Layer and wire connectors

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H01L2224/73265

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/73265Layer and wire connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,272,652
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jiwon Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 12,272,725
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor memory device and structure with memory and metal...
- Patent number 12,272,586
- Issue date Apr 8, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor light-emitting device
- Patent number 12,266,737
- Issue date Apr 1, 2025
- Epistar Corporation
- Yi-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for producing a housing
- Patent number 12,261,063
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
- Patent number 12,255,076
- Issue date Mar 18, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, electronic apparatus, and method for manufac...
- Patent number 12,255,170
- Issue date Mar 18, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yasushi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal relaxation block and manufacturi...
- Patent number 12,255,196
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 12,255,275
- Issue date Mar 18, 2025
- Rohm Co., Ltd.
- Tomoichiro Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and manufacturing method thereof
- Patent number 12,243,811
- Issue date Mar 4, 2025
- Dai Nippon Printing Co., Ltd.
- Masahiro Nagata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passives to facilitate mold compound flow
- Patent number 12,243,849
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Chittranjan Mohan Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor system, moving body, and method...
- Patent number 12,243,789
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,243,765
- Issue date Mar 4, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,237,304
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Minkyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having wirebonded multi-die stack
- Patent number 12,237,305
- Issue date Feb 25, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-typed integrated passive device (IPD) components and devices...
- Patent number 12,230,614
- Issue date Feb 18, 2025
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and semiconductor device
- Patent number 12,230,623
- Issue date Feb 18, 2025
- Kioxia Corporation
- Masaki Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CONTROLLER
- Publication number 20250118689
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250118617
- Publication date Apr 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Huibin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20250118681
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
- Publication number 20250112114
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ninad Shahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250112134
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Yoshihisa UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE
- Publication number 20250112126
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER
- Publication number 20250112102
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Jen Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER GUARD TRACE
- Publication number 20250112148
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Gumaste Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105236
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hong Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250107298
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsin-Ying HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105235
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...
- Publication number 20250105079
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jesus Bajo Bautista
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT
- Publication number 20250105081
- Publication date Mar 27, 2025
- DENSO CORPORATION
- Keita FUKUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...
- Publication number 20250096211
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Sangnam JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
- Publication number 20250096220
- Publication date Mar 20, 2025
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...
- Publication number 20250096183
- Publication date Mar 20, 2025
- Renesas Electronics America Inc.
- Martin Ashley VAGUES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20250096009
- Publication date Mar 20, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM LAMINATE ISOLATION SUBSTRATE
- Publication number 20250096034
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chang-Yen KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250087546
- Publication date Mar 13, 2025
- Amkor Technology Singapore Holding Pte. Ltd
- Joon Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087635
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Shu-Chuan CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER
- Publication number 20250087544
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087599
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Seung Hyun BAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087636
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Inhee YOO
- H01 - BASIC ELECTRIC ELEMENTS

Layer and wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacking structure, package structure and method of fabricating the...

Conductive members atop semiconductor packages

Semiconductor package

Low warpage high density trench capacitor

3D semiconductor memory device and structure with memory and metal...

Semiconductor light-emitting device

Semiconductor device and method for manufacturing the same

Method and device for producing a housing

Info structure with copper pillar having reversed profile

Selective metallization of integrated circuit packages

Method for manufacturing leadless semiconductor package with wettab...

Semiconductor device and method for manufacturing the same

Semiconductor package, electronic apparatus, and method for manufac...

Semiconductor package with thermal relaxation block and manufacturi...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor light emitting device

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Lead frame and manufacturing method thereof

Semiconductor package with EMI shield and fabricating method thereof

Passives to facilitate mold compound flow

Semiconductor device, semiconductor system, moving body, and method...

3D semiconductor device and structure with metal layers and memory...

Dummy structure of stacked and bonded semiconductor device

Semiconductor package

Integrated circuit structure

Integrated circuit package having wirebonded multi-die stack

Multi-typed integrated passive device (IPD) components and devices...

Method for manufacturing semiconductor device and semiconductor device

Semiconductor package having side wall plating

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING A CONTROLLER

SEMICONDUCTOR DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

SEMICONDUCTOR DEVICE

POWER MODULE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WIDE BANDGAP POWER DEVICES WITH LOW POWER LOOP INDUCTANCE

HIGHLY PROTECTIVE WAFER EDGE SIDEWALLl PROTECTION LAYER

TRANSFORMER GUARD TRACE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES WITH CAVITIES AND METHODS OF MANUFACTUR...

SEMICONDUCTOR DEVICE AND POWER CONTROL UNIT

INTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND C...

SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURI...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

SEMICONDUCTOR DEVICE

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

LOW COST PACKAGE WARPAGE SOLUTION

DAM LAMINATE ISOLATION SUBSTRATE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH BINDING REINFORCEMENT LAYER

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE