Claims
- 1. A semiconductor encapsulating epoxy resin composition comprising:
(A) an epoxy resin, (B) a phenolic resin curing agent, (C) a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2 to 20 μm and a specific surface of 1 to 20 m2/g, and (D) an inorganic filler.
- 2. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the fire retardant (C) is included in an amount of 1 to 300 parts by weight per 100 parts by weight of the epoxy resin (A) and the phenolic resin curing agent (B) combined.
- 3. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the fire retardant (C) has a zinc molybdate content of 0.02 to 35 parts by weight per 100 parts by weight of the epoxy resin (A) and the phenolic resin curing agent (B) combined.
- 4. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the fire retardant (C) has a uranium content of not more than 10 ppb.
- 5. A semiconductor device encapsulated with the semiconductor encapsulating epoxy resin composition of claim 1 in a cured state.
- 6. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the spherical silica has a mean particle diameter of 0.3 to 10 μm.
- 7. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the spherical silica has a specific surface of 2 to 18 m2/g.
- 8. The semiconductor encapsulating epoxy resin composition of claim 1, wherein the content of zinc molybdate based on the total amount of zinc molybdate and the spherical silica serving as the carrier is 1 to 50% by weight.
- 9. The semiconductor encapsulating epoxy resin composition of claim 2, wherein the fire retardant is included in an amount of 5 to 100 parts by weight per 100 parts by weight of the epoxy resin and the phenolic resin curing agent combined.
- 10. The semiconductor encapsulating epoxy resin composition of claim 3, wherein the fire retardant has a zinc molybdate content of 0.5 to 25 parts by weight per 100 points by weight of the epoxy resin and the phenolic resin curing agent combined.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-132715 |
May 1998 |
JP |
|
BACKGROUND OF THE INVENTION
[0001] This application is a continuation of co-pending application Ser. No. 09/299,880, filed on Apr. 27, 1999, the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. § 120; and this application claims priority of Application No. 10-132715 filed in Japan on Apr. 27, 1998 under 35 U.S.C. § 119.
Continuations (1)
|
Number |
Date |
Country |
Parent |
09299880 |
Apr 1999 |
US |
Child |
09841046 |
Apr 2001 |
US |