Geometry or layout of the interconnection structure

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H01L23/528

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/528Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip-substrate composite semiconductor device
- Patent number 12,368,052
- Issue date Jul 22, 2025
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with through-substrate interconnects and as...
- Patent number 12,368,096
- Issue date Jul 22, 2025
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic system including the same
- Patent number 12,368,099
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 12,368,103
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and semiconductor memory device with the same
- Patent number 12,369,306
- Issue date Jul 22, 2025
- SK Hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices having a support stack comprising...
- Patent number 12,369,317
- Issue date Jul 22, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of forming semiconductor device
- Patent number 12,368,098
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with etched landing pad surface and manufactur...
- Patent number 12,369,298
- Issue date Jul 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects, inductors, transformers, and power architectures for...
- Patent number 12,368,100
- Issue date Jul 22, 2025
- Synopsys, Inc.
- Jamil Kawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,369,292
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Hsin Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing dual-depth drain-select-...
- Patent number 12,369,319
- Issue date Jul 22, 2025
- SanDisk Technologies, Inc.
- Akihiro Tobioka
- G11 - INFORMATION STORAGE
Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of forming the same
- Patent number 12,368,094
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures for reducing electrical shorts and methods of fo...
- Patent number 12,368,097
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tung-Jiun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory array structure
- Patent number 12,362,015
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Gerben Doornbos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a semiconductor device bonded to a cir...
- Patent number 12,362,276
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial barrier free vias for cobalt-based interconnects and method...
- Patent number 12,362,281
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,362,282
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contacts and methods of forming same
- Patent number 12,363,946
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaled 2T DRAM
- Patent number 12,362,004
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,362,280
- Issue date Jul 15, 2025
- Renesas Electronics Corporation
- Takeshi Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,362,274
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with dual power and signal lines
- Patent number 12,362,278
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and data storage systems including the same
- Patent number 12,363,899
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Yonghoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming embedded diffusion barriers
- Patent number RE50494
- Issue date Jul 15, 2025
- TESSERA LLC
- Cyril Cabral
Information Patent Grant
Semiconductor device assemblies including TSVs of different lengths...
- Patent number 12,362,243
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device including circuitry under bond pads
- Patent number 12,362,244
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Chiara Cerafogli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure including a plurality of an...
- Patent number 12,362,275
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...
- Publication number 20250239519
- Publication date Jul 24, 2025
- NANYA TECHNOLOGY CORPORATION
- MIN-CHUNG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250239526
- Publication date Jul 24, 2025
- KIOXIA Corporation
- Hikaru ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20250239530
- Publication date Jul 24, 2025
- VIA TECHNOLOGIES, INC.
- Yeh-Chi Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SYSTEM INCLUDING THE SAME
- Publication number 20250240963
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250241057
- Publication date Jul 24, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACTS
- Publication number 20250239486
- Publication date Jul 24, 2025
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY
- Publication number 20250239520
- Publication date Jul 24, 2025
- Lodestar Licensing Group LLC
- Harsh Narendrakumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT
- Publication number 20250239523
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING
- Publication number 20250240966
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...
- Publication number 20250240970
- Publication date Jul 24, 2025
- Sunrise Memory Corporation
- Tianhong Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...
- Publication number 20250241060
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Seowoo Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...
- Publication number 20250239522
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS
- Publication number 20250239485
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Kar Wui Thong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...
- Publication number 20250239305
- Publication date Jul 24, 2025
- SANDISK TECHNOLOGIES LLC
- Akira TAKAHASHI
- G11 - INFORMATION STORAGE
Information Patent Application
HIGH-VOLTAGE SEMICONDUCTOR DEVICE
- Publication number 20250241000
- Publication date Jul 24, 2025
- Vanguard International Semiconductor Corporation
- Cheng-Tsung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT
- Publication number 20250241059
- Publication date Jul 24, 2025
- International Business Machines Corporation
- Sagarika Mukesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250239449
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kun-Yen Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239298
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...
- Publication number 20250239524
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Jianfeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-POINT MEMORY CELL AND METHOD
- Publication number 20250240976
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Jen WU
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20250239304
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huai-Ying HUANG
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED FIELD EFFECT TRANSISTOR WITH EPITAXY CUT FOR SOURCE/DRAIN C...
- Publication number 20250239521
- Publication date Jul 24, 2025
- International Business Machines Corporation
- Shay Reboh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...
- Publication number 20250234553
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250234599
- Publication date Jul 17, 2025
- Fuji Electric Co., Ltd.
- Motoyoshi KUBOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE
- Publication number 20250234511
- Publication date Jul 17, 2025
- NANYA TECHNOLOGY CORPORATION
- YI-JEN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH VERTICAL INTERCONNECT
- Publication number 20250233070
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shao-Tse Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233071
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-TA LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...
- Publication number 20250233066
- Publication date Jul 17, 2025
- NVIDIA Corp.
- Mahmut Ersin Sinangil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20250233067
- Publication date Jul 17, 2025
- Yangtze Memory Technologies Co., Ltd.
- Renyan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250233075
- Publication date Jul 17, 2025
- WINBOND ELECTRONICS CORP.
- Yoshinori TANAKA
- G11 - INFORMATION STORAGE

