Geometry or layout of the interconnection structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/528Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structures with gate cuts above buried power rails
- Patent number 12,327,791
- Issue date Jun 10, 2025
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with increased unity density
- Patent number 12,328,860
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Cheng Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory IC's with power supply droop circuitry coupled to f...
- Patent number 12,327,581
- Issue date Jun 10, 2025
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with contact structures
- Patent number 12,327,765
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 12,327,777
- Issue date Jun 10, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method therefor, and electronic...
- Patent number 12,328,861
- Issue date Jun 10, 2025
- BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY
- Xuezheng Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D 1T1C stacked dram structure and method to fabricate
- Patent number 12,328,864
- Issue date Jun 10, 2025
- Intel Corporation
- Aaron Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitors with back side power rails
- Patent number 12,327,786
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect elevator based on through silicon vias
- Patent number 12,327,790
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 12,328,945
- Issue date Jun 10, 2025
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 12,328,876
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector via structures for nanostructures and methods of forming...
- Patent number 12,324,182
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method of the same
- Patent number 12,322,668
- Issue date Jun 3, 2025
- Nippon Telegraph and Telephone Corporation
- Hiromasa Tanobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure and method for forming the same
- Patent number 12,322,698
- Issue date Jun 3, 2025
- Winbond Electronics Corp.
- Hung-Jung Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Different scaling ratio in FEOL / MOL/ BEOL
- Patent number 12,322,701
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Liang-Yao Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function threshold gate with input based adaptive threshold a...
- Patent number 12,322,743
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Amrita Mathuriya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a multi-tier memory device with rounded joint stru...
- Patent number 12,324,150
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Tsutomu Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked capacitors with shared electrodes and methods of fabrication
- Patent number 12,324,162
- Issue date Jun 3, 2025
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures including a photodetector and multiple cathode contacts
- Patent number 12,324,252
- Issue date Jun 3, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Francesco Gramuglia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with interconnects and method for preparing...
- Patent number 12,324,212
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tieh-Chiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,693
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Shin Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Series inductors
- Patent number 12,322,697
- Issue date Jun 3, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Venkata Narayana Rao Vanukuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 12,322,699
- Issue date Jun 3, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with finned support pillar structur...
- Patent number 12,322,710
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Jixin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250192036
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20250192040
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sangjine PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250192045
- Publication date Jun 12, 2025
- SOCIONEXT INC.
- Hidetoshi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED POWER GRID METHODOLOGY WITH FLEXIBLE WALKING LOWER METAL...
- Publication number 20250192047
- Publication date Jun 12, 2025
- ADVANCED MICRO DEVICES, INC.
- Partha Pratim GHOSH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250192050
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194113
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET FET WITH EXPANDED GATE REGION
- Publication number 20250194155
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP SOURCE/DRAIN WITH SIDEWALL LINER PROTECTION AND DIRECT BACKSID...
- Publication number 20250194156
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS
- Publication number 20250194210
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WRAP-AROUND CONTACT HAVING NON-UNIFORM TH...
- Publication number 20250194212
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Minhaz Abedin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250194227
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE...
- Publication number 20250194239
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Hyeong Jun KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION
- Publication number 20250194256
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jack Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING A SUBSTRATE WI...
- Publication number 20250192013
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wooseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192018
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Byung Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250191656
- Publication date Jun 12, 2025
- KIOXIA Corporation
- Hiroshi MAEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192038
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250192041
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seongcheon AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF BIPOLAR DEVICE AND BACKSIDE POWER DELIVERY NETWORK
- Publication number 20250192049
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Xiaoming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS
- Publication number 20250192054
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE WITH FERROELECTRIC MEMORY STACKS HAVING DIFFERENT SWITCHI...
- Publication number 20250194098
- Publication date Jun 12, 2025
- GlobalFoundries Dresden Module One Limited Liability Company & Co. KG
- Stefan Dünkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT
- Publication number 20250194120
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lu-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE GATE CONTACT AND BACKSIDE CROSS-COUPLE CONNECT
- Publication number 20250194153
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE SIGNAL CONTACT AND POWER FORMATION FOR STACKED TRANSISTORS
- Publication number 20250194161
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
- Publication number 20250194199
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192029
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonkeun CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250192031
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Kyung Yong KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192039
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Sung Lae OH
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit structures with gate cuts above buried power rails

Logic drive based on chip scale package comprising standardized com...

Semiconductor device with increased unity density

Embedded memory IC's with power supply droop circuitry coupled to f...

Semiconductor device with contact structures

Semiconductor package structure and manufacturing method thereof

Semiconductor device, manufacturing method therefor, and electronic...

3D 1T1C stacked dram structure and method to fabricate

Decoupling capacitors with back side power rails

Vertical interconnect elevator based on through silicon vias

Semiconductor integrated circuit device

Semiconductor device and manufacturing method thereof

Three-dimensional semiconductor memory device

Connector via structures for nanostructures and methods of forming...

Package and manufacturing method of the same

Wiring base and electronic device

Semiconductor memory structure and method for forming the same

Different scaling ratio in FEOL / MOL/ BEOL

Chip package and method of forming the same

Multi-function threshold gate with input based adaptive threshold a...

Method of making a multi-tier memory device with rounded joint stru...

Stacked capacitors with shared electrodes and methods of fabrication

Structures including a photodetector and multiple cathode contacts

Semiconductor structure with interconnects and method for preparing...

Integrated circuit

Dual-mode wireless charging device

Series inductors

Method of forming high density, high shorting margin, and low capac...

Three-dimensional memory device with finned support pillar structur...

Method of forming integrated chip structure having slotted bond pad...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

AUTOMATED POWER GRID METHODOLOGY WITH FLEXIBLE WALKING LOWER METAL...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NANOSHEET FET WITH EXPANDED GATE REGION

DEEP SOURCE/DRAIN WITH SIDEWALL LINER PROTECTION AND DIRECT BACKSID...

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

SEMICONDUCTOR STRUCTURE WITH EXTENDED BACKSIDE CONNECTIONS

SEMICONDUCTOR DEVICE WITH WRAP-AROUND CONTACT HAVING NON-UNIFORM TH...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

INVERTER AND SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING THE...

POWER SWITCH FOR BACKSIDE POWER DISTRIBUTION

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING A SUBSTRATE WI...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

SEMICONDUCTOR STORAGE DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME

INTEGRATION OF BIPOLAR DEVICE AND BACKSIDE POWER DELIVERY NETWORK

SECOND AIR GAP TYPE FOR SUBTRACTIVE INTERCONNECTS

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

STRUCTURE WITH FERROELECTRIC MEMORY STACKS HAVING DIFFERENT SWITCHI...

METAL-INSULATOR-METAL DEVICE CAPACITANCE ENHANCEMENT

BACKSIDE GATE CONTACT AND BACKSIDE CROSS-COUPLE CONNECT

BACKSIDE SIGNAL CONTACT AND POWER FORMATION FOR STACKED TRANSISTORS

PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF