Van Godbold et al, “Thermal Analysis of High Power Modules”, IEEE 1995 Applied Power Electronics Conference and Exposition, pp. 140-146, Mar. 1995.* |
“Wafer Map Distribution of Statistically Correlated Parameters”, Simulation Standard, For Circuit Simulation and Spice Modeling Engineers, Silvaco International, vol. 7, No. 9, Sep. 1996, pp. 1-3. |
“Diagnose Process Variations By Using PSC Charts and a Wafer Map”, Simulation Standard, For Circuit Simulation and Spice Modeling Engineers, Silvaco International, vol. 8, No. 3, Mar. 1997, pp. 1-2. |