Patent Application
20250040256
The present disclosure relates, in general, to semiconductor technology. More particularly, the present disclosure relates to semiconductor device structures that can be used to provide electrostatic discharge (ESD) protection. Semiconductor device structures including fin field-effect transistors (FinFET) and, more specifically, including laterally diffused metal-oxide-semiconductors (LDMOS), can be used in high-power applications such as power amplifiers, radio frequency (RF) amplifiers, and power transistors for radio and wireless communication systems. As the demand for high-power applications increases, research and development efforts continue to advance semiconductor technologies to meet manufacturing capabilities and capacities of foundries and enhance the functionality of various electronic devices and circuits.
In the following description, for the purposes of explanation, numerous details are set forth to provide a thorough understanding of the disclosure. It will be apparent to one skilled in the art, however, that other aspects can be practiced without some details. Different examples are described herein, and while various features are ascribed to the examples, it should be appreciated that the features described with respect to one example may be incorporated with other examples as well. By the same token, however, no single feature or features of any described example should be considered essential to every example, as other examples may omit such features.
When an element is referred to herein as being “connected” or “coupled” to another element, it is to be understood that the elements can be directly connected to the other element, or have intervening elements present between the elements. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, it should be understood that no intervening elements are present in the “direct” connection between the elements. However, the existence of a direct connection does not exclude other connections, in which intervening elements may be present.
When an element is referred to herein as being “disposed” in some manner relative to another element (e.g., disposed on, disposed between, disposed under, disposed adjacent to, or disposed in some other relative manner), it is to be understood that the elements can be directly disposed relative to the other element (e.g., disposed directly on another element), or have intervening elements present between the elements. In contrast, when an element is referred to as being “disposed directly” relative to another element, it should be understood that no intervening elements are present in the “direct” example. However, the existence of a direct disposition does not exclude other examples in which intervening elements may be present.
Likewise, when an element is referred to herein as being a “layer”, it is to be understood that the layer can be a single layer or include multiple layers. For example, a conductive layer can include multiple different conductive materials or multiple layers of different conductive materials, and a dielectric layer may comprise multiple dielectric materials or multiple layers of dielectric materials. When a layer is described as being coupled or connected to another layer, it is to be understood that the coupled or connected layers may include intervening elements present between the coupled or connected layers. In contrast, when a layer is referred to as being “directly” connected or coupled to another layer, it should be understood that no intervening elements are present between the layers. However, the existence of directly coupled or connected layers does not exclude other connections in which intervening elements may be present.
Moreover, the terms left, right, front, back, top, bottom, forward, reverse, clockwise and counterclockwise are used for purposes of explanation only and are not limited to any fixed direction or orientation. Rather, they are used merely to indicate relative locations and/or directions between various parts of an object and/or components.
Furthermore, unless otherwise indicated, all numbers used herein to express quantities, dimensions, and so forth should be understood as being modified in all instances by the term “about”. In this application, the use of the singular includes the plural unless specifically stated otherwise, and use of the terms “and” and “or” means “and/or” unless otherwise indicated. Moreover, the use of the terms “including” and “having”, as well as other forms, such as “includes”, “included”, “has”, “have”, and “had”, should be considered non-exclusive. Also, terms such as “element” or “component” encompass both elements and components comprising one unit and elements and components that comprise more than one unit, unless specifically stated otherwise.
While some features and aspects have been described with respect to the examples, one skilled in the art will recognize that numerous modifications are possible. For example, the methods and processes described herein may be implemented using hardware components, custom integrated circuits (ICs), programmable logic, and/or any combination thereof. Further, while various methods and processes described herein may be described with respect to particular structural and/or functional components for ease of description, methods provided by various embodiments are not limited to any particular structural and/or functional architecture but instead can be implemented in any suitable hardware configuration. Similarly, while some functionality is ascribed to one or more system components, unless the context dictates otherwise, this functionality can be distributed among various other system components in accordance with the several embodiments.
Moreover, while the procedures of the methods and processes described herein are described in a particular order for ease of description, unless the context dictates otherwise, various procedures may be reordered, added, and/or omitted in accordance with various implementations. Moreover, the procedures described with respect to one method or process may be incorporated within other described methods or processes; likewise, system components described according to a particular structural architecture and/or with respect to one system may be organized in alternative structural architectures and/or incorporated within other described systems. Hence, while various examples are described with or without some features for ease of description and to illustrate aspects of those embodiments, the various components and/or features described herein with respect to a particular example can be substituted, added and/or subtracted from among other described embodiments, unless the context dictates otherwise. Consequently, although several examples are described above, it will be appreciated that the disclosure is intended to cover all modifications and equivalents within the scope of the following claims.
Referring to
The trench 190 can be disposed between the gate 164 and the doped region 144, and the trench 290 can be disposed between the doped region 148 and the gate 264. Accordingly, the trench 190 can also be disposed between the doped region 142 and the doped region 144. The trench 190 and the trench 290 can be formed using any suitable lithography and etching techniques. The specific locations of the trench 190 and the trench 290 can provide advantages in terms of various electrical properties of the semiconductor device 100 (e.g., preventing current leakage, etc.). The gate 264 can be a gate for a second transistor separate from a transistor associated with the gate 164. As detailed below, because of the drain terminal design of the semiconductor device 100, advantages in terms of electrostatic discharge prevention can be provided. From the top view shown in
Referring to
The substrate 110 can be formed of silicon material (e.g., crystalline silicon) and/or other suitable materials or combinations of materials. Substrate 110 can be implemented using various fabrication technologies, such as using a silicon-on-insulator (SOI) structure, a bulk semiconductor structure, an alloy semiconductor, a compound semiconductor, germanium, and/or various other suitable materials and combinations thereof. The substrate 110 generally provides a base for forming components of the semiconductor device 100 thereon. It will be appreciated that the semiconductor device 100 can be implemented in a variety of different types of circuits, inducing various types of integrated circuit (IC) chips.
The well 122 can be implemented as a p-type well and the well 124 can be implemented as an n-type well, in some examples. That is, the well 122 can be doped using p-type dopants such as boron and/or other similar p-type dopants, whereas the well 124 can be doped using n-type dopants such as arsenic, phosphorous, and/or other similar dopants. The well 122 and the well 124 can be regions of the substrate 110 such that the well 122 and the well 124 are formed as doped silicon material. The well 122 and the well 124 can also be formed at least partially separate from the substrate 110, for example at least partially within various types of oxide layers and/or other insulating/dielectric layers. Notably, as shown in
The shallow trench isolation 132, the shallow trench isolation 134, and the shallow trench isolation 136 can be formed as a result of etching trenches in the semiconductor device 100. For example, after etching the trench 190, the shallow trench isolation 134 can be formed by depositing a dielectric material at least partially within the trench 190. The shallow trench isolation 132 and the shallow trench isolation 136 can be formed in a similar manner. The dielectric material used to form the shallow trench isolation 132, the shallow trench isolation 134, and the shallow trench isolation 136 can be, for example, silicon oxide, silicon nitride, and/or other suitable materials and combinations of materials. The shallow trench isolation 132, the shallow trench isolation 134, and the shallow trench isolation 136 can generally prevent leakage of electric current between different components of the semiconductor device 100.
