so that said sealing member is disposed on at least a part of a region including at least one of the first conductive materials and the second conductive materials.

3. The semiconductor device according to claim 1, wherein the regions of the second conductive materials have strip shapes extending in a longitudinal direction of the insulating substrate.

4. The semiconductor device according to claim 2, wherein the regions of the second conductive materials have strip shapes extending in a longitudinal direction of the insulating substrate.

5. The semiconductor device according to claim 1, wherein the insulating substrate has a third conductive material arranged on a central portion of the insulating substrate and the shapes of the regions of the first conductive materials have extended portions that are extended to sides of the central portion to surround a part of the third conductive material.

6. The semiconductor device according to claim 2, wherein the insulating substrate has a third conductive material arranged on a central portion of the insulating substrate and the shapes of the regions of the first conductive materials have extended portions that are extended to sides of the central portion to surround a part of the third conductive material.

7. The semiconductor device according to claim 1, wherein the first conductive materials and second conductive materials are continuously covered with an insulating member.

8. The semiconductor device according to claim 2, wherein the first conductive materials and second conductive materials are continuously covered with an insulating member.

9. The semiconductor device according to claim 3, wherein the first conductive materials and second conductive materials are continuously covered with an insulating member.

10. The semiconductor device according to claim 4, wherein the first conductive materials and second conductive materials are continuously covered with an insulating member.

11. The semiconductor device according to claim 1, wherein said sealing member has a flange portion, and the flange portion of said sealing member is elastically connected to said support member.

12. The semiconductor device according to claim 11, wherein the flange portion of said sealing member includes at least one of a notch and recess therein.

13. The semiconductor device according to claim 2, wherein said sealing member has a flange portion, and the flange portion of said sealing member is elastically connected to said support member.

14. The semiconductor device according to claim 13, wherein the flange portion of said sealing member includes at least one of a notch and recess therein.

15. A method for manufacturing a semiconductor device, the semiconductor device including: a support member having an insulating substrate and a conductive material disposed on the insulating substrate, anda sealing member having a flange portion;the method comprising steps of:a first step of disposing a pair of first conductive materials having a region shape symmetrical to each other in plan view, on the insulating substrate,a second step of disposing a pair of second conductive materials having a region shape symmetrical to each other with respect to a symmetry axis of regions of the first conductive materials, on the insulating substrate, anda third step of attaching a flange portion of the sealing member to a region including a part of at least one of the first conductive materials and second conductive materials.

16. The method for producing a semiconductor device according to claim 15, further comprising the step of forming an elastically deformable portion in the flange portion of the sealing member.

17. A semiconductor device comprising: a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate; anda sealing member covering a semiconductor element arranged on said support member;wherein said support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion.

18. A semiconductor device comprising: a support member having a pair of first conductive materials and a pair of second conductive materials which are different from the first conductive materials on an insulating substrate; anda sealing member covering a semiconductor element arranged on said support member;wherein shapes of regions of the pair of the first conductive materials are symmetrical to each other in plan view,shapes of regions of the pair of the second conductive materials are symmetrical to each other across a symmetry axis of the shapes of the regions of the first conductive materials in the plan view.