SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Abstract

According to one embodiment, a semiconductor device includes a substrate and a stacked body on the substrate via a joining metal layer. The stacked body includes a device portion and a peripheral portion. The device portion includes from a bottommost layer to a topmost layer included in the stacked body. The peripheral portion surrounding and provided around the device portion; the peripheral portion is a portion of the bottommost layer to the topmost layer included in the stacked body and includes a portion of a semiconductor layer in contact with the joining metal layer.

Description

FIELD

Embodiments of the invention relate generally to a semiconductor device and method for manufacturing the same.

BACKGROUND

Many semiconductor devices are fabricated using semiconductor layers that are epitaxially grown on a substrate. Compared to bulk crystals of semiconductors, semiconductor layers that are epitaxially grown have fewer defects, are of higher quality, and therefore can improve the characteristics of the semiconductor devices.

However, substrates that are used for the epitaxial growth principally perform a role of mechanically supporting thin film semiconductor layers and rarely proactively function to improve the characteristics of semiconductor devices. In some cases, such substrates are a factor that inhibits the realization of high performance in semiconductor devices. For example, in light emitting devices formed by using InGaAlP semiconductors that emit light in the green to red wavelength range, GaAs substrates that have similar lattice constants are used as growth substrates. However, there is a problem in that GaAs crystals absorb green to red light, thus causing luminous intensity to decrease.

Hence, a technique is used wherein a high-quality InGaAlP semiconductor is grown on the GaAs substrate, and thereafter a stacked body having a plurality of semiconductor layers including a light emitting layer is transferred to another substrate. For example, the stacked body can be adhered to a support substrate formed from silicon or the like via a joining metal layer that reflects light emitted from the light emitting layer. Thereby, the light absorption by the substrate can be eliminated and the luminous intensity of the light emitting device can be increased.

However, in a cutting process in which the support substrate provided with the joining metal layer is diced, curls and other defects are prone to be formed on an edge of the cut-out chip, which leads to a decline in production yield. Therefore, there is a need for a semiconductor device and method for manufacturing the same wherein the forming of curls and other defects can be suppressed when cutting the chips from a support substrate that has a joining metal layer provided on a surface thereof.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic cross-sectional view illustrating a semiconductor device and FIG. 1B is a planar photograph showing a chip surface of the semiconductor device according to an embodiment;

FIG. 2A to 4B are schematic cross-sectional views illustrating manufacturing processes of the semiconductor device according to the embodiment;

FIG. 5A is a schematic cross-sectional view centered on a peripheral portion of the semiconductor device, and FIG. 5B is an SEM image showing an edge A of the semiconductor device according to the embodiment;

FIG. 6A is a schematic cross-sectional view centered on a peripheral portion of a semiconductor device, and FIG. 6B is an SEM image showing an edge B of the semiconductor device according to a comparative example; and

FIGS. 7A and 7B are schematic cross-sectional views illustrating a manufacturing process of a semiconductor device according to a variation of the embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a semiconductor device includes a substrate and a stacked body on the substrate via a joining metal layer. The stacked body includes a device portion and a peripheral portion. The device portion includes from a bottommost layer to a topmost layer included in the stacked body. The peripheral portion surrounding and provided around the device portion; the peripheral portion is a portion of the bottommost layer to the topmost layer included in the stacked body and includes a portion of a semiconductor layer in contact with the joining metal layer.

Embodiments of the invention will now be described while referring to the drawings. Note that in the following embodiments, the same numerals are applied to constituents that have already appeared in the drawings and, and repetitious detailed descriptions of such constituents are appropriately omitted.

FIGS. 1A and 1B are schematic views illustrating a semiconductor device 100 according to an embodiment. FIG. 1A schematically illustrates a structure of a cross-section taken across the line Ia-Ia illustrated in FIG. 1B. FIG. 1B is a planar photograph illustrating a chip surface of the semiconductor device 100.

The semiconductor device 100 is, for example, a light emitting diode and has a stacked body 25 adhered on a substrate (support substrate 27) via a joining metal layer 40.

As illustrated in FIG. 1A, the semiconductor device 100 includes a device portion 50 provided in the stacked body 25 and a peripheral portion 60 provided so as to surround the device portion 50.

The device portion 50 includes from a p-type contact layer 24 that is a bottommost layer to an n-type current diffusion layer 16 that is a topmost layer of the stacked body 25. Additionally, the device portion 50 includes a light emitting layer 20 that emits luminescent light. The joining metal layer 40 contains a metal that reflects the light that the light emitting layer 20 emits. The peripheral portion 60 is a portion of a plurality of layers included from the bottommost layer to the topmost layer of the stacked body 25, and includes at least a portion of the p-type contact layer 24 that is a semiconductor layer in contact with the joining metal layer 40.

Hereinafter, the semiconductor device 100 is described in detail while referring to FIG. 1A.

In the semiconductor device 100, the stacked body 25 having the light emitting layer 20 and the support substrate 27 are joined via the joining metal layer 40. The joining metal layer 40 includes a first joining metal layer 26 provided on a first major surface 25a of the stacked body 25 and a second joining metal layer 28 provided on the support substrate 27. The first joining metal layer 26 and the second joining metal layer 28 are joined at a joint interface 32. The second joining metal layer 28 is connected to a p-side electrode 29 via the conductive support substrate 27.

A second major surface 25b of the stacked body 25 is, for example, connected to an n-side electrode 34 via an n-type contact layer 14. Current is fed into the light emitting layer 20 by the current flowing from the p-side electrode 29 to the n-side electrode 34, and luminescent light having a wavelength corresponding to a band gap energy of the light emitting layer 20 is emitted.

In FIG. 1A, the stacked body 25 has, from the n-side electrode 34, the n-type current diffusion layer 16, an n-type clad layer 18, the light emitting layer 20, a p-type clad layer 22, and the p-type contact layer 24. An InGaAlP semiconductor material can be used, for example, for the stacked body 25.

A silicon wafer can be used, for example, for the support substrate 27.

Note that “InGaAlP semiconductor” refers to a semiconductor expressed by the composition formula In_x(Ga_yAl_1-y)_1-xP (where 0≦x≦1 and 0≦y≦1), and includes semiconductors that have been doped with p-type impurities or n-type impurities. In this case, the wavelength of the luminescent light can be selected from a range of from green to red by changing the composition of the InGaAlP contained in the light emitting layer 20.

Furthermore, a nitride semiconductor expressed by the composition formula B_xIn_yGa_zAl_1-x-y-zN (where 0≦x≦1, 0≦y≦1, 0≦z≦1, and x+y+z≦1) can be used for the stacked body 25. In this case, the wavelength of the luminescent light can be selected from a range of from purple to green.

Next, a method for manufacturing the semiconductor device 100 will be described while referring to FIGS. 2 to 4.

FIG. 2A is a schematic cross-sectional view illustrating a state in which the stacked body 25 and the first joining metal layer 26 have been formed on a GaAs substrate 30.

For example, a GaAs buffer layer (not shown) and an n-type GaAs contact layer 14 (impurity concentration: 1×10¹⁸ cm⁻³; thickness: 0.1 μm) are formed on the GaAs substrate 30.

Next, the current diffusion layer 16 (impurity concentration: 4×10¹⁷ cm⁻³; thickness: 2 μm) formed from n-type In_0.5(Ga_0.3Al_0.7)_0.5P, the n-type clad layer 18 (impurity concentration: 4×10¹⁷ cm⁻³; thickness: 0.6 μm) formed from n-type InAlP, the light emitting layer 20, the p-type clad layer 22 (impurity concentration: 2×10¹⁷ cm⁻³; thickness: 0.6 μm) formed from InAlP, and the p-type contact layer 24 (impurity concentration: 9×10^˜cm⁻³; thickness: 0.4 μm) formed from p-type Ga_0.5Al_0.5As constituting the stacked body 25 are stacked subsequently.

These semiconductor layers can, for example, be epitaxially grown by using Metal Organic Chemical Vapor Deposition (MOCVD) or the like.

The light emitting layer 20 can include a p-type Multi Quantum Well (MQW) structure in which an impurity concentration is about 1×10¹⁷ cm⁻³. The MQW can be formed by alternately stacking In_0.5(Ga_0.94Al_0.06)_0.5P having a width of about 10 nm that is a well layer and In_0.5(Ga_0.4Al_0.6)_0.5P having a width of about 20 nm that is a barrier layer.

In this case, red light with a peak wavelength of roughly 624 nm and a dominant wavelength of roughly 615 nm can be obtained as the luminescent light.

Next, Au (thickness: 0.05 μm), AuZn (Zn content: 0.3%; thickness: 0.2 μm), and Au (thickness: 0.6 μm) are stacked subsequently on the p-type contact layer 24 to form the first joining metal layer 26.

Next, as illustrated in FIG. 2B, the stacked body 25 is joined to the support substrate 27 (impurity concentration: 1×10¹⁹ cm⁻³; thickness: 200 μm) formed from a p-type silicon having, for example, a face orientation of (100), via the first joining metal layer 26 and the second joining metal layer 28.

The second joining metal layer 28 formed from Ti (thickness: 0.1 μm), Pt (thickness: 0.12 μm), and Au (thickness: 0.2 μm) is formed by a vacuum evaporation method or the like on a first face of the support substrate 27.

Thereafter, as illustrated in FIG. 2B, the first joining metal layer 26 and the second joining metal layer 28 are aligned, and the stacked body 25 and the support substrate 27 are joined, for example, by heating at about 300° C. while applying pressure in a vacuum.

Next, as illustrated in FIG. 3A, the GaAs substrate 30 is removed, for example, by a wet etching process. Thereafter, for example, by sintering the support substrate 27 and the stacked body 25 at 400° C., adhesive strength of the interface 32 of the Au layers between the first joining metal layer 26 and the second joining metal layer 28 can be increased.

The joining metal layer 40 is formed by aligning the first joining metal layer 26 and the second joining metal layer 28 and contact bonding each Au layer thereof. The Au layer included in the joining metal layer 40 is a metal that reflects the light emitted from the light emitting layer 20 upwards, thereby increasing luminous intensity.

Thereafter, as illustrated in FIG. 3B, the n-side electrode 34 is formed.

The n-side electrode 34 is formed, for example, by using a lift-off process on a surface of the n-type contact layer 14 to subsequently stack AuGe (Ge content: about 3%; thickness: 50 nm), Au (thickness: 100 nm), Mo (thickness: 150 nm), Au (thickness: 150 nm), Mo (thickness: 50 nm) and Au (thickness: 600 nm).

Thereafter, for example, the n-type contact layer 14 is etched using the n-side electrode 34 as a mask.

Next, as illustrated in FIG. 4A, a resist mask 41 for forming the peripheral portion 60 is formed on a portion of the surface of the stacked body 25 that will become the device portion 50.

Thereafter, as illustrated in FIG. 4B, a wet etching process, for example, is used to etch a portion around the device portion 50 that will become the peripheral portion 60. Here, etching can be performed so that the p-type contact layer 24 in contact with the joining metal layer 40 remains.

Specifically, the n-type current diffusion layer 16, the n-type clad layer 18, the light emitting layer 20, and the p-type clad layer 22 are subsequently removed by etching. Here, an etching time is adjusted so that the p-type contact layer 24 will be left on the joining metal layer 40.

For example, etching is performed for from 10 to 60 minutes using a compound liquid of HCl+H₂O₂+H₂O with a solution temperature adjusted to be in a range of from −30 to 30° C. Furthermore, when etching the p-type clad layer 22 formed from InAlP, an etchant with a faster etching speed with respect to InAlP than to p-type Ga_0.5Al_0.5As can be used. Thereby, leaving the p-type contact layer 24 formed from the p-type Ga_0.5Al_0.5As on the joining metal layer 40 will be facilitated. A layer having a uniform thickness can be left as a protective layer by using selective etching or Reactive Ion Etching (RIE).

The p-type contact layer 24 left on the joining metal layer 40 may be etched, for example, to a thickness less than the initial thickness of 0.4 μm. Furthermore, the semiconductor layer left on the joining metal layer 40 is not limited to the p-type contact layer 24, and, for example, the p-type clad layer 22 may be left in addition to the p-type contact layer 24. By leaving a plurality of layers as desired in this way, the plurality of layers can be designed according to the dicing conditions and/or the joining metal layer to function as a protective layer.

Next, the p-side electrode 29 is formed on a reverse side of the support substrate 27 by subsequently stacking Ti (thickness: 0.1 μm), Pt (thickness: 0.12 μm), and Au (thickness: 0.2 μm).

Thereafter, individual chips including the device portion 50 are separated by cutting the peripheral portion 60 using, for example, a dicing saw.

FIGS. 5A and 5B are, respectively, a schematic view and an SEM image illustrating a cross-section of the semiconductor device 100. FIG. 5A is a schematic cross-sectional view centered on the peripheral portion 60. FIG. 5B is an SEM image showing an edge A of the semiconductor device 100 that is separated into individual chips.

As illustrated in FIG. 5A, a cutting portion C in a center of the peripheral portion 60 is cut by using, for example, a dicing saw.

The dicing parameters can be set to, for example, a dicing blade feed rate of from 5 to 20 mm/sec and to a revolution rate of from 25,000 to 50,000 RPM. A supply rate of coolant liquid to the dicing blade can be set to from 0.5 to 1.0 liters/min.

FIG. 5B is an SEM image of the edge A illustrated in FIG. 5A. Cut surfaces of the support substrate 27, the joining metal layer 40, and the p-type contact layer 24 left on the joining metal layer 40 are shown.

On the other hand, FIGS. 6A and 6B are, respectively, a schematic view and an SEM image illustrating a cross-section of a semiconductor device 150 according to a comparative example. FIG. 6A is a schematic cross-sectional view centered on the peripheral portion 60. FIG. 6B is an SEM image showing an edge B of the semiconductor device 150 that is separated into individual chips.

As illustrated in FIG. 6A, in the semiconductor device 150, an entirety of the p-type contact layer 24 is removed in the peripheral portion 60 by etching and the surface of the joining metal layer 40 is exposed.

As shown in FIG. 6B, cracking has occurred in a surface of the support substrate 27 at the chip edge B of the semiconductor device 150 that has been cut using a dicing saw. Furthermore, it is clear that the joining metal layer 40 has curled and so-called Au curls have formed.

In contrast, in the chip edge A shown in FIG. 5B, it is clear that curls such as those seen in FIG. 6B are not present and that the chip has been cut into a satisfactory shape.

Specifically, by leaving a semiconductor layer (the p-type contact layer 24) on the joining metal layer 40, it is possible to suppress the formation of defects such as curls and the like when dicing processing, and thereby the quality of the chips can be improved. Furthermore, because the thickness of the protective layer formed from the semiconductor layer is uniform, shape reproducibility after dicing can be improved.

FIGS. 7A and 7B are schematic cross-sectional views illustrating a manufacturing process of a semiconductor device 200 according to a variation of this embodiment.

As illustrated in FIG. 7A, after forming the peripheral portion 60 while leaving the p-type contact layer 24 on the joining metal layer 40, a resist mask 42 covering the device portion 50 is formed.

Thereafter, individual chips including the device portion 50 are separated by cutting the peripheral portion 60 using, for example, a dicing saw.

Then, using the resist mask 42 as an etching mask, the p-type contact layer 24 that was left on the surface of the peripheral portion 60 is removed. A wet etching process can be used, for example, for the etching of the p-type contact layer 24.

Specifically, after the support substrate 27 is cut on a dicing sheet (not shown) and separated into individual chips, the p-type contact layer 24 of the chips adhered to the dicing sheet can be etched by immersing the dicing sheet in an etchant.

Thereby, as shown in FIG. 7B, the surface of the joining metal layer 40 can be exposed while leaving a p-type contact layer 24a on a portion of the peripheral portion 60.

On the other hand, because the device portion 50 is protected by the resist mask 42, the light emitting layer 20, the n-side electrode 34, and the like will not be eroded by the etchant, and therefore, the characteristics of the semiconductor device 200 will not deteriorate.

The resist mask 42 can be removed by, for example, wet processing or oxygen ashing.

In the semiconductor device 200 according to this variation, the surface of the joining metal layer 40 is exposed at the chip edge. Thereby, for example, adhesion between the chip and a resin when resin sealing the chip can be improved, and the formation of defects such as voids in the chip edge can be prevented.

In the example illustrated in FIG. 7B, the p-type contact layer 24a is left on a portion of the peripheral portion 60, but this embodiment is not limited thereto. For example, substantially all of the p-type contact layer 24a may be etched and removed from the peripheral portion 60. Moreover, cases where the p-type contact layer 24a is over-etched or where the p-type contact layer 24a is etched and removed up to a portion of the device portion 50 are included within the range of this embodiment.

In the embodiment described above, examples of semiconductor light emitting devices were given for the purpose of explanation, but it is possible to apply this embodiment to, for example, electronic devices such as Field Effect Transistors (FET) formed using GaN nitride semiconductors.

Note that, in this specification, “nitride semiconductor” includes B_xAl_zGa_(1-x-y-z)N (where 0≦x≦1, 0≦y≦1, 0≦z≦1, and 0≦x+y+z≦1) group III-V compound semiconductors, and furthermore includes mixed crystals containing phosphorus (P) and/or arsenic (As) in addition to nitrogen (N) as group V elements.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel devices and methods described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the devices and methods described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the invention.

Claims

1. A method for manufacturing a semiconductor device having a stacked body connected to a substrate via a joining metal layer, comprising the processes of: joining the stacked body formed on a growth substrate and the substrate via the joining metal layer;removing the growth substrate; andforming an device portion including from an bottommost layer to an topmost layer of the stacked body and a peripheral portion surrounding and provided around the device portion by selectively etching the stacked body, the peripheral portion being a portion of the bottommost layer to the topmost layer of the stacked body and including a portion of a semiconductor layer in contact with the joining metal layer.

2. The method according to claim 1, wherein the growth substrate is GaAs and the stacked body includes an InGaAlP semiconductor.

3. The method according to claim 2, wherein the stacked body includes, from the topmost layer, a current diffusion layer, an n-type clad layer, a light emitting layer, a p-type clad layer, and a p-type contact layer.

4. The method according to claim 3, wherein the semiconductor layer in contact with the joining metal layer is the p-type contact layer.

5. The method according to claim 1, wherein the joining metal layer includes gold (Au).

6. The method according to claim 1, wherein the substrate is conductive.

7. The method according to claim 1, further comprising a process of removing a portion of the bottommost layer to the topmost layer remaining on the peripheral portion of a chip, the chip including the device portion separated by cutting the peripheral portion.