Geometry or layout of the interconnection structure

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H01L23/528

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/528Geometry or layout of the interconnection structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Protection structures for bonded wafers
- Patent number 12,243,772
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ssu-Chiang Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,243,777
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Woojin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask alternating line deposition
- Patent number 12,243,819
- Issue date Mar 4, 2025
- International Business Machines Corporation
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fine metal lines for BEOL structure and m...
- Patent number 12,243,820
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Taeyong Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive line structures and method of forming same
- Patent number 12,243,821
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power switch for backside power distribution
- Patent number 12,243,866
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jack Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory system with multiple wiring boards with multiple projecting...
- Patent number 12,243,612
- Issue date Mar 4, 2025
- Kioxia Corporation
- Kenta Iwasaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Through-circuit vias in interconnect structures
- Patent number 12,243,805
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with porous dielectric layers and method for f...
- Patent number 12,243,817
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power switch for backside power distribution
- Patent number 12,243,868
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jack Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional vertical nor flash thin-film transistor strings
- Patent number 12,245,430
- Issue date Mar 4, 2025
- SUNRISE MEMORY CORPORATION
- Eli Harari
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 12,243,818
- Issue date Mar 4, 2025
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit
- Patent number 12,243,822
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM cell word line structure with reduced RC effects
- Patent number 12,245,412
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a buried metal line in a semiconductor substrate
- Patent number 12,237,207
- Issue date Feb 25, 2025
- Imec VZW
- Boon Teik Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and same
- Patent number 12,237,222
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Fan Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 12,237,265
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Sangoh Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fin structure
- Patent number 12,237,322
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shun-Li Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power rail for physical failure analysis (PFA)
- Patent number 12,237,233
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with stacked conductive plugs and me...
- Patent number 12,237,260
- Issue date Feb 25, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell, semiconductor device having the same, and methods of m...
- Patent number 12,239,031
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power wall integration for multiple stacked devices
- Patent number 12,237,333
- Issue date Feb 25, 2025
- Tokyo Electron Limited
- Daniel Chanemougame
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device with memory cells each including a char...
- Patent number 12,237,014
- Issue date Feb 25, 2025
- Kioxia Corporation
- Takatoshi Minamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk cancelation structures having metal layers between signal...
- Patent number 12,237,258
- Issue date Feb 25, 2025
- RAMBUS INC.
- Shahram Nikoukary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising multilevel bitlines, and related meth...
- Patent number 12,237,259
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods of manufacturing thereof
- Patent number 12,237,267
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having supportive plating structures
- Patent number 12,237,275
- Issue date Feb 25, 2025
- Western Digital Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact transistor utilizing shield structure arrangement
- Patent number 12,237,257
- Issue date Feb 25, 2025
- NXP USA, INC.
- Vikas Shilimkar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250067793
- Publication date Feb 27, 2025
- InnoLux Corporation
- Chia-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS
- Publication number 20250070018
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- I-Hsin Yang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250070024
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Takafumi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...
- Publication number 20250070028
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20250071968
- Publication date Feb 27, 2025
- Beijing Superstring Academy of Memory Technology
- Xuezheng AI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME
- Publication number 20250071977
- Publication date Feb 27, 2025
- CXMT Corporation
- Yexiao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072048
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Youngjin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070002
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Kyungtae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070021
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Ki-Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MEMORY DEVICE
- Publication number 20250070025
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Shyue Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...
- Publication number 20250069947
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- WEI-CHEN PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...
- Publication number 20250069950
- Publication date Feb 27, 2025
- Micron Technology, Inc.
- Raja Kumar Varma Manthena
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...
- Publication number 20250070029
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...
- Publication number 20250071992
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Min Yong Lee
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HO...
- Publication number 20250071998
- Publication date Feb 27, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Masanori TSUTSUMI
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...
- Publication number 20250072001
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hanbyeol LEE
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD
- Publication number 20250069993
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...
- Publication number 20250070014
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20250070020
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250070023
- Publication date Feb 27, 2025
- KIOXIA Corporation
- Hisashi KATO
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION
- Publication number 20250069885
- Publication date Feb 27, 2025
- ASM IP HOLDING B.V.
- Eva E. Tois
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM LAYOUTS FOR SRAM AND REGISTER FILE BIT CELLS
- Publication number 20250071963
- Publication date Feb 27, 2025
- Intel Corporation
- Zheng GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFUSE CELLS WITH BACKSIDE POWER RAILS
- Publication number 20250071984
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Li-Chin Yu
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING MULTIPLE DECKS OF MEMORY CELLS AND PILLARS...
- Publication number 20250071996
- Publication date Feb 27, 2025
- Lodestar Licensing Group, LLC
- Darwin A. Clampitt
- G11 - INFORMATION STORAGE
Information Patent Application
RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER
- Publication number 20250072013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20250072078
- Publication date Feb 27, 2025
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...
- Publication number 20250072106
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jisoo PARK
- H01 - BASIC ELECTRIC ELEMENTS

Geometry or layout of the interconnection structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Protection structures for bonded wafers

Semiconductor device and method of manufacturing the same

Single-mask alternating line deposition

Semiconductor device with fine metal lines for BEOL structure and m...

Conductive line structures and method of forming same

Power switch for backside power distribution

Memory system with multiple wiring boards with multiple projecting...

Through-circuit vias in interconnect structures

Semiconductor device with porous dielectric layers and method for f...

Power switch for backside power distribution

Three-dimensional vertical nor flash thin-film transistor strings

Memory device and method of manufacturing the same

Method of manufacturing integrated circuit

SRAM cell word line structure with reduced RC effects

Method for forming a buried metal line in a semiconductor substrate

Method for manufacturing semiconductor device and same

Methods of manufacturing semiconductor devices

Integrated circuit semiconductor device

Semiconductor device having fin structure

Backside power rail for physical failure analysis (PFA)

Semiconductor device structure with stacked conductive plugs and me...

Semiconductor device having a contact structure

Memory cell, semiconductor device having the same, and methods of m...

Power wall integration for multiple stacked devices

Semiconductor memory device with memory cells each including a char...

Crosstalk cancelation structures having metal layers between signal...

Electronic devices comprising multilevel bitlines, and related meth...

Memory devices and methods of manufacturing thereof

Semiconductor devices having supportive plating structures

Compact transistor utilizing shield structure arrangement

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS

SEMICONDUCTOR MEMORY DEVICE

INTERCONNECTION STRUCTURE WITH COMPOSITE ISOLATION FEATURE AND METH...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING MEMORY DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE BARRIER STRUCTURE AND METHOD FO...

MICROELECTRONIC DEVICES, AND RELATED MEMORY DEVICES AND ELECTRONIC...

Method of Fabricating Redistribution Circuit Structure

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRU...

SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND...

THREE-DIMENSIONAL MEMORY DEVICE WITH SOURCE CONTACT LAYER HAVING HO...

SEMICONDUCTOR DEVICE HAVING MEMORY STRINGS ARRANGED IN A VERTICAL D...

PACKAGE STRUCTURE WITH PHOTONIC DIE AND METHOD

SEMICONDUCTOR DIE STUCTURE WITH AIR GAPS AND METHOD FOR PREPARING T...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SELECTIVE PASSIVATION AND SELECTIVE DEPOSITION

UNIFORM LAYOUTS FOR SRAM AND REGISTER FILE BIT CELLS

EFUSE CELLS WITH BACKSIDE POWER RAILS

MEMORY DEVICE INCLUDING MULTIPLE DECKS OF MEMORY CELLS AND PILLARS...

RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...

THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING TH...