Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Selection of measurement locations for patterning processes
- Patent number 12,228,862
- Issue date Feb 18, 2025
- ASML Netherlands B.V.
- Hans Van Der Laan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inline wafer defect detection system and method
- Patent number 12,230,522
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Patrick David Noll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of evaluating SiC substrate, method of manufacturing SiC epi...
- Patent number 12,228,523
- Issue date Feb 18, 2025
- Resonac Corporation
- Ling Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Substrate treating apparatus and substrate treating method
- Patent number 12,230,516
- Issue date Feb 18, 2025
- Semes Co., Ltd.
- Jae Oh Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photolithography alignment process for bonded wafers
- Patent number 12,230,585
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeong-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process recipe search apparatus, etching recipe search method and s...
- Patent number 12,222,690
- Issue date Feb 11, 2025
- HITACHI HIGH-TECH CORPORATION
- Takashi Dobashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interferometer systems and methods for real time etch process compe...
- Patent number 12,218,015
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 12,211,811
- Issue date Jan 28, 2025
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including interconnection to probe pad with...
- Patent number 12,205,856
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit test method and structure thereof
- Patent number 12,205,853
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method of determining control parameters of a device manufacturing...
- Patent number 12,197,136
- Issue date Jan 14, 2025
- ASML Netherlands B.V.
- Wim Tjibbo Tel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for predicting yield of semiconductor devices
- Patent number 12,198,061
- Issue date Jan 14, 2025
- Shanghai Huali Integrated Circuit Corporation
- Shanshan Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate formation of semiconductor devices
- Patent number 12,198,988
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chang-Jhih Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for determining post bonding overlay
- Patent number 12,197,137
- Issue date Jan 14, 2025
- KLA Corporation
- Franz Zach
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing and measuring system for semiconductor structures
- Patent number 12,191,215
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ta Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,191,176
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,188,149
- Issue date Jan 7, 2025
- Sumitomo Electric Device Innovations, Inc.
- Kohei Miyashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display device and manufacturing method therefor
- Patent number 12,193,178
- Issue date Jan 7, 2025
- LG Electronics Inc.
- Myoungjin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and methods for controlling an amount of primer in a primer...
- Patent number 12,191,214
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Pei-Yi Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Showerhead for process tool
- Patent number 12,180,589
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Anthony Dip
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for adjusting surface topography of a substrate support app...
- Patent number 12,183,621
- Issue date Dec 31, 2024
- Micron Technology, Inc.
- Paul D. Shirley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,165,932
- Issue date Dec 10, 2024
- LG Display Co., Ltd.
- Seeun Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Shift control method in manufacture of semiconductor device
- Patent number 12,148,733
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in wafer processing
- Patent number 12,148,640
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iterative formation of damascene interconnects
- Patent number 12,148,721
- Issue date Nov 19, 2024
- Raytheon Company
- Eric R. Miller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING
- Publication number 20250062163
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- Nicholas A. Wiswell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250062164
- Publication date Feb 20, 2025
- LG Display Co., Ltd.
- Seeun KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
HIGH-FREQUENCY DRAIN-EXTENDED METAL-OXIDE-SEMICONDUCTOR (DEMOS) DEV...
- Publication number 20250056829
- Publication date Feb 13, 2025
- Zhejiang University
- Kai XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEASUREMENT APPARATUS AND METHOD OF MANUFACTURING SEM...
- Publication number 20250052691
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Youngsun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS WINDOW OPTIMIZER
- Publication number 20250053702
- Publication date Feb 13, 2025
- ASML NETHERLANDS B.V.
- Stefan HUNSCHE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TEST STRUCTURE AND INTEGRATED CIRCUIT TEST USING SAME
- Publication number 20250054817
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Wei-Kuan Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING SYSTEM AND METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250038019
- Publication date Jan 30, 2025
- Hitachi High-Tech Corporation
- Makoto SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYLINDER HEAD, TRANSFER AND BONDING SYSTEM INCLUDING THE SAME, AND...
- Publication number 20250040292
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFICATION METHOD FOR REDUCING WAFER DEFECTS
- Publication number 20250031461
- Publication date Jan 23, 2025
- Shanghai Huali Integrated Circuit Corporation
- Jin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME
- Publication number 20250029930
- Publication date Jan 23, 2025
- TOPPAN Holdings Inc.
- Fusao TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20250029921
- Publication date Jan 23, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022758
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Yongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE SEPARATION FROM METROLOGY DATA
- Publication number 20250004385
- Publication date Jan 2, 2025
- ASML NETHERLANDS B.V.
- Marc Johannes NOOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING SOURCE PRECURSOR DELIVERY SYSTEM
- Publication number 20250003057
- Publication date Jan 2, 2025
- Entegris, Inc.
- Weihang Guan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MEASUREMENT METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250003874
- Publication date Jan 2, 2025
- TOKYO ELECTRON LIMITED
- Yuji OTSUKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR WAFER TEMPERATURE MEASUREMENT METHOD
- Publication number 20240421008
- Publication date Dec 19, 2024
- KIOXIA Corporation
- Shunsuke OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION CONTROL SYSTEM
- Publication number 20240419156
- Publication date Dec 19, 2024
- Analog Devices International Unlimited Company
- Julius Seville Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...
- Publication number 20240421007
- Publication date Dec 19, 2024
- Kokusai Electric Corporation
- Kentaro GOSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- Publication number 20240421117
- Publication date Dec 19, 2024
- Canon Kabushiki Kaisha
- KIYOTAKA NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION
- Publication number 20240404893
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Shih-Hao KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20240404894
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTATIONAL WAFER INSPECTION
- Publication number 20240403537
- Publication date Dec 5, 2024
- ASML NETHERLANDS B.V.
- Christophe David FOUQUET
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL
- Publication number 20240395637
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chansyun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20240395638
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME
- Publication number 20240395574
- Publication date Nov 28, 2024
- SAMSUNG DISPLAY CO., LTD.
- DEOKJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS

Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Selection of measurement locations for patterning processes

Inline wafer defect detection system and method

Method of evaluating SiC substrate, method of manufacturing SiC epi...

Substrate treating apparatus and substrate treating method

Photolithography alignment process for bonded wafers

Process recipe search apparatus, etching recipe search method and s...

Interferometer systems and methods for real time etch process compe...

Electronic device and method of manufacturing electronic device

Semiconductor structure including interconnection to probe pad with...

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Plasma control method in semiconductor wafer fabrication

Integrated circuit test method and structure thereof

Selective micro device transfer to receiver substrate

Method of determining control parameters of a device manufacturing...

Method and apparatus for predicting yield of semiconductor devices

Gate formation of semiconductor devices

System and method for determining post bonding overlay

Manufacturing and measuring system for semiconductor structures

Integrated substrate measurement system to improve manufacturing pr...

Semiconductor device assembly with pillar array

Method of manufacturing semiconductor device

Display device and manufacturing method therefor

System and methods for controlling an amount of primer in a primer...

Showerhead for process tool

Integrated aligned stealth laser for wafer edge trimming process

Methods for adjusting surface topography of a substrate support app...

Display device

Shift control method in manufacture of semiconductor device

Method and apparatus for use in wafer processing

Iterative formation of damascene interconnects

Patents Applicationslast 30 patents

ACOUSTIC MONITORING FOR PROCESS RELIABILITY DURING POLISHING

DISPLAY DEVICE

HIGH-FREQUENCY DRAIN-EXTENDED METAL-OXIDE-SEMICONDUCTOR (DEMOS) DEV...

SEMICONDUCTOR MEASUREMENT APPARATUS AND METHOD OF MANUFACTURING SEM...

PROCESS WINDOW OPTIMIZER

TEST STRUCTURE AND INTEGRATED CIRCUIT TEST USING SAME

MANUFACTURING SYSTEM AND METHOD OF SEMICONDUCTOR DEVICE

CYLINDER HEAD, TRANSFER AND BONDING SYSTEM INCLUDING THE SAME, AND...

SURFACE MODIFICATION METHOD FOR REDUCING WAFER DEFECTS

INTERPOSERS, SEMICONDUCTOR PACKAGES AND METHODS OF PRODUCING THE SAME

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

SEMICONDUCTOR DEVICE

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

SOURCE SEPARATION FROM METROLOGY DATA

SEMICONDUCTOR MANUFACTURING SOURCE PRECURSOR DELIVERY SYSTEM

MEASUREMENT METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR WAFER TEMPERATURE MEASUREMENT METHOD

SEMICONDUCTOR FABRICATION CONTROL SYSTEM

MATERIAL MONITORING SYSTEM, PROCESSING APPARATUS, METHOD OF MANUFAC...

BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

PROCESSING METHOD AND PROCESSING SYSTEM

APRIORI APPLICATION WITH DYNAMIC DIGITAL CORRECTION (DDC) FUNCTION

SYSTEM AND METHOD FOR CONTROLLING CHEMICAL MECHANICAL PLANARIZATION

COMPUTATIONAL WAFER INSPECTION

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

METHODS FOR REAL TIME ETCH PROCESS COMPENSATION CONTROL

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

LASER DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME