BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to the technical field of manufacturing semiconductor, in particular to a semiconductor structure, a method for fabricating thereof and a method for fabricating a semiconductor layout adopting double patterning technology.
2. Description of the Prior Art
In the fabrication of integrated circuits (ICs), photolithography has been an essential technique. At present, the resolution required by photolithography at 32 nm node and below has exceeded the limit capability of the present mask aligner. Therefore, the double patterning technique (DPT), which can enlarge the minimum pattern distance on the present mask aligner, has become the solution for the line width between 32 nm to 22 nm. DPT technology includes decomposing a set of high-density circuit patterns into two or more sets of low-density circuit patterns; then fabricating photomasks having the sets of low-density circuit patterns respectively which can be used in the corresponding exposure and etching processes; and finally forming a merged pattern corresponding to the high-density patterns as originally required.
However, because DPT must go through multiple exposure processes, overlay control and alignment have always been a concern of DPT, and the problem of overlay control and alignment is more prominent when the high-density circuit pattern is decomposed into two or more sets of circuit patterns with lower density. When overlay errors or inaccurate alignment occur in DPT, it will lead to disconnection or connection of circuit patterns, resulting in serious open circuit or short circuit.
Therefore, there is still a need in the industry for a method for fabricating semiconductor layout and a semiconductor structure fabricated by adopting the layout that can overcome the above problems.
SUMMARY OF THE INVENTION
The present invention provides a semiconductor structure, a method for fabricating thereof and a method for fabricating a semiconductor layout to solve the issues such as the occurrence of broken lines and merged connection lines during the double patterning technique.
According to a first aspect of the present invention, there is provided a semiconductor structure. The semiconductor includes a substrate, a plurality of metal patterns and at least one merged pattern, wherein the metal patterns are disposed on the substrate, the at least one merged pattern is disposed between the adjacent metal patterns, wherein the merged pattern includes a first outer line, a central line and a second outer line sequentially arranged along a first direction, and a short axis of the first outer line, a short axis of the central line and a short axis of the second outer line are misaligned to each other along the first direction.
According to a second aspect of the present invention, there is provided a semiconductor structure. The semiconductor includes a substrate, a plurality of metal patterns and at least one merged pattern, the at least one merged pattern comprises two short axes disposed opposite each other and arranged along a second direction perpendicular to the first direction, each of the short axes comprises a recessed region and at least a protruded region.
According to a third aspect of the present invention, there is provided a semiconductor structure. The semiconductor includes a plurality of metal patterns, disposed on the substrate; and at least one merged pattern, disposed between adjacent two of the metal patterns, wherein the merged pattern comprises a first portion and a second portion sequentially arranged along a first direction and connected with each other, the first portion and the second portion each comprises two ends opposite each other and arranged along a second direction which is perpendicular to the first direction, one end of the first portion extends beyond one end of the second portion to form a first offset, the other end of the second portion extends beyond the other end of the first portion to form a second offset.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic plan view of a layout for fabricating a semiconductor structure according to one embodiment of the present invention.
FIG. 2 is a schematic plan view of a discomposed layout for fabricating a semiconductor structure according to one embodiment of the present invention.
FIG. 3 is a schematic plan view of another discomposed layout for fabricating a semiconductor structure according to one embodiment of the present invention.
FIGS. 4 to 8 are schematic cross-sectional views of each stage of the method for fabricating the semiconductor structure according to one embodiment of the present invention.
FIG. 9 is a schematic plan view of a semiconductor structure according to one embodiment of the present invention.
FIG. 10 is another schematic plan view of a semiconductor structure according to one embodiment of the present invention.
FIG. 11 is another schematic plan view of a semiconductor structure according to one embodiment of the present invention.
FIG. 12 is enlarged top views of a structure in a region R1 according to one embodiment of the present invention
FIG. 13 is a schematic plan view of a semiconductor structure according to embodiments of the present invention.
DETAILED DESCRIPTION
For better understanding of the present invention, some embodiments of the present invention are listed below with the accompanying drawings, the composition and the desired effects of the present invention are described in detail for those skilled in the art.
Please refer to FIG. 1, which is a schematic plan view of a layout 200 for fabricating a semiconductor structure according to one embodiment of the present invention. As shown in FIG. 1, the layout 200 may be a layout of metal connection layers for fabricating semiconductor devices (for example, memory devices such as dynamic random access memory or static random access memory), such as the layout of a 0-th metal layer (M0) and a first metal layer (M1), but is not limited thereto. The layout 200 includes a plurality of connection patterns 210 and at least one to-be-split pattern 213. The connection patterns 210 may be decomposed to a plurality of first connection patterns 211 and a plurality of second connection patterns 212 alternatively arranged with each other, and the to-be-split pattern 213 is arranged between the first connection pattern 211 and the second connection pattern 212 adjacent to the first connection pattern 211. The first connection patterns 211 and the second connection patterns 212 are alternately arranged along a first direction (e.g., the x direction shown in FIG. 1), and each extends along a second direction (e.g., the y direction shown in FIG. 1). It should be noted that part of the connections among the first connection patterns 211 and the second connection patterns 212 may not extend along the second direction, but on the whole, each of the first connection patterns 211 and the second connection patterns 212 may be regarded as extending along the second direction.
According to one embodiment of the present invention, the minimum pattern spacing of the layout 200 violates the predetermined rule of photolithography, that is, a spacing P1 between two adjacent first and second connection patterns 211, 212, a spacing P2 between the to-be-split pattern 213 and the first connection pattern 211 adjacent thereto, and a spacing P3 between the to-be-split pattern 213 and the second connection pattern 212 adjacent thereto violate the predetermined rule of photolithography. When the layout 200 violates the predetermined rule of photolithography, the corresponding pattern formed on the photomask may cause significant light diffraction during the photolithography, and thus the pattern may not be exactly and completely transferred to the semiconductor wafer. In one embodiment, the minimum pattern distance of the layout 200 is, for example, 52 nm, that is, the spacing P1 between each of the first connection patterns 211 and each of the second connection patterns 212 adjacent to the first connection patterns 211 may be 52 nm, and the spacing P2 between the to-be-split pattern 213 and the first connection pattern 211 adjacent thereto and the spacing P3 between the to-be-split pattern 213 and the second connection pattern 212 adjacent thereto may also be 52 nm. In addition, along the first direction, the width of the to-be-split pattern 213 is larger than the width of each first connection pattern 211 and each second connection pattern 212. In one embodiment, the width of the to-be-split pattern 213 may be 2 to 3 times the width of the first connection pattern 211 and the width of the second connection pattern 212.
According to one embodiment of the present invention, the to-be-split pattern 213 may be split into an original cutting portion 213-1 and an original counterpart cutting portion 213-2, and a boundary line 213L is included between the original cutting portion 213-1 and the original counterpart cutting portion 213-2, wherein the original cutting portion 213-1 is in proximity to the second connection pattern 212 and the original counterpart cutting portion 213-2 is in proximity to the first connection pattern 211. In addition, as shown in FIG. 1, at least one upper corner of the to-be-split pattern 213 is cut off (or regarded as being truncated), so that the upper corner becomes a bevel edge 213S. The to-be-split pattern 213 with the bevel edge 213S may increase the distance between the corner of the to-be-split pattern 213 and the first connection pattern 211 adjacent to the to-be-split pattern 213, thereby reducing the possibility of interconnection between the pattern formed by the to-be-split pattern 213 and the connection pattern adjacent to the to-be-split pattern 213 after the photolithography, and avoiding or reducing the short circuit between the formed circuit patterns. In one embodiment, the four corners of the to-be-split pattern 213 may be cut off to form four bevel edge, so that the distance between each of the four corners of the to-be-split pattern 213 and the first connection pattern 211 adjacent to the to-be-split pattern 213 or the second connection pattern 212 adjacent to the to-be-split pattern 213 is increased, which further ensures that no short circuit will occur between the formed circuit patterns.
Then, the first connection pattern 211, the second connection pattern 212, the original cutting portion 213-1 and the original counterpart cutting portion 213-2 may be decomposed into different layouts to thereby obtain the layouts shown in FIGS. 2 and 3. In addition, the layouts shown in FIG. 2 and FIG. 3 are only illustrations, and the patterns in these layouts may be further modified (for example, optical proximity correction), so that the contours of the patterns before and after correction are different from each other.
Please refer to FIG. 2, which is a discomposed layout 200-1 for fabricating a semiconductor structure according to one embodiment of the present invention. As shown in FIG. 2, the discomposed layout 200-1 includes a plurality of first connection patterns 211 and a modified cutting portion 214-1. In detail, the modified cutting portion 214-1 is formed by moving the boundary line 213L of the original cutting portion 213-1, and an end surface 213-1A of the original cutting portion 213-1 away from the boundary line 213L is immobilized. The boundary line 213L is moved along the first direction to the direction close to the original counterpart cutting portion 213-2 to form an end surface 214-1A of the modified cutting portion 214-1, and the area of the formed modified cutting portion 214-1 is larger than that of the original cutting portion 213-1. In one embodiment, the ratio of the area of the modified cutting portion 214-1 to the area of the original cutting portion 213-1 may be 1.05 to 1.50.
Please refer to FIG. 3, which is a schematic plan view of another discomposed layout 200-2 for fabricating a semiconductor structure according to one embodiment of the present invention. As shown in FIG. 3, the another decomposed layout 200-2 includes a plurality of second connection patterns 212 and a modified counterpart cutting portion 214-2. In detail, the modified counterpart cutting portion 214-2 is formed by moving the boundary line 213L of the original counterpart cutting portion 213-2, and an end surface 213-2A of the original counterpart cutting portion 213-2 away from the boundary line 213L is immobilized. The boundary line 213L is moved toward the original cutting portion 213-1 along the first direction to form the end surface 214-2A of the modified counterpart cutting portion 214-2, and the area of the formed modified counterpart cutting portion 214-2 is larger than that of the original counterpart cutting portion 213-2. In one embodiment, the ratio of the area of the modified counterpart cutting portion 214-2 to the area of the original counterpart cutting portion 213-2 may be 1.05 to 1.50.
According to one embodiment of the present invention, it is not limited to moving the boundary line 213L of the original cutting portion 213-1 in FIG. 2 and the boundary line 213L of the original counterpart cutting portion 213-2 in FIG. 3. According to actual requirements, it is also possible to move only the boundary line 213L of the original cutting portion 213-1 without moving the boundary line 213L of the original counterpart cutting portion 213-2. Alternatively, only the boundary line 213L of the original counterpart cutting portion 213-2 is moved without moving the boundary line 213L of the original cutting portion 213-1.
According to one embodiment of the present invention, the decomposed layout 200-1 including the first connection patterns 211 and the modified cutting portion 214-1 is formed on at least one photomask, and another decomposed layout 200-2 including the second connection patterns 212 and the modified counterpart cutting portion 214-2 is formed on another at least one photomask. In addition, according to actual requirements, the decomposed layout 200-1 and the another decomposed layout 200-2 may be further modified (for example, optical proximity correction) before being fabricated into different photomasks.
Next, please refer to FIGS. 4 to 8, which are schematic cross-sectional views of each stage of the method for fabricating the semiconductor structure according to one embodiment of the present invention. First, as shown in FIG. 4, a substrate 101 is provided, which may be a silicon substrate, a silicon-on-insulator (SOI) substrate or other semiconductor substrates. A diffusion barrier layer 103, a target layer 105, a protective layer 107, a bottom mask layer 109, a top mask layer 111, a photoresist bottom layer 113, a photoresist intermediate layer 115 and a bottom anti-reflective coating (BARC) layer 117 are sequentially deposited on the substrate 101, and a patterned photoresist layer 119 is formed on the substrate 101. In one embodiment, the material of the diffusion barrier layer 103 is, for example, titanium nitride (TiN), tantalum nitride (TaN) or other suitable diffusion barrier materials, which may be used to prevent metal atoms in the upper layer from diffusing to the layer underneath. The target layer 105 is, for example, a conductive layer including a metal layer, a metal alloy layer or a combination of the above, such as a tungsten layer. The target layer 105 may be patterned by photolithography to form a metal pattern in the subsequent processes. The protective layer 107 may be a dielectric material, such as silicon nitride, silicon oxide, silicon oxynitride or a combination thereof, and covers the target layer 105 to protect the underlying target layer 105 during the photolithography process. The material of the bottom mask layer 109 is, for example, amorphous silicon, and the pattern of the aforementioned decomposed layout 200-1 and the decomposed layout 200-2 are transferred to the bottom mask layer 109 by photolithography in the subsequent process. The material of the top mask layer 111 is, for example, silicon oxide, and the pattern of the other one of the decomposed layout 200-1 and the decomposed layout 200-2 are transferred to the top mask layer 111 by photolithography in the subsequent process. The material and etching rate of the bottom mask layer 109 are preferably different from those of the top mask layer 111. The photoresist bottom layer 113 may be a spin-on carbon (SOC) layer, which provides a relatively flat surface for the photoresist deposited or coated thereon, so as to facilitate subsequent exposure and development processes. The material of the photoresist intermediate layer 115 may be silicon oxynitride, and the bottom anti-reflective coating (BARC) layer 117 is disposed under the patterned photoresist layer 119, which may be used to reduce the reflected light between the photoresist and the substrate 101 during the exposure process.
According to one embodiment of the present invention, one of the decomposed layout 200-1 and the decomposed layout 200-2, for example, the pattern of the decomposed layout 200-1 formed on a photomask, is transferred to the photoresist layer through exposure and development processes to form the patterned photoresist layer 119 shown in FIG. 4. In one embodiment, positive photoresists may be used, and the pattern of the patterned photoresist layer 119 may correspond to the pattern of the decomposed layout 200-1 on the photomask. However, according to actual requirements, negative photoresists may also be used. Then, referring to FIGS. 4 and 5, the pattern of the patterned photoresist layer 119 is transferred down to the top mask layer 111 by using an etching process to form a mask pattern 112, as shown in FIG. 5. In one embodiment, the pattern of the mask pattern 112 is also the same as the pattern of the decomposed layout 200-1 on the photomask, and includes the first connection patterns 211 and the modified cut portion 214-1.
Then, as shown in FIG. 6, a photoresist bottom layer 121 and a photoresist intermediate layer 123 are sequentially deposited on the mask pattern 112 and the bottom mask layer 109, and a patterned photoresist layer 125 is formed, wherein the photoresist bottom layer 121 may be an organic dielectric layer (ODL) to provide a flat surface on which photoresist is deposited or coated. The photoresist intermediate layer 123 may be a silicon-containing hard-mask bottom anti-reflection coating (SHB) layer. According to one embodiment of the present invention, another one of the decomposed layout 200-1 and the decomposed layout 200-2, for example, the pattern of the decomposed layout 200-2 formed on the another photomask, is transferred to the photoresist layer through exposure and development processes to form the patterned photoresist layer 125 shown in FIG. 6. In one embodiment, a positive photoresist may be used, and the pattern of the formed patterned photoresist layer 125 may correspond to the pattern of the decomposed layout 200-2 on the another photomask, including the second connection patterns 212 and the modified counterpart cutting portion 214-2.
According to one embodiment of the present invention, partial patterns 114 in the mask pattern 112 corresponds to the modified cutting portion 214-1 in the decomposed layout 200-1, while partial patterns 126 in the patterned photoresist layer 125 corresponds to the modified counterpart cutting portion 214-2 in the decomposed layout 200-2. Because the sides of the partial patterns 114 in the mask pattern 112 and the partial patterns 126 in the photoresist layer 125 partially overlap in the direction perpendicular to substrate 101, when the partial patterns 114 and the partial patterns 126 are transferred to the bottom mask layer 109 by etching process, the corresponding patterns formed in the bottom mask layer 109 may be regarded as merged patterns including the partial patterns 114 and the partial patterns 126.
Then, referring to FIG. 6 and FIG. 7, the pattern of the patterned photoresist layer 125 and the pattern of the mask pattern 112 are transferred to the bottom mask layer 109 by etching process to form another mask pattern 110, as shown in FIG. 7. The pattern of the mask 110 may correspond to a pattern formed by combining the decomposed layout 200-1 on one photomask with the decomposed layout 200-2 on another photomask, and the merged pattern includes the first connection patterns 211, the second connection patterns 212, and a pattern formed by combining a modified cutting portion 214-1 and a modified counterpart cutting portion 214-2. As shown in FIG. 7, a merged pattern 116 in the mask pattern 110 is a pattern composed of the modified cut portion 214-1 and the modified counterpart cutting portion 214-2. Ideally, the top-view contour of the merged pattern 116 may be similar to the contour of the to-be-split pattern 213 in FIG. 1, however, in fact, due to the misalignment between two stacked layers during the photolithographic process, the patterned photoresist layer 119 and patterned photoresist layer 125 may be unintentionally laterally shifted in the first direction (such as x direction parallel to the main surface of the substrate 101), the second direction (such as y direction perpendicular to the x direction and parallel to the main surface of the substrate 101), and/or other directions parallel to the main surface of the substrate 101. Thus, the top-view contour of the merged pattern 116 may be different from the contour of the to-be-split pattern 213 in FIG. 1.
Then, referring to FIGS. 7 and 8, the pattern of the mask pattern 110 is transferred to the target layer 105 by an etching process to thereby form a patterned target layer 106 on the substrate 101, as shown in the semiconductor structure 100 shown in FIG. 8. In one embodiment, a portion of the diffusion barrier layer 103 under the patterned target layer 106 may also be patterned together. According to some embodiments of the present invention, the patterned target layer 106 includes a plurality of metal patterns 130 and at least one merged pattern 133. Ideally, the top-view contour of the merged pattern 133 may be similar to the contour of the to-be-split pattern 213 in FIG. 1, however, the actual top-view contour of the merged pattern 133 may be different from the contour of the to-be-split pattern 213 in FIG. 1.
Referring to FIG. 9, which is a schematic plan view of a semiconductor structure according to one embodiment of the present invention. As shown in FIG. 9, the semiconductor structure 100 may be a top view of FIG. 8, which includes the metal patterns 130 and at least one merged pattern 133 disposed on the substrate 101, and the patterned target layer 106 of FIG. 8 includes the metal patterns 130 and the merged patterns 133 shown in FIG. 9. In one embodiment, the semiconductor structure 100 may be a partial structure of a semiconductor memory device, the substrate 101 includes a plurality of active regions (not shown in the figure), and the metal patterns 130 are a plurality of conductive line patterns, and each of the conductive line patterns is electrically connected to each of the active regions. The metal patterns 130 include the first metal patterns 131 and the second metal patterns 132, and the first metal patterns 131 and the second metal patterns 132 are alternately arranged along the first direction (for example, along the x direction shown in FIG. 9). The merged pattern 133 is disposed between the adjacent two of the metal patterns 130, that is, the merged pattern 133 is disposed between the first metal pattern 131 and the second metal pattern 132 adjacent to the first metal pattern 131. In addition, each of the metal patterns 130 and the merged pattern 133 extend along the second direction (for example, along the y direction shown in FIG. 9), and the second direction is perpendicular to the first direction.
Referring to FIG. 9, the merged patterns 133 comprises two merged patterns 133A and 133B which are separated from each other along the second direction (e.g. the y direction) perpendicular to the first direction. At least one of the adjacent metal patterns 130 (e.g. the first metal pattern 131 or the second pattern 132) therefore extends from a side of one merged pattern to a side of another merged patterns along the second direction. In one embodiment, one of the metal patterns 130 does not extend long enough, so that both the merge patterns 133A, 133B are partially overlapped by one of the metal patterns 130. In another embodiment, the metal patterns 130 can extend lengthwise to achieve a sufficient length that exceeds the combined length of the merged patterns 133A, 133B. In this case, the metal patterns 130 overlap an entire sidewall of the two merged patterns 133A, 133B when viewed along the first direction.
According to one embodiment of the present invention, the contour of the merged pattern 133 is defined by the cutting portion 213-1 and the counterpart cutting portion 213-2 of FIG. 1, and the merged pattern 133 includes a first outer line 133-1, an central line 133-3 and a second outer line 133-2 which are sequentially arranged and connected along the first direction. The major axis of the first outer line 133-1, the major axis of the central line 133-3 and the major axis of the second outer line 133-2 are parallel to each other. In one embodiment, the length of the first outer line 133-1 is not equal to the length of the second outer line 133-2, and the width of the merged pattern 133 is larger than the width of each of the first metal patterns 131 and each of the second metal patterns 132. In addition, a short axis (also called an end surface) 133-1E of the first outer line 133-1, a short axis (also called an end surface) 133-3E of the central line 133-3 and a short axis (also called an end surface) 133-2E of the second outer line 133-2 are misaligned to each other along the first direction so that a short axis (also called an end surface) 133E of the merged pattern 133 includes a recessed region and protruded regions. In detail, the recessed region corresponds to the short axis 133-3E of the central line 133-3, and the protruded regions correspond to the short axis 133-1E of the first outer line 133-1 and the short axis 133-2E of the second outer line 133-2. The merged pattern 133 further includes another short axis 133E′ which is disposed opposite to the short axis 133E in the second direction. For example, the first outer line 133-1 comprises two opposite short axes 133-1E, 133-1E′, the central line 133-3 comprises two opposite short axes 133-3E, 133-3E′, and the second outer line 133-2 comprises two opposite short axes 133-3E, 133-3E′, and both of the opposite short axes 133-1E, 133-1E′ of the first outer line 133-1, both of the opposite short axes 133-3E, 133-3E′ of the central line 133-3, and both of the opposite short axes 133-2E, 133-2E′ of the second outer line 133-2 are misaligned with each other along the first direction.
Similar to the short axis 133E, the opposite short axis also includes a short axis from the first outer line, a short axis from the central line, and a short axis from the second outer line, which are misaligned with each other and form a recessed region and a protruded region. In addition, the recessed region and the protruded region of both short axes of the merged pattern 133 include curved surfaces respectively.
In FIG. 9, for the merged pattern 133A, the length (which is parallel to the y direction) of the first outer line 133-1 is shorter than the length (which is parallel to the y direction) of the second outer line 133-2 even though the original cutting portion 213-1 has substantially the same length as the original counterpart cutting portion 213-2. The reason the length of the first outer line 133-1 is shorter than the length of the second outer line 133-2 may be due to the fact that the first outer line 133-1 and the second outer line 133-2 are defined by separate photolithography processes which are carried out in different exposure environments. For different exposure environments, the degree of compensation (e.g. light intensity or exposure duration, etc.) often varies, leading to the difference in the lengths of the first outer line 133-1 and the second outer line 133-2.
In addition, the semiconductor structure 100 further includes a contact structure 135 disposed on the patterned target layer 106, and the contact structure 135 overlaps the merged pattern 133 in a third direction (for example, in the z direction shown in FIG. 9), where the third direction is perpendicular to the surface of the substrate 101. The contact structure 135 may be a conductive structure made of metal, which may be electrically connected to not only the merged pattern 133 underneath but also other structures above, such as an interconnection structure. Since the width of the merged pattern 133 that supports the contact structure 135 is larger than the width of each of the first metal patterns 131 and each of the second metal patterns 132, the merged pattern 133 may be split into two portions, namely the original counterpart cutting portion and the original cutting portion, during the decomposition of the layout, and these two portions may be formed on different photomasks respectively. During the photolithography, if overlay errors or inaccurate alignments occur, the merged pattern used to support the contact structure may be separated from each other, resulting in open circuit or short circuit of the formed circuit.
FIG. 10 is a schematic plan view of a semiconductor structure according to another embodiment of the present invention. The structure of FIG. 10 is similar to that shown in FIG. 9, but the main difference is that the merged pattern 133 of FIG. 10 includes at least one cavity, for example, two cavities 137. The cavity 137 may be located between the first outer line 133-1 and the second outer line 133-2, so that the central line 133-3 located between the first outer line 133-1 and the second outer line 133-2 is thereby distributed discontinuously in the second direction (for example, in the y direction shown in FIG. 9). In the decomposed layout 200-1 and the decomposed layout 200-2 in FIGS. 2 and 3, the layout patterns corresponding to the first outer line 133-1 and the second outer line 133-2 have been modified (the area of the layout patterns is increased), so the first outer line 133-1 and the second outer line 133-2 may not be completely separated by the cavity 137 even if overlay errors or inaccurate alignment occur during the photolithography. In addition, since the contact structure 135 is formed later than the merged pattern 133, a portion of the contact structure 135 may be filled into the cavity 137 when at least a portion of the contact structure 135 overlaps the cavity 137, and hence at least one cavity 137 is filled with metal to form a filled cavity 137m. The filled cavity 137m can also function as a contact structure 135′ and further increase the contact area between the merged pattern 133 and the metal in the filled cavity 137m. Therefore, an increased contact area between the contact structure 135, 135′ and the merged pattern 133 is obtained.
According to one embodiment of the present invention, when fabricating a semiconductor layout, the misalignment between two stacked layers during the photolithographic process, may cause the two parts of the merged pattern 133 be unintentionally laterally shifted in the second direction. FIG. 11 is a schematic plan view of a semiconductor structure according to another embodiment of the present invention. The structure of FIG. 11 is similar to that shown in FIG. 9, but the main difference is that the shape of the merged pattern 133 of FIG. 11 is different from the merged pattern 133 of FIG. 9. Referring to FIG. 11, the merged pattern 133 comprises a first portion 1331 and a second portion 1332. The first portion 1331 corresponds to the original cutting portion 213-1, and the second portion 1332 corresponds to the cutting portion 213-2. The first portion 1331 comprises two opposite ends 1331E and 1331E′, and the second portion 1332 comprises two opposite ends 1332E and 1332E′. Both of the opposite ends 1331E, 1331E′ of the first portion 1331, and both of the opposite ends 1332E, 1332E′ of the second portion 1332 are opposite to each other and arranged along the second direction. As seen in FIG. 11, the end 1331E of the first portion 1331 extends beyond the end 1332E of the second portion 1332 to form a first offset 141, and the end 1332E′ of the second portion 1332 extends beyond the end 1331E′ of the first portion 1331 to form a second offset 142. In one embodiment, the misalignment of the stacked layers may cause each of the first offset 141 and the second offset 142 to be greater than a width of each of the first portion 1331 and the second portion 1332.
Please refer to a top view 12A of FIG. 12, which is an enlarged top view of a structure in a region R1 according to one embodiment of the present invention. In the top view 12A, the short axis 133-3E of the central line 133-3 includes a width W1 (also called a first width) in the first direction, and the width W1 is smaller than the critical dimension (also called minimum resolution) of the photolithography. The term “critical dimension” in the disclosure refers to the minimum dimension of the patterns that could be achieved by photolithography process, and is defined as the equation below:
wherein CD is the critical dimension, k1 is a coefficient that relates to the factors of the process, λ is the wavelength of light used in the process, and NA is the numerical aperture.
Refer to a top view 12B of FIG. 12, which is an enlarged top view of a structure in the region R1 according to one embodiment of the present invention. In the top view 12B, the peak 133-2P of the short axis 133-2E of the second outer line 133-2 and the trough 133-3T of the short axis 133-3E of the central line 133-3 define a width W2 (also called a second width) in the first direction, and the width W2 is smaller than the critical dimension.
Refer to a top view 12C of FIG. 12, which is an enlarged top view of a structure in the region R1 according to one embodiment of the present invention. In the top view 12C, the peak 133-1P of the short axis 133-1E of the first outer line 133-1 and the peak 133-2P of the short axis 133-2E of the second outer line 133-2 define a width W3 (also called a third width) in the first direction, and the width W3 is smaller than two times of the critical dimension, or even less than the critical dimension.
Refer to a top view 12D of FIG. 12, which is an enlarged top view of a structure in the region R1 according to one embodiment of the present invention. In the top view 12D, the peak 133-1P of the short axis 133-1E of the first outer line 133-1 and the trough 133-3T of the short axis 133-3E of the central line 133-3 define a width W4 (also called a fourth width) in the second direction, and the width W4 is smaller than the critical dimension.
Please refer to FIG. 13, which is a top view of a structure according to an embodiment of the present invention. The structure shown in FIG. 13 includes several merged patterns 133, such as merged patterns 133C, 133D. For the merged pattern 133C, the cavity 137 can be larger than the other cavities. The cavity 137 is elongated in the second direction with a length L1 (also called a first length) that can be greater than the maximum width Wmax of any metal pattern 130.
Still refer to FIG. 13, for the merged pattern 133D, the merged pattern 133D includes a recessed region and two protruded regions. The recessed region corresponds to the short axis 133-3E of the central line 133-3 and defines a trough 133-3T. Two protruded regions correspond to the short axis 133-1E of the first outer line 133-1 and the short axis 133-2E of the second outer line 133-2, and the protruded regions define a peak 133-1P and a peak 133-2P, respectively. The trough 133-3T of the short axis 133-3E together with either the peak 133-1P of the short axis 133-1E or the peak 133-2P of the short axis 133-2E define a length Le (also called a second length) of the recessed region in the second direction, and the length L2 can be greater than the maximum width Wmax of any metal pattern 130.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Patent Application
20240274531
