SEMICONDUCTOR DEVICE

Abstract

A trimming element for trimming a redundant circuit and a high-accuracy resistance in consideration of the stability and the ease of fuse cutting, and more specifically a trimming element which is easily formed by an existing process. An SOI substrate, a heater connected to the SOI substrate, and a fuse connected to the heater are formed.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a trimming circuit of the present invention;

FIG. 2 is a plane structural diagram illustrating an example of a trimming element of FIG. 1;

FIG. 3 is a cross-sectional structural diagram at the line X-X;

FIG. 4 is a plane structural diagram illustrating another example of a trimming element of FIG. 1; and

FIG. 5 is a cross-sectional structural diagram at the line Y-Y.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is an embodiment of a semiconductor device of the present invention, a so-called trimming circuit. The trimming circuit is one where a trimming element T11 including a fuse part F11 and a bipolar transistor for heating N11 underneath the fuse is connected to the circuit being separated S11 in series. The fuse part and the heating element are electrically separated by an insulation film. The transistor for heating N11 is energized by applying a voltage to the input terminals B11, E11, and C11 thereof, and it is allowed to self-heat only when the fuse F11 is cut. At the same time, by energizing the input terminals P11 and P12 connected to both ends of the fuse part F11, the fuse F11 is cut. With respect of the current applied to the transistor and the heat output, it is necessary to obtain beforehand the current dependence of the heat output. It is possible that the circuit being separated S11 can be replaced with another element such as a resistive element, etc.

First Embodiment

FIGS. 2 and 3 show one embodiment of a trimming element which is an example of a semiconductor device to which the present invention is applied. A plurality of bipolar transistors N21/N31 are formed in parallel as heating elements over the SOI substrate, and, surrounding it, single or multiple isolation grooves U21/U31 are formed of a silicon oxide film, etc. Moreover, a fuse part F21/F31 is formed of a metallic film such as Al, etc. over the bipolar transistors N21/N31 through an insulation film G31 composed of a silicon oxide film, etc. The bipolar transistors N21/N31 for heating are separated from the buried silicon oxide film K31 of the SOI substrate by the isolation grooves U21/U31. The bipolar transistors for heating formed in the isolation grooves are energized by applying a voltage to the electrodes B21/B31, E21/E31, and C21/C31 to heat up the bipolar element intentionally, and, at the same time, a current flows between the input terminals P21 and P22 of both ends of the fuse to execute the fuse cutting.

Second Embodiment

FIGS. 4 and 5 show another embodiment of a trimming element. A plurality of bipolar transistors N41/N51 are formed in parallel as heating elements over the SOI substrate, and an individual transistor is separated by the isolation grooves U41/U51. A fuse part F41/F51 is formed of a metallic film such as Al, etc. over the bipolar transistors N41/N51 through an insulation film G51 composed of a silicon oxide film, etc. the same as the first embodiment. Each bipolar transistor N41/N51 is separated from the buried silicon oxide film K51 of the SOI substrate by the individual isolation grooves U41/U51.

Claims

1. A semiconductor device comprising: a semiconductor substrate;a plurality of heaters formed over said semiconductor substrate in which each or a plurality thereof are separated by isolation grooves; anda fuse formed over said plurality of heaters through an insulation film.

2. A semiconductor device according to claim 1, wherein said semiconductor substrate is an SOI substrate.

3. A semiconductor device according to claim 2, wherein said heaters are separated from a buried silicon oxide film in said SOI substrate by said isolation grooves.

4. A semiconductor device according to claim 1, wherein said heaters are bipolar transistors.

5. A semiconductor device according to claim 1, wherein said heaters are arranged in parallel.

6. A semiconductor device according to claim 1, wherein said heaters and fuse are energized.