The present invention relates to sensor systems, devices, and methods, and more particularly to systems, devices, and methods for sensors, sensor apparatus, and sensor apparatus systems.
In many applications, the temperature of a media, whether a solid, liquid or gas, is determined. One method is introducing a temperature sensor apparatus or probe to the medium being measured. For accuracy, close proximity of the sensor to the subject media is desired. However, this method may lead to contamination of the sensor apparatus and/or the fluid. Additional problems with harsh media or problems with the accuracy of the device used exist.
The concentration of a known compound in a media, whether fluid or otherwise, can be determined through measuring the conductivity of the fluid. Determining the conductivity of a material can also provide useful information such as the composition or presence of a particular compound in a material or irregularities in the conductive material between conductivity sensing probes. The presence, absence or variation of conductivity can also be a useful determinant of anomalies in a system.
There is a need for an apparatus that can both sense the temperature and the conductivity of a fluid or other media. There is a desire for a combination temperature and conductivity sensor that avoid contamination with the subject media and is compact. Also, there is a desire for an accurate temperature sensing device.
Additionally, there is a need for an accurate measurement apparatus to measure the temperature, conductivity, and/or other condition of a subject media while avoiding contamination between with the measurement apparatus and the subject media. There is also a need for an accurate measurement apparatus that can measure the temperature, conductivity, and/or other condition of a subject media where such subject media is contained in and/or flowing through a disposable component such that part or all of the sensor apparatus can be reused and need not be disposed of along with the disposable component.
In accordance with one aspect of the invention there is provided a sensor apparatus system for determining one or more properties of a subject fluid in a cassette, the system comprising a probe housing; a thermal sensor in said probe housing having a sensing end and a connector end; a probe tip thermally coupled to said sensing end of the thermal sensor and attached to said probe housing, the probe tip adapted for thermal coupling with an inner surface of a well installed in a cassette; and at least two leads connected to said connector end of said thermal sensor, whereby thermal energy is transferred from said well to said thermal sensor and whereby temperature information is conveyed through said leads. In various alternative embodiments, the sensing probe may further include a third lead attached to one of the probe housing, the thermal sensor, and the probe tip for permitting conductivity sensing. Alternatively, the sensing probe may further include a conductivity sensor attached to one of the probe housing, the thermal sensor, and the probe tip for permitting conductivity sensing; and a third lead attached to the conductivity sensor for transmitting conductivity information. A urethane resin may be included between said probe tip and said probe housing. The probe tip may include a flange for mating with the housing.
In various alternative embodiments of the sensor apparatus system described above, thermal epoxy may be included between said thermal sensor and said probe tip. The probe tip may be copper, steel, or a metal including at least one of silver, copper, steel, and stainless steel. In various embodiments, the housing may be plastic or metal. The housing may include a flange disposed about said probe housing, and a spring may be used in conjunction with the flange. The housing may include an integrated flexible member.
Some embodiments of this aspect of the present invention include a well of a predetermined size and shape. The well mates with the probe and the probe tip is thermal coupled to said well.
In accordance with one aspect of the present invention the well includes a hollow housing of a thermally conductive material. The housing has an outer surface and an inner surface. The inner surface is a predetermined shape so as to form a mating relationship with a sensing probe. The mating thermally couples the inner surface with a sensing probe.
Some embodiments of this aspect of the present invention include a predetermined volume of thermal grease on the inner surface of the well.
In accordance with one aspect of the present invention, method for determining temperature and conductivity of a subject media in a cassette is described. The method includes the following steps: installing at least one well in a cassette; thermally coupling a well and a sensing probe such that temperature and conductivity can be determined; transferring thermal and conductivity signals through at least 3 leads from the sensing probe; and determining temperature and conductivity using the signals.
In accordance with another aspect of the present invention, a method for detecting air in a fluid line contained in a cassette is described. The method includes the following steps: installing at least one well in a cassette; thermally coupling at least two wells located in a fluid line to sensing probes such that temperature and conductivity can be determined; transferring conductivity signals through at least 3 leads from the sensing probes; determining conductivity for each sensing probe; calculating the difference of conductivity from each sensing probe; and determining if the difference exceeds a threshold.
In accordance with another aspect of the invention there is provided apparatus comprising a fluid conduit in a cassette including a well for at least one of transmitting temperature and permitting conductivity sensing of fluid passing through the conduit, wherein the well is adapted for interconnection with a sensor.
In various alternative embodiments, the apparatus may be configured so that a portion of the well comes into contact with fluid in the conduit or so that no portion of the well comes into contact with fluid in the conduit. The fluid conduit in the cassette may include plastic tubing or metal tubing.
In various embodiments, the cassette containing the fluid line comprises a rigid body overlaid on one or more sides with a flexible diaphragm. In various embodiments the flexible diaphragm cassette includes one or more pump chambers and/or one or more value stations. In various embodiments, one or more wells are positioned on the edge of the cassette. In certain of these embodiments, one or more wells are positioned on the bottom edge of the cassette.
In various embodiments, the cassette has a rigid front and/or back plate. One or more wells may be installed in the rigid cassette. Alternatively, one or more sensor leads may be installed in the rigid cassette. In various embodiments, the rigid cassette may contain one or more pod pumps.
The cassette and the well may be integrally formed from the same material.
Alternatively, the well may be coupled to the cassette, e.g., using at least one of press fit connection, flexible tabs, adhesive, ultrasonic weld, and a retaining plate and fastener. An o-ring may be disposed between the well and the fluid conduit. The o-ring may include one of a round cross-section, a square cross-section, and an X-shaped cross-section. The well may include a groove to receive a portion of the o-ring. A portion of the well in contact with the conduit may be flexible so as to deform the conduit and may include a plurality of cuts to provide such flexibility.
In accordance with another aspect of the invention there is provided a fluid pumping apparatus comprising at least one pump and a well for at least one of transmitting temperature and permitting conductivity sensing of fluid passing through the conduit, wherein the well is adapted for interconnection with a sensor. In various alternative embodiments, the at least one pump may include at least one pod pump and may include a pair of pod pumps. The at least one pump and the well may be integrated into a cassette.
In accordance with another aspect of the invention there is provided a sensing system comprising at least one sensing probe and at least one well installed in a cassette, the well in communication with the sensing probe for at least one of thermal sensing and conductivity sensing.
These aspects of the invention are not meant to be exclusive or comprehensive and other features, aspects, and advantages of the present invention are possible and will be readily apparent to those of ordinary skill in the art when read in conjunction with the following description, the appended claims, and the accompanying drawings.
The foregoing features of the invention will be more readily understood by reference to the following detailed description, taken with reference to the accompanying drawings, wherein:
It should be noted that the foregoing figures and the elements depicted therein are not necessarily drawn to consistent scale or to any scale. Unless the context otherwise suggests, like elements are indicated by like numerals.
Definitions. As used in this description and the accompanying claims, the following terms shall have the meanings indicated, unless the context otherwise requires:
“Spheroid” means any three-dimensional shape that generally corresponds to a oval rotated about one of its principal axes, major or minor, and includes three-dimensional egg shapes, oblate and prolate spheroids, spheres, and substantially equivalent shapes.
“Hemispheroid” means any three-dimensional shape that generally corresponds to approximately half a spheroid.
“Spherical” means generally spherical.
“Hemispherical” means generally hemispherical.
“Fluid” shall mean a substance, a liquid for example, that is capable of being pumped through a flow line. Blood is a specific example of a fluid.
A “patient” includes a person or animal from whom, or to whom, fluid is pumped, whether as part of a medical treatment or otherwise.
“Subject media” is any material, including any fluid, solid, liquid or gas, that is in contact directly with a sensing probe or indirectly via thermal wells, sensor extension pins, and other such devices for transferring information regarding one or more characteristics of such subject media to one or more sensors.
