Geometry or layout of the interconnection structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/528Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Standard cell design architecture for reduced voltage droop utilizi...
- Patent number 12,205,897
- Issue date Jan 21, 2025
- Advanced Micro Devices, Inc.
- Richard T. Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic protection element
- Patent number 12,206,017
- Issue date Jan 21, 2025
- Kabushiki Kaisha Tokai-Rika-Denki-Seisakusho
- Kengo Shima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring
- Patent number 12,205,885
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device including buried conductive f...
- Patent number 12,205,899
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming semiconductor structure and semiconductor structure
- Patent number 12,205,893
- Issue date Jan 21, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Tianlei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 12,205,883
- Issue date Jan 21, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Zhi Lin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure, semiconductor device and method of manufacturing...
- Patent number 12,205,890
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Li-Yen Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,892
- Issue date Jan 21, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Akio Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Routing pattern
- Patent number 12,205,894
- Issue date Jan 21, 2025
- Macronix International Co., Ltd.
- Chin-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having staircase structure and meth...
- Patent number 12,205,895
- Issue date Jan 21, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit board structure and manufacturing met...
- Patent number 12,205,923
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with chiplets coupled to a memory device
- Patent number 12,205,924
- Issue date Jan 21, 2025
- Intel Corporation
- Andrew Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,207,459
- Issue date Jan 21, 2025
- SanDisk Technologies LLC
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory structure fabrication using channel replac...
- Patent number 12,205,645
- Issue date Jan 21, 2025
- SUNRISE MEMORY CORPORATION
- Shohei Kamisaka
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory devices
- Patent number 12,207,473
- Issue date Jan 21, 2025
- Lodestar Licensing Group LLC
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid method for forming semiconductor interconnect structure
- Patent number 12,205,886
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-metal cell semiconductor device and method
- Patent number 12,205,898
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plasma-damage-resistant interconnect structure and methods for form...
- Patent number 12,205,901
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jheng-Hong Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having interconnection lines with different li...
- Patent number 12,199,042
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Wonhyuk Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,199,060
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Changbo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,016
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Shaofeng Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure, circuit and electronic apparatus includi...
- Patent number 12,199,031
- Issue date Jan 14, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance interconnect structure for semiconductor device
- Patent number 12,199,036
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jason Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,199,089
- Issue date Jan 14, 2025
- SOCIONEXT INC.
- Kazuya Okubo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULAR CHIPLET SYSTEM
- Publication number 20250029971
- Publication date Jan 23, 2025
- Zero ASIC Corporation
- Andreas Olofsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...
- Publication number 20250029922
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SZU-LING LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...
- Publication number 20250029924
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250029946
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INCLUDING 2-TRANSISTOR MEMORY CELL STRUCTURE FOR NEUR...
- Publication number 20250029638
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031375
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Sung-Lae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250031412
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hyojin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250031427
- Publication date Jan 23, 2025
- Industrial Technology Research Institute
- Chih-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE
- Publication number 20250029873
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS
- Publication number 20250029894
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250029896
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Younghun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250029923
- Publication date Jan 23, 2025
- SOCIONEXT INC.
- Masato NAKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...
- Publication number 20250029945
- Publication date Jan 23, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE FORMATION FOR A MEMORY ARRAY
- Publication number 20250031383
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250031437
- Publication date Jan 23, 2025
- INNOSCIENCE (SUZHOU) SEMICONDUCTOR CO., LTD.
- Xiaoming LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...
- Publication number 20250029915
- Publication date Jan 23, 2025
- Intel Corporation
- Leonard P. Guler
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LATERALLY UNCONFINED STRUCTURE
- Publication number 20250029919
- Publication date Jan 23, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR COMPONENT AND METHODS
- Publication number 20250029920
- Publication date Jan 23, 2025
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...
- Publication number 20250029926
- Publication date Jan 23, 2025
- Intel Corporation
- Bernhard SELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE STRUCTURE FOR MEMORY DEVICE
- Publication number 20250031366
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250031373
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Yun Cheol HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY
- Publication number 20250031378
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Go OIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250031442
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Ji Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20250029921
- Publication date Jan 23, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250029956
- Publication date Jan 23, 2025
- KIOXIA Corporation
- Yasunori IWASHITA
- G11 - INFORMATION STORAGE
Information Patent Application
CELL ARCHITECTURE OF SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR C...
- Publication number 20250031456
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Jintae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022788
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME
- Publication number 20250022801
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Te-Hsin CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Standard cell design architecture for reduced voltage droop utilizi...

Wafer-level design and wiring pattern for a semiconductor package

Electrostatic protection element

Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring

Contact via formation

Method of making semiconductor device including buried conductive f...

Method for forming semiconductor structure and semiconductor structure

Sensor packages

Semiconductor structure and fabrication method thereof

Circuit structure, semiconductor device and method of manufacturing...

Semiconductor device

Routing pattern

Three-dimensional memory device having staircase structure and meth...

Semiconductor device, circuit board structure and manufacturing met...

Semiconductor packages with chiplets coupled to a memory device

Three-dimensional memory array with dual-level peripheral circuits...

Three-dimensional memory structure fabrication using channel replac...

Memory devices

Hybrid method for forming semiconductor interconnect structure

Metal-oxide-metal cell semiconductor device and method

Plasma-damage-resistant interconnect structure and methods for form...

Semiconductor device having interconnection lines with different li...

Semiconductor device and method of fabricating the same

3D semiconductor devices and structures with metal layers

Gate line plug structures for advanced integrated circuit structure...

Semiconductor device

Interconnection structure, circuit and electronic apparatus includi...

Low resistance interconnect structure for semiconductor device

Integrated fan-out package, package-on-package structure, and manuf...

Semiconductor device

Patents Applicationslast 30 patents

MODULAR CHIPLET SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR S...

CORRUGATED TIER SUPPORT STRUCTURE AND REPLACEMENT SOURCE INTERIOR C...

PACKAGE STRUCTURE

MEMORY DEVICE INCLUDING 2-TRANSISTOR MEMORY CELL STRUCTURE FOR NEUR...

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH LINER STRUCTURE

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

DUAL VIA STRUCTURE FOR THROUGH-CHIP CONNECTIONS

SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING VIAS WITH DIFFERENT DIMENSIONS AND M...

ACCESS LINE FORMATION FOR A MEMORY ARRAY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

VERTICAL METAL SPLITTING USING HELMETS AND WRAP-AROUND DIELECTRIC S...

LATERALLY UNCONFINED STRUCTURE

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR COMPONENT AND METHODS

METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THE...

STAIRCASE STRUCTURE FOR MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY

SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

SEMICONDUCTOR MEMORY DEVICE

CELL ARCHITECTURE OF SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR C...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT, SYSTEM AND METHOD OF FORMING SAME