SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefits of Japanese application No. 2023-218956, filed on Dec. 26, 2023. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.

BACKGROUND
Technical Field

The disclosure relates to a semiconductor processing device and a polishing device.

Description of Related Art

A polishing device is used for polishing semiconductor substrates. An example of such a polishing device is disclosed in Patent Document 1 (Japanese Patent Application Laid-Open (JP-A) No. 2010-50436). The polishing unit (polishing device) disclosed in Patent document 1, as shown in FIG. 5 thereof, includes a top ring for holding a wafer, a rotary joint, and a fluid pipe connected to the rotary joint. A part of the fluid supplied from the fluid pipe is supplied to the top ring through the rotary joint.

Meanwhile, the rotary joint may vibrate violently due to the rotation of the shaft. As a result, there is a risk that the fixing of the fluid pipe connected to the rotary joint may loosen, causing liquid to leak from the fluid pipe. To prevent the scattering of liquid leaked from the fluid pipe, a cover may be attached to the polishing unit. In the case where such a cover is rigidly screw-fixed to the frame of the polishing unit, there is a risk that the cover may receive repeated stress due to the vibration of the rotary joint and suffer fatigue failure in a relatively short period. In particular, this problem is likely to occur when the cover is made of resin material.

Further, members attached near the vibration source similarly receive repeated stress due to vibration, so there is a risk that members other than the cover may also suffer fatigue failure in a relatively short period.

Thus, the disclosure provides a semiconductor processing device and a polishing device that may suppress fatigue failure of an attached member (second member) due to vibration.

SUMMARY

The semiconductor processing device according to the disclosure is a semiconductor processing device that includes a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member. The first rod-shaped member is inserted into the first hole, and the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole.

The polishing device according to the disclosure is a polishing device, the polishing device is a semiconductor processing device including a polishing table configured to attachably mount a polishing pad for polishing a substrate, and a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the overall configuration of the substrate processing device according to an embodiment of the disclosure.

FIG. 2 is a schematic perspective view showing the polishing device illustrated in FIG. 1.

FIG. 3 is a schematic cross-sectional view showing the support structure of the top ring of the polishing device illustrated in FIG. 2.

FIG. 4 is a perspective view of the area surrounding the rotary joint shown in FIG. 3.

FIG. 5 is a perspective view omitting the rotary joint from FIG. 4.

FIG. 6A is a cross-sectional view of portion A when viewed from the DA direction in FIG. 5.

FIG. 6B is a cross-sectional view of portion B when viewed from the DB direction in FIG. 5.

FIG. 6C is a cross-sectional view of portion C when viewed from the DC direction in FIG. 5.

FIG. 6D is a cross-sectional view of portion D when viewed from the DD direction in FIG. 5.

FIG. 7 is a perspective view of the cover assembly indicated by 300 in FIG. 3.

FIG. 8 is a perspective view showing the first rod-shaped member according to another embodiment of the disclosure.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, the embodiment of the disclosure is described with reference to the drawings. In the drawings described below, the same or equivalent components are denoted by the same reference numerals, and duplicate descriptions are omitted.

FIG. 1 is a plan view showing the overall configuration of the substrate processing device 100 according to an embodiment of the disclosure. The substrate processing device 100 is a device for performing processing on a semiconductor substrate W. It is noted that, the semiconductor substrate W includes wafers such as silicon wafers, glass wafers, and quartz wafers. As shown in FIG. 1, the substrate processing device 100 includes a load/unload module 102, a polishing module 103, and a cleaning module 104. Furthermore, the substrate processing device 100 includes a controller 105 that controls the substrate processing operations. It is noted that in this disclosure, a device that performs any processing on a semiconductor substrate W is included in the semiconductor processing device. In other words, the substrate processing device 100 and the polishing device 200 to be described later are included in the semiconductor processing device.

The load/unload module 102 includes four front load portions 120 on which wafer cassettes 124 capable of stocking a plurality of substrates W may be placed. These front load portions 120 are arranged along the width direction (perpendicular to the longitudinal direction) of the substrate processing device 100. The front load portions 120 are configured to accommodate open cassettes, SMIF (standard manufacturing interface) pods, or FOUPs (front opening unified pods). Furthermore, the load/unload module 102 includes two transport robots 122 that may move on rails 121 laid along the arrangement of the front load portions 120. The transport robots 122 access the wafer cassettes 124 mounted on the front load portions 120 by moving on the rails 121 and perform the transport of substrates W.

The polishing module 103 has the function of polishing (planarizing) the substrate W. The polishing module 103 includes a first polishing device (CMP device: chemical mechanical polishing device) 200A, a second polishing device 200B, a third polishing device 200C, and a fourth polishing device 200D. The first polishing device 200A, the second polishing device 200B, the third polishing device 200C, and the fourth polishing device 200D are arranged along the longitudinal direction of the substrate processing device 100.

Referring to FIG. 1, the first polishing device 200A includes, for example, a polishing table 230, a top ring 231, a polishing fluid supply nozzle 232, a dresser 233, and an atomizer 234. A polishing pad 210 having a polishing surface is attached to the polishing table 230. The top ring 231 has the function of polishing the substrate W by pressing the substrate W against the polishing pad 210 on the polishing table 230 while holding the substrate W The polishing fluid supply nozzle 232 is configured to supply polishing fluid and dressing fluid (e.g., pure water) to the polishing pad 210. The dresser 233 has the function of dressing the polishing surface of the polishing pad 210. The atomizer 234 has the function of spraying a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) in a mist form onto the polishing surface.

The first polishing device 200A, the second polishing device 200B, the third polishing device 200C, and the fourth polishing device 200D have identical configurations to each other. Thus, the descriptions of the second polishing device 200B, the third polishing device 200C, and the fourth polishing device 200D are omitted. Further, in the disclosure, the first polishing device 200A, the second polishing device 200B, the third polishing device 200C, and the fourth polishing device 200D may be referred to as the polishing device 200. The detailed configuration of the polishing device 200 is described later.

Next, the transport mechanism for transporting the substrate W is described. The substrate processing device 100 includes, as the transport mechanism, a lifter 111, a first linear transporter 106, a swing transporter 112, a second linear transporter 107, and a temporary placement stage 180.

The lifter 111 receives the substrate W from the transport robot 122 and passes the substrate W to the first linear transporter 106. The first linear transporter 106 transports the substrate W received from the lifter 111 between the first transport position TP1, the second transport position TP2, the third transport position TP3, and the fourth transport position TP4. The first polishing device 200A and the second polishing device 200B receive the substrate W from the first linear transporter 106 and polish the substrate W. After polishing, the first polishing device 200A and the second polishing device 200B pass the substrate W back to the first linear transporter 106.

The swing transporter 112 performs the transfer of the substrate W between the first linear transporter 106 and the second linear transporter 107. The second linear transporter 107 transports the substrate W received from the swing transporter 112 between the fifth transport position TP5, the sixth transport position TP6, and the seventh transport position TP7. The third polishing device 200C and the fourth polishing device 200D receive the substrate W from the second linear transporter 107 and polish the substrate W. The third polishing device 200C and the fourth polishing device 200D pass the polished substrate W to the second linear transporter 107. The substrate W that has undergone the polishing process by the polishing module 103 is placed on the temporary placement stage 180 by the swing transporter 112 and then passed to the cleaning module 104.

The cleaning module 104 has the function of performing cleaning process and drying process on the substrate W that has undergone the polishing process by the polishing module 103. The cleaning module 104 includes a first cleaning chamber 190, a first transport chamber 191, a second cleaning chamber 192, a second transport chamber 193, and a drying chamber 194.

The substrate W that has undergone the polishing process by the polishing module 103 is transported to the first cleaning chamber 190 via the first transport chamber 191 and cleaned. Subsequently, the substrate W is transported to the second cleaning chamber 192 via the first transport chamber 191 and cleaned again. Then, the substrate W that has undergone the cleaning process in the first cleaning chamber 190 and the second cleaning chamber 192 is transported to the drying chamber 194 via the second transport chamber 193. The substrate W undergoes the drying process in the drying chamber 194. The substrate W that has undergone the drying process is removed from the drying chamber 194 by the transport robot 122 and transported to the wafer cassette 124 in the front load portion 120.

Next, referring to FIG. 2, a more detailed configuration of the polishing device 200 is described. FIG. 2 is a schematic perspective view showing the polishing device 200. Referring to FIG. 2, the top ring 231 is supported by the top ring shaft (an example of a shaft) 236. The polishing pad 210 is attached to the upper surface of the polishing table 230. The upper surface of the polishing pad 210 constitutes a polishing surface for polishing the substrate W. The top ring 231 and the polishing table 230 are configured to rotate around their respective axes as indicated by the arrows. The substrate W is held on the lower surface of the top ring 231 by vacuum suction. During polishing, polishing fluid is supplied from the polishing fluid supply nozzle 232 to the polishing surface of the polishing pad 210, and the substrate W, which is the object to be polished, is pressed against the polishing surface by the top ring 231 and polished.

FIG. 3 is a schematic cross-sectional view showing the support structure of the top ring 231 of the polishing device 200. Referring to FIG. 3, the polishing device 200 further includes, for example, a top ring head 260, a pulley 261, a pulley 262, a belt 263, and a motor M1. The top ring head 260 rotatably supports the top ring shaft 236. Further, the top ring shaft 236 is connected to the rotating shaft of the motor M1 via the pulley 261, the pulley 262, and the belt 263. As a result, when the motor M1 rotates, the top ring shaft 236 and the top ring 231 rotate around their axis. The motor M1 is mounted on the upper portion of the top ring head 260.

Furthermore, the polishing device 200 includes a top ring base (an example of a base) 265. The polishing device 200 includes a drive device (not shown) inside the top ring base 265 for moving the top ring 231 and the top ring shaft 236 up and down. The drive device, although not limited to, may have a mechanism with a ball screw and a servo motor, or may have an air cylinder, etc., for moving the top ring 231 and the top ring shaft 236 up and down.

Furthermore, the polishing device 200 includes a support shaft 267, a bearing 272, and a motor M2. The top ring head 260 is rotatably supported on the support shaft 267 via the bearing 272. The support shaft 267 is a fixed shaft and does not rotate. The motor M2 is fixed to the top ring head 260. The rotating shaft of the motor M2 is connected to the support shaft 267 via a rotation transmission mechanism (not shown) such as gears. As a result, when the motor M2 rotates, the top ring head 260 operates to swing around the support shaft 267. Then, by the swinging motion of the top ring head 260, the top ring 231 may move between a polishing position above the polishing table 230 and a transport position to the side of the polishing table 230.

Furthermore, the polishing device 200 includes a rotary joint 269, a pressure adjustment device 275, a plurality of pipings 270, a fixed member 400, and a stopper member 280.

FIG. 4 is a perspective view of the area surrounding the rotary joint 269, where the pipings 270 are omitted. FIG. 5 is a perspective view omitting the rotary joint 269 from FIG. 4. FIG. 6A to FIG. 6D are cross-sectional views of portion A when viewed from the DA direction, portion B when viewed from the DB direction, portion C when viewed from the DC direction, and portion D when viewed from the DD direction in FIG. 5, respectively. Referring to FIG. 4 and FIG. 5, the fixed member 400 includes, for example, a thin plate-shaped frame 410 that extends in the vertical direction. The lower end of the frame 410 is fixed to the top ring base 265 (refer to FIG. 3). Further, the stopper member 280 is fixed to the upper end of the frame 410 by two fastening members 282 (refer to FIG. 5).

Referring to FIG. 4 and FIG. 5, the stopper member 280 includes, for example, a thin plate-shaped plate member 284 and a U-shaped cushioning member 286, extending in the horizontal direction. A U-shaped notch 288 is formed in the plate member 284. Then, the rotary joint 269 is positioned to fit into the notch 288 (refer to FIG. 4). This restricts the rotation of the rotary joint 269. In other words, the stopper member 280 supports the rotary joint 269 in a non-rotatable manner. Further, the cushioning member 286 is attached to the notch 288 portion so as to be positioned between the rotary joint 269 and the plate member 284. The cushioning member 286 is, for example, made of rubber. Further, the cushioning member 286 may be, for example, made of resin (such as PVC, POM, etc.). This reduces the vibration transmitted from the rotary joint 269 to the plate member 284.

The plurality of pipings 270 fluidly connects the pressure adjustment device 275 and the rotary joint 269 (refer to FIG. 3).

The rotary joint 269 is positioned at the upper portion of the top ring base 265 and rotatably supports the top ring shaft 236 around a rotating shaft X extending in the vertical direction (refer to FIG. 3). Then, the rotary joint 269 has the function of supplying fluid supplied from the plurality of pipings 270 to a plurality of pressure chambers (not shown) inside the top ring 231 through a through-hole (not shown) inside the top ring shaft 236. Thus, the pressure chambers inside the top ring 231 are in fluid communication with the pressure adjustment device 275 via the through-hole inside the top ring shaft 236, the rotary joint 269, and the pipings 270, respectively. This allows the pressure adjustment device 275 to pressurize or depressurize the interior of the pressure chambers by supplying fluid to the pressure chambers. Then, the polishing device 200 may adjust the pressing force for each region on the surface of the substrate W during polishing of the substrate W by adjusting the pressure inside the plurality of pressure chambers.

Further, during rotation of the top ring shaft 236, the sealing member (not shown) of the rotary joint 269 may generate heat due to sliding. In the case where the sealing member generates heat, there is a risk that the sealing member may expand and adversely affect the sealing performance. Thus, liquid (cooling water) for cooling the sealing member is supplied to the rotary joint 269 through the pipings 270. As a result, the sealing member of the rotary joint 269 is cooled. Further, water (quenching water) used as lubrication for the sliding of the sealing member is also supplied to the rotary joint 269 through the pipings 270.

Here, referring to FIG. 4, the rotary joint 269 has connection ports 271 on its side surface to which the pipings 270 are connected. Meanwhile, the rotary joint 269 may vibrate due to the rotation of the top ring shaft 236. There is a risk that the vibration of the rotary joint 269 may loosen the fixation of the pipings 270 to the connection ports 271, causing liquid to leak from the gap between the pipings 270 and the connection ports 271. Further, there is a risk that the vibration may damage the pipings 270 or the connection ports 271, causing liquid to leak from the damaged areas. Furthermore, in the case where the sealing member of the rotary joint 269 deteriorates, there is a risk of water leakage of the cooling water or quenching water.

In response to this, a drain hole 266 is formed on the upper surface of the top ring base 265 to flow liquid into the drain piping 268 (refer to FIG. 5). This allows the polishing device 200 to discharge liquid that has fallen onto the top ring base 265 through the drain hole 266.

It is noted that in the disclosure, members that generate vibration are included in the vibration source. Then, the rotary joint 269 generates vibration when the sealing member inside slides during rotation of the top ring shaft 236. Thus, the rotary joint 269 is included in the vibration source. Further, in the disclosure, the vibration source may include, for example, members that vibrate at a frequency of 0.1 Hz or more, 1 Hz or more, or 10 Hz or more.

Further, as mentioned above, since the rotary joint 269 vibrates, there is a risk that liquid leaked from the gap between the pipings 270 and the connection ports 271, or liquid leaked from the rotary joint 269 itself due to seal deterioration inside the rotary joint 269, may scatter due to vibration before being discharged through the drain hole 266. To suppress such scattering of liquid, the polishing device 200 includes a cover assembly 300 (refer to FIG. 3).

The following describes the more detailed configuration of the cover assembly 300 with reference to FIG. 3 to FIG. 7. FIG. 7 is a perspective view of the cover assembly 300.

The cover assembly 300 is, for example, positioned on the upper portion of the top ring base 265 and attached to the fixed member 400 (refer to FIG. 3). Referring to FIG. 7, the cover assembly 300 includes a first cover (an example of a second member) 320 having a main body 324, and a second cover (an example of a third member) 360 having a main body 364. In the cover assembly 300, for example, the main body 324 of the first cover 320 and the main body 364 of the second cover 360 are separate members. However, in another embodiment according to the disclosure, the main body 324 of the first cover 320 and the main body 364 of the second cover 360 may be integrally formed.

The main body 324 of the first cover 320 is, for example, a resin member composed of a resin such as polyvinyl chloride (PVC). Further, the main body 324 includes, for example, a thin plate-shaped first wall 326, a thin plate-shaped second wall 328, a thin plate-shaped third wall (an example of a wall) 330, a thin plate-shaped first curved wall 332, and a thin plate-shaped second curved wall 334. The second wall 328 extends in a direction perpendicular to the first wall 326. The third wall 330 extends parallel to the first wall 326. Further, the first curved wall 332 connects the first wall 326 and the second wall 328. The second curved wall 334 connects the second wall 328 and the third wall 330. Further, the first wall 326 has a thick plate portion 338 that is thicker than other parts of the main body 324. The thickness of the thick plate portion 338 is, for example, 7 mm. On the other hand, the thickness of the parts of the first wall 326 other than the thick plate portion 338 is, for example, 3 mm. Further, the thicknesses of the second wall 328, the third wall 330, the first curved wall 332, and the second curved wall 334 are, for example, 3 mm. Furthermore, in the first cover 320, the first wall 326, the second wall 328, the third wall 330, the first curved wall 332, and the second curved wall 334 are integrally formed.

Further, the lower end of the first cover 320 is positioned below the connection ports 271 (refer to FIG. 4). Further, a recess 273 is formed on the upper surface of the top ring base 265. Then, at least a part of the first cover 320 is fitted into the recess 273 of the top ring base 265 (refer to FIG. 4). Furthermore, the first cover 320 surrounds at least a part of the periphery of the rotating shaft X (refer to FIG. 4). As a result, the first cover 320 may suppress the scattering of liquid accumulated on the upper surface of the top ring base 265 due to vibration. In other words, the first cover 320 may suppress the scattering of liquid that has leaked from the connection ports 271 of the rotary joint 296 or from the rotary joint 269 itself.

Further, the upper end of the first cover 320 is positioned below the connection ports 271. It is noted that in another embodiment according to the disclosure, the upper end of the first cover 320 may be positioned at the same height as the connection ports 271, or may be positioned above the connection ports 271.

On the other hand, the main body 364 of the second cover 360 is, for example, a resin member composed of a resin such as polyvinyl chloride (PVC). Further, the main body 364 includes, for example, a thin plate-shaped first wall 366, a thin plate-shaped second wall 368, a thin plate-shaped third wall (an example of a wall) 370, a thin plate-shaped first curved wall 372, and a thin plate-shaped second curved wall 374. The second wall 368 extends in a direction perpendicular to the first wall 366. The third wall 370 extends parallel to the first wall 366. Further, the first curved wall 372 connects the first wall 366 and the second wall 368. The second curved wall 374 connects the second wall 368 and the third wall 370. Further, the first wall 366 has a thick plate portion 378 that is thicker than other parts of the main body 364. The thickness of the thick plate portion 378 is, for example, 7 mm. On the other hand, the thickness of the parts of the first wall 326 other than the thick plate portion 378 is, for example, 3 mm. Further, the thicknesses of the second wall 368, the third wall 370, the first curved wall 372, and the second curved wall 374 are, for example, 3 mm. Furthermore, in the second cover 360, the first wall 366, the second wall 368, the third wall 370, the first curved wall 372, and the second curved wall 374 are integrally formed.

Further, the lower end of the second cover 360 is positioned below the connection ports 271 (refer to FIG. 4). Then, at least a part of the second cover 360 is fitted into the recess 273 of the top ring base 265 (refer to FIG. 4). Furthermore, the second cover 360 surrounds at least a part of the periphery of the rotating shaft X (refer to FIG. 4). As a result, the second cover 360 may suppress the scattering of liquid accumulated on the upper surface of the top ring base 265 due to vibration. In other words, the second cover 360 may suppress the scattering of liquid that has leaked from the connection ports 271 of the rotary joint 296 or from the rotary joint 269 itself.

Further, the upper end of the second cover 360 is positioned below the connection ports 271. It is noted that in another embodiment according to the disclosure, the upper end of the second cover 360 may be positioned at the same height as the connection ports 271, or may be positioned above the connection ports 271.

Further, the first cover 320, the second cover 360, and the plate nut 420 to be described later, integrally surround the entire circumference around the rotating shaft X.

Further, as shown in FIG. 7, the third wall 330 of the first cover 320 has an end face 336. On the other hand, the third wall 370 of the second cover 360 has an opposing end face 376 that contacts the end face 336 or faces the end face 336 with a minute gap. In other words, the end face 336 and the opposing end face 376 extend parallel to each other. Then the end face 336 extends at an angle with respect to the thickness direction of the third wall 330 of the first cover 320. On the other hand, the opposing end face 376 extends at an angle with respect to the thickness direction of the third wall 370 of the second cover 360. As a result, it is difficult for a space to form between the end face 336 and the opposing end face 376 that connects the inside and outside of the wall in the thickness direction. Consequently, it is difficult for liquid to scatter from the seam between the first cover 320 and the second cover 360.

Next, the mounting structure of the first cover 320 to the fixed member 400 is described. Referring to FIG. 6A and FIG. 6B, the polishing device 200 includes, for example, a first rod-shaped member 510, a first elastic member 520, a second rod-shaped member 530, and a second elastic member 540. Further, the fixed member 400 has a frame 410 and a plate-shaped plate nut 420.

The first rod-shaped member 510 is, for example, a bolt, and has a head 512, a male threaded portion 514 connected to the head 512, and a cylindrical portion 516 connected to the male threaded portion 514. The male threaded portion 514 is subjected to screw machining. The cylindrical portion 516 is not subjected to screw machining. The outer diameter of the cylindrical portion 516 is, for example, 3.1 mm. The first rod-shaped member 510 passes through a through-hole 412 formed in the frame 410, and the male threaded portion 514 is fixed to the female threaded portion 422 of the plate nut 420. In this way, the first rod-shaped member 510 is fixed to the fixed member 400. It is noted that in another embodiment according to the disclosure, the first rod-shaped member 510 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Further, the plate nut 420 may be eliminated and female thread machining may be applied to the through-hole 412.

On the other hand, the second rod-shaped member 530 is, for example, a bolt, and has a head 532, a male threaded portion 534 connected to the head 532, and a cylindrical portion 536 connected to the male threaded portion 534. The male threaded portion 534 is subjected to screw machining. The cylindrical portion 536 is not subjected to screw machining. The outer diameter of the cylindrical portion 536 is, for example, 3.1 mm. The second rod-shaped member 530 passes through a through-hole 414 formed in the frame 410, and the male threaded portion 534 is fixed to the female threaded portion 424 of the plate nut 420. In this way, the second rod-shaped member 530 is fixed to the fixed member 400. It is noted that in another embodiment according to the disclosure, the second rod-shaped member 530 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Further, the plate nut 420 may be eliminated and female thread machining may be applied to the through-hole 414. Further, the second rod-shaped member 530 extends parallel to the first rod-shaped member 510.

Further, as shown in FIG. 6B, the first hole 340 and the second hole 342 are formed in the thick plate portion 338 of the first cover 320. Then, the first rod-shaped member 510 is inserted into the first hole 340. The first elastic member 520 is, for example, composed of a material such as rubber that is softer than the main body 324. The hardness of the first elastic member 520 is, for example, Type A durometer hardness of A70 or less. More specifically, the first elastic member 520 is, for example, a P-3 O-ring. Further, the first elastic member 520 is, for example, arranged to surround the outer circumferential surface of the first rod-shaped member 510 inside the first hole 340. More specifically, a groove 344 is formed in the first hole 340, and the first elastic member 520 is inserted into the groove 344. Then, the first elastic member 520 holds the cylindrical portion 516 of the first rod-shaped member 510. In other words, the inner diameter of the first elastic member 520 is smaller than the outer diameter of the cylindrical portion 516 of the first rod-shaped member 510. On the other hand, the second rod-shaped member 530 is inserted into the second hole 342. The second elastic member 540 is, for example, composed of a material such as rubber that is softer than the main body 324. The hardness of the second elastic member 540 is, for example, Type A durometer hardness of A70 or less. More specifically, the second elastic member 540 is, for example, a P-3 O-ring. Further, the second elastic member 540 is, for example, arranged to surround the outer circumferential surface of the second rod-shaped member 530 inside the second hole 342. More specifically, a groove 346 is formed in the second hole 342, and the second elastic member 540 is inserted into the groove 346. Then, the second elastic member 540 holds the cylindrical portion 536 of the second rod-shaped member 530. In other words, the inner diameter of the second elastic member 540 is smaller than the outer diameter of the cylindrical portion 536 of the second rod-shaped member 530.

Meanwhile, as described above, the stopper member 280 fixed to the fixed member 400 supports the rotary joint 269, which is a vibration source (refer to FIG. 3). For this reason, the fixed member 400 is configured to vibrate due to the transmission of vibrations from the rotary joint 269. It is noted that the fixed member 400 is, for example, configured to vibrate at a frequency of 40 Hz or higher. Thus, in the case where a cover is rigidly screw-fixed to the fixed member 400, there is a risk that the cover may receive repeated stress due to the vibration of the fixed member 400 and suffer fatigue failure in a relatively short period. In particular, this problem is likely to occur when the cover is made of resin material.

In contrast, in the polishing device 200, the first cover 320 is supported on the fixed member 400 by being supported on the first rod-shaped member 510 via the first elastic member 520 and on the second rod-shaped member 530 via the second elastic member 540. In other words, the first cover 320 is not fixed to the fixed member 400 by a screw. As a result, the repeated stress acting on the first cover 320 is mitigated by the first elastic member 520 and the second elastic member 540. Consequently, the polishing device 200 may suppress fatigue failure of the first cover 320 attached to the fixed member 400 due to repeated stress. It is noted that in the disclosure, “member A is fixed to member B by a screw” means that member A is fixed to member B by rotating a fastening member having screws and tightening the fastening member having screws.

As described above, in the polishing device 200, the first elastic member 520 is inserted into the groove 344, but the polishing device 200 need not have such a configuration. FIG. 8 is a perspective view showing the first rod-shaped member 510 according to another embodiment of the disclosure. As shown in FIG. 8, the first elastic member 520 may be fixed to the first rod-shaped member 510. More specifically, the first elastic member 520 may be fixed to the first rod-shaped member 510 by being joined to the first rod-shaped member 510 by adhesion, press-fitting, or crimping, etc. Similarly, the second elastic member 540 may be fixed to the second rod-shaped member 530 by being joined to the second rod-shaped member 530 by adhesion, press-fitting, or crimping, etc.

Further, in the case where the first cover 320 is supported only by the first rod-shaped member 510, there is a risk that the first cover 320 may rotate with the first rod-shaped member 510 as the center. In other words, the position of the first cover 320 may not be fixed. In contrast, in the polishing device 200, the first cover 320 is supported by both the first rod-shaped member 510 and the second rod-shaped member 530. Thus, the first cover 320 does not rotate with the first rod-shaped member 510 as the center. In other words, in the polishing device 200, the position of the first cover 320 is fixed.

Further, referring to FIG. 6B, the first rod-shaped member 510 and the second rod-shaped member 530 extend in the horizontal direction. Furthermore, the second rod-shaped member 530 is positioned vertically below the first rod-shaped member 510. As a result, the bending stress in the vertical direction received by the first hole 340 from the first rod-shaped member 510 and the bending stress in the vertical direction received by the second hole 342 from the second rod-shaped member 530 are reduced compared to the case where the first rod-shaped member 510 and the second rod-shaped member 530 are arranged side by side in the horizontal direction. Consequently, in the polishing device 200, the parts of the first cover 320 around the first hole 340 and the second hole 342 are less likely to be damaged.

Next, the mounting structure of the second cover 360 to the fixed member 400 is described. Referring to FIG. 6A and FIG. 6C, the polishing device 200 includes, for example, a first rod-shaped member 610, a first elastic member 620, a second rod-shaped member 630, and a second elastic member 640.

The first rod-shaped member 610 is, for example, a bolt, and has a head 612, a male threaded portion 614 connected to the head 612, and a cylindrical portion 616 connected to the male threaded portion 614. The male threaded portion 614 is subjected to screw machining. The cylindrical portion 616 is not subjected to screw machining. The outer diameter of the cylindrical portion 616 is, for example, 3.1 mm. The first rod-shaped member 610 passes through a through-hole 416 formed in the frame 410, and the male threaded portion 614 is fixed to the female threaded portion 426 of the plate nut 420. In this way, the first rod-shaped member 610 is fixed to the fixed member 400. It is noted that in another embodiment according to the disclosure, the first rod-shaped member 610 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Further, the plate nut 420 may be eliminated and female thread machining may be applied to the through-hole 416.

On the other hand, the second rod-shaped member 630 is, for example, a bolt, and has a head 632, a male threaded portion 634 connected to the head 632, and a cylindrical portion 636 connected to the male threaded portion 634. The male threaded portion 634 is subjected to screw machining. The cylindrical portion 636 is not subjected to screw machining. The outer diameter of the cylindrical portion 636 is, for example, 3.1 mm. The second rod-shaped member 630 passes through a through-hole 418 formed in the frame 410, and the male threaded portion 634 is fixed to the female threaded portion 428 of the plate nut 420. In this way, the second rod-shaped member 630 is fixed to the fixed member 400. It is noted that in another embodiment according to the disclosure, the second rod-shaped member 630 may be fixed to the frame 410 by a hexagonal nut or the like instead of the plate nut 420. Further, the plate nut 420 may be eliminated and female thread machining may be applied to the through-hole 418. Further, the second rod-shaped member 630 extends parallel to the first rod-shaped member 610.

Further, as shown in FIG. 6C, the first hole 380 and the second hole 382 are formed in the thick plate portion 378 of the second cover 360. Then, the first rod-shaped member 610 is inserted into the first hole 380. The first elastic member 620 is, for example, composed of a material such as rubber that is softer than the main body 364. The hardness of the first elastic member 620 is, for example, Type A durometer hardness of A70 or less. More specifically, the first elastic member 620 is, for example, a P-3 O-ring. Further, the first elastic member 620 is, for example, arranged to surround the outer circumferential surface of the first rod-shaped member 610 inside the first hole 380. More specifically, a groove 384 is formed in the first hole 380, and the first elastic member 620 is inserted into the groove 384. Then, the first elastic member 620 holds the cylindrical portion 616 of the first rod-shaped member 610. In other words, the inner diameter of the first elastic member 620 is smaller than the outer diameter of the cylindrical portion 616 of the first rod-shaped member 610. On the other hand, the second rod-shaped member 630 is inserted into the second hole 382. The second elastic member 640 is, for example, composed of a material such as rubber that is softer than the main body 364. The hardness of the second elastic member 640 is, for example, Type A durometer hardness of A70 or less. More specifically, the second elastic member 640 is, for example, a P-3 O-ring. Further, the second elastic member 640 is, for example, arranged to surround the outer circumferential surface of the second rod-shaped member 630 inside the second hole 382. More specifically, a groove 386 is formed in the second hole 382, and the second elastic member 640 is inserted into the groove 386. Then, the second elastic member 640 holds the cylindrical portion 636 of the second rod-shaped member 630. In other words, the inner diameter of the second elastic member 640 is smaller than the outer diameter of the cylindrical portion 636 of the second rod-shaped member 630.

Further, in the polishing device 200, the second cover 360 is supported on the fixed member 400 by being supported on the first rod-shaped member 610 via the first elastic member 620 and on the second rod-shaped member 630 via the second elastic member 640. In other words, the second cover 360 is not fixed to the fixed member 400 by a screw.

Further, referring to FIG. 6C, the first rod-shaped member 610 and the second rod-shaped member 630 extend in the horizontal direction. Furthermore, the second rod-shaped member 630 is positioned vertically below the first rod-shaped member 610.

Next, referring to FIG. 6D, the top ring base 265 includes, for example, a wall 264. The first cover 320 includes, for example, a first cushion member 348 and a second cushion member 350. The first cushion member 348 and the second cushion member 350 are, for example, made of foam material and composed of polyvinyl chloride. It is noted that in another embodiment of the disclosure, the first cushion member 348 and the second cushion member 350 may be made of a material softer than the main body 324 of the first cover 320. The first cushion member 348 and the second cushion member 350 are, for example, attached to the main body 324. The wall 264 is configured to restrict the movement of the first cover 320 in the first direction D1 by contacting the first cushion member 348 of the first cover 320. The first direction D1 is the direction in which the first rod-shaped member 510 extends and the direction in which the first cover 320 moves away from the fixed member 400. As a result, it becomes difficult for the first rod-shaped member 510 to come out of the first hole 340 and for the second rod-shaped member 530 to come out of the second hole 342. Consequently, the first cover 320 is less likely to fall off.

Further, the first cushion member 348 is configured to contact the wall 264 and press the main body 324 in the second direction D2, which is opposite to the first direction D1. On the other hand, the second cushion member 350 is positioned between the main body 324 and the frame 410 of the fixed member 400, and is configured to press the main body 324 in the first direction D1. As a result, the first cushion member 348 and the second cushion member 350 reduce the repeated stress applied to the main body 324 of the first cover 320 due to vibrations in the first direction D1 and the second direction D2. Consequently, in the polishing device 200, the main body 324 of the first cover 320 is less likely to be damaged.

It is noted that the second cover 360 may also include a first cushion member 348 and a second cushion member 350, corresponding to those of the first cover 320.

Further, the first cover 320 includes, for example, two lower side cushion members 352 (refer to FIG. 6D). The lower side cushion members 352 are, for example, made of foam material and composed of polyvinyl chloride. It is noted that in another embodiment of the disclosure, the lower side cushion members 352 may be made of a material softer than the main body 324 of the first cover 320. The lower side cushion members 352 are, for example, attached to the lower surface of the main body 324. Further, the lower side cushion members 352 are configured to contact the top ring base 265 and support the main body 324 from below. As a result, in the polishing device 200, the stress for supporting the first cover 320 related to the first hole 340 and the second hole 342 of the first cover 320 is reduced. Consequently, damage to the main body 324 is suppressed.

It is noted that the second cover 360 may also include lower side cushion members 352, corresponding to those of the first cover 320.

As described above, the disclosure exemplifies the mounting structure of the first cover 320 and the second cover 360 to the fixed member 400, but the disclosure is not limited only to the mounting structure of the first cover 320 and the second cover 360 to the fixed member 400. The mounting structure of the disclosure may be applied to any member. In particular, the mounting structure of the disclosure is effective in cases where another member is attached to a member configured to vibrate.

APPENDIX

Part or all of the above embodiments may be described as in the following appendix, but are not limited to the following.

(Appendix 1)

A semiconductor processing device according to Appendix 1 is a semiconductor processing device that includes: a first rod-shaped member; a first member to which the first rod-shaped member is fixed; a second member in which a first hole is formed; and a first elastic member, the first rod-shaped member is inserted into the first hole, and the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole.

(Effect)

The semiconductor processing device according to Appendix 1 may suppress fatigue failure of the second member attached to the first member due to repeated stress.

(Appendix 2)

The semiconductor processing device according to Appendix 2 is the semiconductor processing device according to Appendix 1, and the second member is not fixed to the first member by a screw.

(Appendix 3)

The semiconductor processing device according to Appendix 3 is the semiconductor processing device according to Appendix 1 or 2 that further includes a vibration source for vibrating the first member.

(Appendix 4)

The semiconductor processing device according to Appendix 4 is the semiconductor processing device according to any one of Appendix 1 to 3 that includes a second rod-shaped member fixed to the first member and extending parallel to the first rod-shaped member; and a second elastic member, a second hole is formed in the second member, the second rod-shaped member is inserted into the second hole, and the second elastic member is configured to surround an outer circumferential surface of the second rod-shaped member inside the second hole.

