the substrate comprising an insulating body on a semiconductor body

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H01L27/1203

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/1203the substrate comprising an insulating body on a semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with a second isolation dam and manufacturi...
- Patent number 12,211,852
- Issue date Jan 28, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yukun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic body biasing for radio frequency (RF) switch
- Patent number 12,206,400
- Issue date Jan 21, 2025
- QUALCOMM Incorporated
- Ravi Pramod Kumar Vedula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Butted body contact for SOI transistor and amplifier circuit
- Patent number 12,205,954
- Issue date Jan 21, 2025
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency switching devices having improved voltage handling...
- Patent number 12,205,851
- Issue date Jan 21, 2025
- Skyworks Solutions, Inc.
- Guillaume Alexandre Blin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for use in digitally tuning a capacitor in an...
- Patent number 12,199,599
- Issue date Jan 14, 2025
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual strained semiconductor substrate and patterning
- Patent number 12,191,208
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF switch device with a sidewall spacer having a low dielectric con...
- Patent number 12,183,804
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC Chips using non-vol...
- Patent number 12,176,901
- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Photonics chips including a fully-depleted silicon-on-insulator fie...
- Patent number 12,176,351
- Issue date Dec 24, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Ryan Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,176,350
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor on insulator having a semiconductor layer with differ...
- Patent number 12,170,284
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-element-including memory device
- Patent number 12,166,107
- Issue date Dec 10, 2024
- Unisantis Electronics Singapore Pte. Ltd.
- Koji Sakui
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked nanosheet gate-all-around device structures
- Patent number 12,166,042
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Nicolas Loubet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on insulator semiconductor device with mixed doped regions
- Patent number 12,166,130
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jack Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method for making
- Patent number 12,165,955
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Josh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,160,999
- Issue date Dec 3, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Kiyoshi Kato
- G11 - INFORMATION STORAGE
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device using semiconductor elements
- Patent number 12,159,923
- Issue date Dec 3, 2024
- Unisantis Electronics Singapore Pte. Ltd.
- Nozomu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit emulating neural system with neuron circuit and...
- Patent number 12,154,017
- Issue date Nov 26, 2024
- Seoul National University R&DBFoundation
- Byung-Gook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based temperature sensor
- Patent number 12,146,798
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Lien Linus Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective polysilicon growth for deep trench polysilicon isolation...
- Patent number 12,148,756
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory having both volatile and non-volatile function...
- Patent number 12,148,472
- Issue date Nov 19, 2024
- Zeno Semiconductor, Inc.
- Yuniarto Widjaja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Front-side-type image sensor
- Patent number 12,148,755
- Issue date Nov 19, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a thermal contact and method of making
- Patent number 12,142,542
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon and silicon germanium nanowire structures
- Patent number 12,142,634
- Issue date Nov 12, 2024
- Sony Group Corporation
- Kelin J. Kuhn
- B82 - NANO-TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device with improved gate ins...
- Patent number 12,137,556
- Issue date Nov 5, 2024
- Renesas Electronics Corporation
- Yuto Omizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside electrical contacts to buried power rails
- Patent number 12,136,655
- Issue date Nov 5, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Memory Having Both Volatile and Non-Volatile Function...
- Publication number 20250037766
- Publication date Jan 30, 2025
- Zeno Semiconductor, Inc.
- Yuniarto Widjaja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...
- Publication number 20250022747
- Publication date Jan 16, 2025
- SOITEC
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Application
TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...
- Publication number 20250022882
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Martin W. Popp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING NITRID...
- Publication number 20250015085
- Publication date Jan 9, 2025
- Shin-Etsu Handotai Co., Ltd.
- Kazunori HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
S-Contact for SOI
- Publication number 20250015082
- Publication date Jan 9, 2025
- pSemi Corporation
- Befruz Tasbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Distributed FET Back-Bias Network
- Publication number 20250015086
- Publication date Jan 9, 2025
- pSemi Corporation
- Simon Edward Willard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Field Effect Transistor Device with Blocking Region
- Publication number 20250006793
- Publication date Jan 2, 2025
- SOOCHOW UNIVERSITY
- Mingxiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20250006544
- Publication date Jan 2, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MAIN-AUXILIARY FIELD-EFFECT TRANSISTOR CONFIGURATIONS
- Publication number 20250007512
- Publication date Jan 2, 2025
- Skyworks Solutions, Inc.
- Hailing Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OPENING IN STRESS-INDUCING LINER(S) BETWEEN TRANSISTORS
- Publication number 20250006842
- Publication date Jan 2, 2025
- GLOBALFOUNDRIES U.S. Inc.
- George Robert Mulfinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240429086
- Publication date Dec 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING SOI DEVICE FROM BULK SILICON SUBSTRATE AND SOI DEVICE
- Publication number 20240420993
- Publication date Dec 19, 2024
- Hangzhou HFC Semiconductor Co.
- Youming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR USE IN IMPROVING LINEARITY OF MOSFETS USIN...
- Publication number 20240421227
- Publication date Dec 19, 2024
- pSemi Corporation
- Christopher N. Brindle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...
- Publication number 20240421139
- Publication date Dec 19, 2024
- Transphorm Technology, Inc.
- Davide Bisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...
- Publication number 20240413162
- Publication date Dec 12, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kah Wee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Voltage Switching Device
- Publication number 20240413243
- Publication date Dec 12, 2024
- MURATA MANUFACTURING CO., LTD.
- Abhijeet Paul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR...
- Publication number 20240413163
- Publication date Dec 12, 2024
- ENKRIS SEMICONDUCTOR (WUXI), LTD.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES
- Publication number 20240405105
- Publication date Dec 5, 2024
- Analog Devices, Inc.
- F. Jacob Steigerwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
RADIO FREQUENCY DEVICE
- Publication number 20240395884
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Po-Yu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20240395944
- Publication date Nov 28, 2024
- SOCIONEXT INC.
- Hiroyuki SHIMBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240395823
- Publication date Nov 28, 2024
- RENESAS ELECTRONICS CORPORATION
- Takaaki TSUNOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...
- Publication number 20240387241
- Publication date Nov 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR
- Publication number 20240385056
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Lien Linus LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED CIRCUIT DIES
- Publication number 20240379462
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hong-Shyang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...
- Publication number 20240379684
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE
- Publication number 20240379486
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING INTERGATE SPACER AND METHODS O...
- Publication number 20240371880
- Publication date Nov 7, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- SEUNGCHAN YUN
- H01 - BASIC ELECTRIC ELEMENTS