The gate 164 can be formed using polysilicon material and/or another suitable material or combination of materials (e.g., a metal gate). Voltage applied at the gate 164 can generally control the operation and conductance of the semiconductor device 100. As shown in
The silicide layer 172 can be formed on the doped region 142 using a trench silicidation process, for example. The silicide layer 176 can likewise be formed on the doped region 146 using a trench silicidation process or another similar type of process. The silicide layer 172 and the silicide layer 176 can generally be formed using a combination of silicon and some type of metal, such as a transition metal, among other possible implementations. The silicide layer 172 can be formed on the doped region 142 to provide an electrical contact for a transistor source terminal. The silicide layer 176 can be formed on the doped region 146 to provide an electrical contact for a transistor drain terminal. The trench silicidation process used to form the silicide layer 172 and the silicide layer 176 can generally include deposition of a metal and heating of the wafer, followed by etching to leave the silicide layer 172 and the silicide layer 176 exposed in the active regions of the semiconductor device 100. The top surfaces (from the perspective shown in
The interconnect 182 can be disposed on the silicide layer 172 to form a transistor source terminal and provide a connection between the semiconductor device 100 (e.g., FinFET) and one or more additional circuit elements (e.g., other components of an integrated circuit, such as other FinFETs). The interconnect 184 can be disposed on the gate 164 to form a transistor gate terminal and likewise to provide a connection between the semiconductor device 100 and one or more additional circuit elements. As noted, in some examples, a silicide layer similar to the silicide layer 172 and the silicide layer 176 can be formed on the gate 164, and then the interconnect 184 can be formed on that silicide layer. The interconnect 186 can be disposed on the silicide layer 176 to form a transistor drain terminal, and to provide a connection between the semiconductor device 100 and one or more additional circuit elements. As shown, the interconnect 186 does not contact the doped region 144 or the doped region 146 of the fin 140. The interconnect 182, the interconnect 184, and the interconnect 186 can be formed using any suitable interconnect structures and materials. The interconnect 182, the interconnect 184, and the interconnect 186 can be implemented as conductive copper vias, for example, among other possible approaches for implementing the interconnect 182, the interconnect 184, and the interconnect 186. The term “interconnect” as used herein refers to any structure used to form one or more electrical connections between components of the semiconductor device 100, and should not unduly limit the scope of the claims.
The doped region 142, the doped region 144, the doped region 146, and the doped region 148 can each be in-situ doped epitaxial regions on the fin 140. The doped region 142, the doped region 144, the doped region 146, and the doped region 148 can be formed using various suitable doping techniques, including doping of the fin 140 (e.g., a silicon fin) using phosphorus or another suitable dopant. As a result of the doping process (e.g., an ion implantation process, etc.), the doped region 142, the doped region 144, the doped region 146, and the doped region 148 of the fin 140 can exhibit different electrical properties than the undoped region 141, the undoped region 143, the undoped region 145, the undoped region 147, the undoped region 149, and the undoped region 151 of the fin 140. For example, after doping pure silicon with phosphorus, extra valence electrons can be added that become unbounded from individual atoms and allow the doped region 142, the doped region 144, the doped region 146, and the doped region 148 of the fin 140 exhibit properties of electrically conductive semiconductor materials.
As shown in
The generally symmetric relationship of the doped region 144, the doped region 146, and the doped region 148 can provide an intrinsic ballast resistor within the semiconductor device 100. The resistance of the intrinsic ballast resistor can increase as the current flowing through the fin 140 increases, and the resistance of the intrinsic ballast resistor can decrease as the current flowing through the fin 140 decreases. In some examples, the use of silicide layers (e.g., the silicide layer 172 and the silicide layer 176) can cause some unwanted device characteristics, including current crowding at the shallow silicide surface. However, the added intrinsic ballast resistor can mitigate these unwanted characteristics without requiring additional fabrication steps and without requiring the use of additional masks during the fabrication process. In some examples, the human body model (HBM) voltage of the semiconductor device 100 can be improved through the added intrinsic ballast resistor without significantly affecting the breakdown voltage. As a result, the semiconductor device 100 can provide better electrostatic discharge prevention when compared to structures that do not include such an intrinsic ballast resistor.
In some examples, the operating voltage of the semiconductor device 100 can range from range from 1 volt to 15 volts. The height of the fin 140 can range from 35 nanometers to 60 nanometers. The length of the gate 164 (along the direction of the fin 140) can range from 200 nanometers to 1 micrometer (micron). The length of the trench 190 (along the direction of the fin 140) can range from 100 nanometers to 1 micrometer (micron). Under these operating conditions and design parameters, the electrostatic discharge prevention functionality provided by the added intrinsic ballast resistor can be particularly advantageous.
Referring to