In the semiconductor processing device according to Appendix 4, the position of the second member is determined.

(Appendix 5)

The semiconductor processing device according to Appendix 5 is the semiconductor processing device according to any one of Appendix 1 to 4, the first rod-shaped member and the second rod-shaped member extend in a horizontal direction, and the second rod-shaped member is positioned vertically below the first rod-shaped member.

According to the semiconductor processing device of Appendix 5, the bending stress received by the first hole from the first rod-shaped member and the bending stress received by the second hole from the second rod-shaped member are reduced compared to the case where the first hole and the second hole are arranged side by side in the horizontal direction.

(Appendix 6)

The semiconductor processing device according to Appendix 6 is the semiconductor processing device according to any one of Appendix 1 to 5 that includes a wall restricting, by contacting the second member, movement of the second member in a first direction, which is a direction in which the first rod-shaped member extends and a direction in which the second member moves away from the first member.

In the semiconductor processing device according to Appendix 6, the first rod-shaped member is less likely to come out of the first hole.

(Appendix 7)

The semiconductor processing device according to Appendix 7 is the semiconductor processing device according to Appendix 6, in the semiconductor processing device, the second member includes: a main body; a first cushion member contacting the wall and pressing the main body in a second direction opposite to the first direction; and a second cushion member positioned between the main body and the first member and pressing the main body in the first direction.

In the semiconductor processing device according to Appendix 7, the main body of the second member is less likely to be damaged.

(Appendix 8)

The semiconductor processing device according to Appendix 8 is the semiconductor processing device according to any one of Appendix 1 to 7 that includes a base located at a lower portion of the second member, the second member includes: a main body; and a lower side cushion member contacting the base and supporting the main body from below.

In the semiconductor processing device according to Appendix 8, the stress applied to the first hole of the second member may be reduced, and damage to the main body may be suppressed.

(Appendix 9)

The semiconductor processing device according to Appendix 9 is the semiconductor processing device according to Appendix 8, and the base is formed with a drain hole for flowing liquid to a drain piping.

In the semiconductor processing device according to Appendix 9, liquid that has flowed down to the base may be discharged from the drain hole.

(Appendix 10)

The semiconductor processing device according to Appendix 10 is the semiconductor processing device according to Appendix 3, the vibration source is a rotary joint, the rotary joint has a connection port on a side surface to which a piping is connected, and supports a shaft configured to be rotatable about a rotating shaft extending in a vertical direction, a lower end of the second member is positioned below the connection port, and the second member is a cover that surrounds at least a part around the rotating shaft.

In the semiconductor processing device according to Appendix 11, the second member, which is a cover, may suppress the scattering of liquid that has leaked from the connection port of the rotary joint or from the rotary joint itself.

(Appendix 11)

The semiconductor processing device according to Appendix 11 is the semiconductor processing device according to Appendix 10 that includes a third member, a lower end of the third member is positioned below the connection port, the third member is a cover that surrounds at least a part around the rotating shaft, the second member has a wall having an end face, the third member has a wall having an opposing end face that contacts the end face or faces the end face with a minute gap, and the end face and the opposing end face extend at an angle with respect to a thickness direction of the wall of the second member and a thickness direction of the wall of the third member.

In the semiconductor processing device according to Appendix 11, liquid is less likely to scatter from the seam between the second member and the third member.

(Appendix 12)

The semiconductor processing device according to Appendix 12 is the semiconductor processing device according to Appendix 10 or 11 that further includes a stopper member fixed to the first member for supporting the rotary joint in a non-rotatable manner.

(Appendix 13)

The semiconductor processing device according to Appendix 13 is the semiconductor processing device according to any one of Appendix 1 to 12, and the second member includes a resin member.

(Appendix 14)

The semiconductor processing device according to Appendix 14 is the semiconductor processing device according to any one of Appendix 1 to 13, the first rod-shaped member is a bolt, the first elastic member is an O-ring, and the first member includes a frame, and a plate nut fixing the first rod-shaped member to the frame.

(Appendix 15)

A polishing device according to Appendix 15 is a polishing device that is a semiconductor processing device according to any one of Appendix 1 to 14 that includes a polishing table configured to attachably mount a polishing pad for polishing a substrate, and a top ring for holding the substrate and polishing the substrate while pressing the substrate against the polishing pad.

The polishing device according to Appendix 15 provides similar effects to the semiconductor processing device according to Appendix 1. That is, this polishing device may suppress fatigue failure of the second member attached to the first member due to repeated stress.

The disclosure has described the embodiments and their respective modification examples, but it goes without saying that the above-mentioned examples are intended to facilitate understanding of the disclosure and do not limit the disclosure. The disclosure may be appropriately modified and improved within the scope that does not deviate from its spirit, and equivalents thereof are included in the disclosure. Further, any combination or omission of the components described in the claims and specification is possible within the range that may solve at least a part of the above-mentioned problems or within the range that may provide at least a part of the effects.

SEMICONDUCTOR PROCESSING DEVICE AND POLISHING DEVICE

Information

Publication Number

Date Filed

Date Published

Inventors

Original Assignees

CPC

International Classifications

Abstract

Description

Claims

Priority Claims (1)