Various aspects of the present invention are described below with reference to various exemplary embodiments. It should be noted that headings are included for convenience and do not limit the present invention in any way.
Various embodiments of sensors, including thermal and/or conductivity sensors, are described. Such thermal/conductivity sensors can be used in a wide variety of applications and are by no means limited to thermal/conductivity measurements of fluids or to thermal/conductivity measurements in any particular context. Additionally, various embodiments of systems, devices, and methods for sensor interface, including direct sensor contact, sensor interface through the use of a thermal well, or otherwise with various disposable and reusable components are described. Such systems, devices, and methods for sensor interface can be used with a wide variety of sensors and in a wide variety of applications. Such systems, devices, and methods for sensor interface are by no means limited to use with the various sensor embodiments or for use in any particular context.
1. Thermal Wells
In one exemplary embodiment, a thermal well is used to accommodate a sensor probe, such as a temperature sensing probe. The thermal well comes into direct contact with a subject media (e.g., a liquid such as blood or dialysate) and the sensing probe does not. Based on heat transfer dictated in large part by the thermodynamic properties of the thermal well and sensing probe construction, the sensing probe can determine the properties of the subject media without coming into direct contact with the subject media. The accuracy and efficiency of the sensor apparatus arrangement depends on many factors including, but not limited to: construction, material and geometry of both the probe and the thermal well.
Referring now to
Referring now to
In this embodiment, the thermal well 5100 is one piece with the fluid line 5108. The total area of the thermal well 5100 can vary. By varying the geometry of the thermal well 5100, the variables, including, but not limited to, the thermal conductivity characteristic of the thermal well 5100 and thus, the heat transfer between the thermal well 5100 and the sensing probe 5102 will vary. As described in more detail below, the material construction of the thermal well 5100 is another variable in the sensor apparatus.
In some embodiments, the fluid line 5108 is made from a material having a desired thermal conductivity. This material may vary depending on the purpose. The material can be anything including, but not limited to, any plastic, ceramic, metals or alloys of metals or combinations thereof.
Referring now to
Thus, multiple variables affect the various embodiments of the sensor apparatus, these variables include but are not limited to: 1) geometry of the thermal well; 2) material composition of the thermal well; 3) material composition of the sensing probe; 4) desired flow rate of the subject media; 5) length and width of the thermal well; 6) desired accuracy of the sensing probe; 7) wall thicknesses; 8) length and width of the sensing probe; 9) cost of manufacture; 10) subject media composition and characteristics including tolerance for turbulence; 11) geometry of sensing probe; and 12) desired speed of readings.
In the foregoing, various embodiments of the sensor apparatus are described. The description is intended to provide information on the affect the variables have on the sensor apparatus embodiment design. However, these are but exemplary embodiments. Many additional embodiments are contemplated and can be easily designed based on the intended use of the sensor apparatus. Thus, by changing one or more of the above mentioned partial list of variables, the embodiment of the sensor apparatus may vary.
Referring now to
Referring now to
Still referring to
The shape of the thermal well 5100 is also a variable. Any shape desired is contemplated. However, the shape of the thermal well 5100, as with the other variables, is determined in part based on the intended use of the sensor apparatus. For purposes of description, an exemplary embodiment is described herein. However, the shape in the exemplary embodiment is not meant to be limiting.
Referring now
The bottom zone 5406, which in some embodiments may not be necessary (see
Referring now to
In some embodiments, the wall thickness can be variable, i.e., the wall thickness varies in different locations of the thermal well. Although these embodiments are shown with variable thicknesses in various locations, this is for description purposes only. Various embodiments of the thermal well may incorporate varying wall thickness in response to variables, these varying wall thicknesses can be “mixed and matched” depending on the desired properties of the sensing apparatus. Thus, for example, in some embodiments, a thinner zone 5404 may be used with thinner zone 5406 and vice-versa. Or, any other combination of “thinner” and “thicker” may be used. Also, the terms used to describe the wall thicknesses are relative. Any thickness desired is contemplated. The figures shown are therefore for descriptive purposes and represent two embodiments where many more are contemplated.
Referring now to
The thermal well 5100, in practice, can be embedded into a fluid line 5108, as a separate part from the fluid line 5108. This is shown and described above with respect to
Referring first to
Referring now to
Referring now to
Referring now to
Referring now to
Referring now to
Referring now to
Referring now to
Referring now to
Referring now to
2. Sensing Probes
Various embodiments of systems, devices, and methods for sensor interface, including direct sensor contact, sensor interface through the use of a thermal well, or otherwise with various disposable and reusable components are described. Such systems, devices, and methods for sensor interface can be used with a wide variety of sensors and in a wide variety of applications. Such systems, devices, and methods for sensor interface are by no means limited to use with the various sensor embodiments or for use in any particular context.
Referring now to
In the exemplary embodiment, the tip 5802 is attached to the housing 5804 using a urethane resin or another thermal insulator in between (area 5807) the tip 5802 and the housing 5804. Urethane resin additionally adds structural support. In alternate embodiments, other fabrication and joining methods can be used to join the tip 5802 to the housing 5804.
The tip 5802 of the sensing probe 5800 is made of a thermally conductive material. The better thermally conductive materials, for example, copper, silver and steel, can be used, however, depending on the desired use for the sensing probe and the subject media; the materials may be selected to be durable and compatible for the intended use. Additionally, factors such as cost and ease of manufacture may dictate a different material selection. In one exemplary embodiment, the tip 5802 is made from copper. In other embodiments, the material can be an alloy of copper or silver, or either solid or an alloy of any thermally conductive material or element, including but not limited to metals and ceramics. However, in the exemplary embodiments, the tip 5802 is made from metal.
In the exemplary embodiment, the tip 5802 is shaped to couple thermally with a thermal well as described in the exemplary embodiment of the thermal well above. In the exemplary embodiment as well as in other embodiments, the tip 5802 may be shaped to insulate the thermal sensor 5808 from the ambient. In the exemplary embodiment, the tip 5802 is made from metal.
In alternate embodiments a non-electrically conductive material is used for the tip. These embodiments may be preferred for use where it is necessary to electrically insulate the thermal well from the probe. In another alternate embodiment, the tip 5802 may be made from any thermally conductive ceramic.
In the exemplary embodiment, the thermal sensor 5808 is located in the housing and is attached to the interior of the tip 5802 with a thermally conductive epoxy 5812. In the exemplary embodiment, the epoxy used is THERMALBOND, however, in other embodiments; any thermal grade epoxy can be used. However, in alternate embodiments, thermal grease may be used. In alternate embodiments, an epoxy or grease is not used.
The thermal sensor 5808, in the exemplary embodiment, is a thermistor. The thermistor generally is a highly accurate embodiment. However in alternate embodiments, the thermal sensor 5808 can be a thermocouple or any other temperature sensing device. The choice of thermal sensor 5808 may again relate to the intended use of the sensing apparatus.