the substrate comprising an insulating body on a semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure with a second isolation dam and manufacturi...

Dynamic body biasing for radio frequency (RF) switch

Butted body contact for SOI transistor and amplifier circuit

Radio-frequency switching devices having improved voltage handling...

3D semiconductor devices and structures with metal layers

Method and apparatus for use in digitally tuning a capacitor in an...

Dual strained semiconductor substrate and patterning

RF switch device with a sidewall spacer having a low dielectric con...

Logic drive based on standard commodity FPGA IC Chips using non-vol...

Photonics chips including a fully-depleted silicon-on-insulator fie...

Semiconductor structure and manufacturing method thereof

Semiconductor on insulator having a semiconductor layer with differ...

Semiconductor-element-including memory device

Stacked nanosheet gate-all-around device structures

Silicon on insulator semiconductor device with mixed doped regions

Semiconductor arrangement and method for making

Semiconductor device

Connection arrangements for integrated lateral diffusion field effe...

Memory device using semiconductor elements

Integrated circuit emulating neural system with neuron circuit and...

Methods for producing a 3D semiconductor memory device and structure

Thin film transistor based temperature sensor

Selective polysilicon growth for deep trench polysilicon isolation...

Semiconductor memory having both volatile and non-volatile function...

Front-side-type image sensor

Semiconductor device having a thermal contact and method of making

Silicon and silicon germanium nanowire structures

3D semiconductor device and structure with single-crystal layers

Method of manufacturing semiconductor device with improved gate ins...

Backside electrical contacts to buried power rails

Patents Applicationslast 30 patents

Semiconductor Memory Having Both Volatile and Non-Volatile Function...

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

TRANSISTOR WITH TRENCH ISOLATED WELL FOR SEMICONDUCTOR DEVICE ASSEM...

NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING NITRID...

S-Contact for SOI

Distributed FET Back-Bias Network

Field Effect Transistor Device with Blocking Region

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

MAIN-AUXILIARY FIELD-EFFECT TRANSISTOR CONFIGURATIONS

OPENING IN STRESS-INDUCING LINER(S) BETWEEN TRANSISTORS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

METHOD OF MAKING SOI DEVICE FROM BULK SILICON SUBSTRATE AND SOI DEVICE

METHOD AND APPARATUS FOR USE IN IMPROVING LINEARITY OF MOSFETS USIN...

MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...

CAVITY WITH BOTTOM HAVING DIELECTRIC LAYER PORTION OVER GATE BODY W...

High Voltage Switching Device

COMPOSITE SUBSTRATE, MANUFACTURING METHOD THEREOF AND SEMICONDUCTOR...

HIGH FREQUENCY HETEROJUNCTION BIPOLAR TRANSISTOR DEVICES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

RADIO FREQUENCY DEVICE

SEMICONDUCTOR CHIP

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

STRUCTURE OF HIGH-RESISTIVITY SILICON-ON-INSULATOR EMBEDDED WITH CH...

THIN FILM TRANSISTOR BASED TEMPERATURE SENSOR

HYBRID INTEGRATED CIRCUIT DIES

SELECTIVE POLYSILICON GROWTH FOR DEEP TRENCH POLYSILICON ISOLATION...

INTEGRATED CHIP WITH GOOD THERMAL DISSIPATION PERFORMANCE

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT DEVICES INCLUDING INTERGATE SPACER AND METHODS O...