Claims
- 1. A semiconductor device for detecting gamma radiation having a maximum energy comprising:
- (a) a semiconductor substrate having two principal surfaces;
- (b) a substantially annular region of a semiconductor material different from said substrate disposed on a first of said principal surfaces;
- (c) a first electrode disposed on said first principal surface and making electrical contact with said annular region of semiconductor material; and
- (d) a second electrode disposed on a second principal surface of the substrate; wherein application of a biasing voltage between said electrodes leads to the formation of an annular depletion region within the substrate and adjacent to said annular region of semiconductor material, said substrate and said annular region of semiconductor material of a size such that the inner diameter of the depletion region is at least substantially equal to a mean range of secondary electrons generated by incidence of said maximum energy gamma radiation on said substrate, and such that the distance from the outer edge of said annular depletion region to an edge of the substrate is at least substantially equal to said mean range.
- 2. A semiconductor device according to claim 1, wherein the semiconductor substrate is a P-type material and the annular region is formed from an N-type material.
- 3. A semiconductor device according to claim 1, comprising a plurality of substantially annular regions of semiconductor material disposed as a fused array on the substrate.
- 4. A semiconductor device according to claim 1, wherein the maximum energy of the gamma radiation is about 6 MeV and the inner diameter of the depletion region is about 4.6 mm.
- 5. A semiconductor device according to claim 2, wherein the maximum energy of the gamma radiation is about 6 MeV and the inner diameter of the depletion region is about 4.6 mm.
- 6. A semiconductor device according to claim 3, wherein the maximum energy of the gamma radiation is about 6 MeV and the inner diameter of the depletion region is about 4.6 mm.
- 7. A semiconductor device according to claim 1, wherein the semiconductor substrate and the annular region form a heterojunction.
Priority Claims (1)
Number |
Date |
Country |
Kind |
61-235541 |
Oct 1986 |
JPX |
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Parent Case Info
This application is a continuation-in-part of copending U.S. patent application Ser. No. 698,616 filed Feb. 6, 1985 which is a divisional of Ser. No. 528,077 filed Aug. 13, 1983, now abandoned and Ser. No. 771,622 filed Sept. 3, 1985, now U.S. Pat. No. 4,689,649, issued Aug. 25, 1987.
US Referenced Citations (8)
Foreign Referenced Citations (4)
Number |
Date |
Country |
3431053 |
Mar 1985 |
DEX |
53-136987 |
Nov 1978 |
JPX |
61-74375 |
Apr 1986 |
JPX |
2104725 |
Mar 1983 |
GBX |
Related Publications (1)
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Number |
Date |
Country |
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771622 |
Sep 1985 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
528077 |
Aug 1983 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
698616 |
Feb 1985 |
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