Semiconductor substrate, production method thereof and semiconductor device

Abstract

[Problem to be Solved] An object is to provide an art for preventing an element formative layer (active layer) from peeling off from a buried insulating film (intermediate insulating layer) with regard to production method of a semiconductor substrate having trench construction.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[FIG. 1] It is a sectional side view of a SOI wafer concerning an embodiment of the present invention.

[FIG. 2] It is a flow chart of production of a semiconductor substrate concerning an embodiment of the present invention.

[FIG. 3] It is a drawing explaining the flow of production of the semiconductor substrate according to the Embodiment 1.

[FIG. 4] It is a plan view of trench pattern.

[FIG. 5] It is a plan view of another trench pattern.

[FIG. 6] It is a plan view of the semiconductor substrate.

[FIG. 7] It is a drawing explaining the flow of production of the semiconductor substrate according to the Embodiment 2.

[FIG. 8] It is a plan view of the trench pattern.

[FIG. 9] It is a plan view of the semiconductor substrate.

[FIG. 10] It is a drawing explaining the flow of production of the conventional semiconductor substrate.

[FIG. 11] It is a plan view of the conventional semiconductor substrate.

Claims

1. Production method of a semiconductor substrate constructed by laminating a support substrate, a buried insulating film and an element formative layer in this order and having a trench in the element formative layer for separating an element, comprising: a process forming one or plural trenches in the element formative layer along an outer perimeter of an element formative area so as to connect the element formative area of the element formative layer to an outer peripheral part thereof at a part thereof at least;a process oxidizing a part of the element formative layer connecting the element formative area to the outer peripheral part thereof; anda process filling up the trenches with an insulator.

2. The production method of a semiconductor substrate as set forth in claim 1, wherein the trenches are enough deep to reach the buried insulating film, and are provided intermittently while a fixed distance exists between each two trenches adjacent to each other.

3. The production method of a semiconductor substrate as set forth in claim 2, wherein the fixed distance between the trenches is not less than 0.1 μm and not more than 1 μm.

4. The production method of a semiconductor substrate as set forth in claim 1, wherein the trenches are provided continuously along the outer perimeter of the element formative area while a fixed distance exists between the bottom surface of each of the trenches and the buried insulating film.

5. The production method of a semiconductor substrate as set forth in claim 4, wherein the fixed distance between the bottom surface of each of the trenches and the buried insulating film is not less than 0.1 μm and not more than 0.5 μm.

6. A semiconductor substrate constructed by laminating a support substrate, a buried insulating film and an element formative layer in this order and having a trench in the element formative layer for separating an element, comprising: one or plural trenches formed in the element formative layer so as to connect an element formative area of the element formative layer to an outer peripheral part thereof at a part thereof at least.

7. The semiconductor substrate as set forth in claim 6, wherein the trenches are enough deep to reach the buried insulating film, and are provided intermittently while a fixed distance exists between each two trenches adjacent to each other.

8. The semiconductor substrate as set forth in claim 7, wherein the fixed distance between the trenches is not less than 0.1 μm and not more than 1 μm.

9. The semiconductor substrate as set forth in claim 6, wherein the trenches are provided continuously along the outer perimeter of the element formative area while a fixed distance exists between the bottom surface of each of the trenches and the buried insulating film.

10. The semiconductor substrate as set forth in claim 9, wherein the fixed distance between the bottom surface of each of the trenches and the buried insulating film is not less than 0.1 μm and not more than 0.5 μm.

11. A semiconductor device comprising the semiconductor substrate as set forth in one of claims 6 to 10.