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip-substrate composite semiconductor device

Microelectronic devices with through-substrate interconnects and as...

Semiconductor device and electronic system including the same

Diffusion barrier layer for conductive via to decrease contact resi...

Memory cell and semiconductor memory device with the same

Three-dimensional memory devices having a support stack comprising...

Methods of forming semiconductor device

Electronic package comprising conductive layer connected electrode...

Semiconductor device with etched landing pad surface and manufactur...

Interconnects, inductors, transformers, and power architectures for...

Memory device

Three-dimensional memory device containing dual-depth drain-select-...

IGBT chip integrating temperature sensor

Semiconductor structures and methods of forming the same

Contact structures for reducing electrical shorts and methods of fo...

Memory array structure

Semiconductor package having a semiconductor device bonded to a cir...

Partial barrier free vias for cobalt-based interconnects and method...

Semiconductor structure and manufacturing method thereof

Source/drain contacts and methods of forming same

Scaled 2T DRAM

Semiconductor device and method of manufacture

Semiconductor device and method of manufacturing the same

Package structure and method of forming the same

Transistors with dual power and signal lines

Semiconductor devices and data storage systems including the same

Self-forming embedded diffusion barriers

Semiconductor device assemblies including TSVs of different lengths...

Memory device including circuitry under bond pads

Method of fabricating package structure including a plurality of an...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING METAL STRUCTURE HAVING FUNNEL-SHAPED INTERC...

SEMICONDUCTOR MEMORY DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE

MEMORY DEVICE AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SELF-ALIGNED CONTACTS

MEMORY ARRAYS AND METHODS USED IN FORMING A MEMORY ARRAY

BACKSIDE POWER SCHEME WITH FRONT-SIDE POWER INPUT

INTEGRATED CIRCUIT MEMORY DEVICES THAT SUPPORT CHIP-SCALE PACKAGING

VERTICAL THIN-FILM TRANSISTOR AND APPLICATION AS BIT-LINE CONNECTOR...

INTEGRATED CIRCUIT DEVICES HAVING ENHANCED POWER DELIVERY NETWORKS...

INTEGRATED CIRCUIT (IC) PACKAGE WITH EMBEDDED POWER MANAGEMENT INTE...

MEMORY DEVICE INCLUDING SELF-ALIGNED CONDUCTIVE CONTACTS

THREE-DIMENSIONAL MEMORY DEVICE HAVING DIFFERENT SHAPE SUPPORT PILL...

HIGH-VOLTAGE SEMICONDUCTOR DEVICE

STACKED FET STRUCTURE WITH IMPROVED CELL HEIGHT

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT PROVIDING POWER GATING AND METHOD OF DESIGNING T...

CROSS-POINT MEMORY CELL AND METHOD

MEMORY DEVICE, METHOD OF MANUFACTURING, AND INTEGRATED CIRCUIT DEVICE

STACKED FIELD EFFECT TRANSISTOR WITH EPITAXY CUT FOR SOURCE/DRAIN C...

METHOD OF SELECTIVE BOTTOM WIDENING OF HIGH ASPECT RATIO OPENINGS T...

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING BONDING STRUCTURE

STACKED TRANSISTORS WITH VERTICAL INTERCONNECT

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE DIMENSIONAL CHIP AND PACKAGE INTEGRATION WITH BACKSIDE METALL...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR STRUCTURE