Leads 5814 from the thermal sensor 5808 exit the back of the housing 5804. These leads 5814 attach to other equipment used for calculations. In the exemplary embodiment, a third lead 5816 from the tip 5802 is also included. This third lead 5816 is attached to the tip on a tab 5818. The third lead 5816 is attached to the tip 5802 because in this embodiment, the tip 5802 is metal and the housing is plastic. In alternate embodiments, the housing 5804 is metal, thus the third lead 5816 may be attached to the housing 5804. Thus, the tip 5802, in the exemplary embodiment, includes a tab 5818 for attachment to a lead. However, in alternate embodiments, and perhaps depending on the intended use of the sensing apparatus, the third lead 5816 may not be included. Also, in alternate embodiments where a third lead is not desired, the tip 5802 may not include the tab 5818. Referring now to
Referring now to
In the exemplary embodiment, zone 6006 includes a tab 6010. A third lead (as described with respect to
Referring now to
Referring now to
Referring now to
Referring now to both
Referring now to
Referring now to both
3. Sensor Apparatus and Sensor Apparatus Systems
3.1. Sensor Apparatus and Sensor Apparatus Systems Utilized in Connection with a Fluid Line
For purposes of description of the sensor apparatus, the sensor apparatus is described with respect to exemplary embodiments. The exemplary embodiments are shown in
Referring now to
A subject media is in contact with the outside of zone 5402 of the thermal well 5100. Thermal energy is transferred from the subject media to the thermal well 5100 and further transferred to the tip 6002 of the sensing probe 6000. Thermal energy is then conducted to the thermal sensor 6014. The thermal sensor 6014 communicates via leads 6016 with equipment that can determine the temperature of the subject media based on feedback of the thermal sensor 6014. In embodiments where conductivity sensing is also desired, lead 6018 communicates with equipment that can determine the conductivity of the subject media. With respect to determining the conductivity of the subject media, in addition to the lead 6018, a second electrical lead/contact (not shown) would also be used. The second lead could be a second sensor apparatus as shown in
Heat transfer from the tip 6002 to the thermal sensor 6014 may be improved by the use of a thermal epoxy or thermal grease 6022.
Referring now to
The sensing probe 5800 and thermal well 5100 are shown coupled and outside of a fluid line. As described above, the thermal well 5100 can be in a fluid line, a protective sleeve, disposable unit, machine, non-disposable unit, chamber, cassette or container. However, for purposes of this description of the exemplary embodiment, the thermal well 5100 is taken to be anywhere where it is used to determine thermal and/or conductive properties (
A subject media is in contact with the outside of zone 5402 of the thermal well 5100. Thermal energy is transferred from the subject media to the thermal well 5100 and further transferred to the tip 5802 of the sensing probe 5800. Thermal energy is then conducted to the thermal sensor 5808. The thermal sensor 5808 communicates via leads 5814 with equipment that can determine the temperature of the subject media based on feedback of the thermal sensor 5808. In embodiments where conductivity sensing is also desired, lead 5816 communicates with equipment that can determine the conductivity of the subject media. With respect to determining the conductivity of the subject media, in addition to the lead 5816, a second electrical lead (not shown) would also be used. The second lead could be a second sensor apparatus as shown in
Heat transfer from the tip 5802 to the thermal sensor 5808 can be improved by the use of a thermal epoxy or thermal grease 5812.
Referring now to
Referring now to
In this embodiment, the thermal well 5100 and the sensing probe 6000 may include alignment features 6702, 6704 that aid in the thermal well 5100 and sensing probe 6000 being aligned. The correct orientation of the thermal well 5100 and the sensing probe 6000 may aid in the mating of the thermal well 5100 and the sensing probe 6000 to occur. The configuration of the space 6706 provides the sensing probe 6000 with space for lateral movement. This allows the sensing probe 6000 to, if necessary; move laterally in order to align with the thermal well 5100 for mating.
The sensing probe 6000 is suspended by a spring 6700 supported by the flange 6020. The spring 6700 allow vertical movement of the sensing probe 6000 when the thermal well 5100 mates with the sensing probe 6000. The spring 6700 aids in establishing full contact of the sensing probe 6000 and the thermal well 5100.
The fluid line 5108 can be in any machine, container, device or otherwise. The fluid line 5108 contains a fluid path 5104. A subject media flows through the fluid path 5104 and the thermal well 5100, located in the fluid line 5108 such that the thermal well 5100 has ample contact with the fluid path 5104 and can sense the temperature properties and, in some embodiments, the conductive properties of the subject media. The location of the thermal well 5100 in the fluid path 5104, as described in more detail above, may be related to the desired accuracy, the subject media and other considerations.
The spring 6700 and sensing probe 6000 assembly, together with the space 6706 in the housing 6708 may aid in alignment for the mating of the sensing probe 6000 and the thermal well 5100. The mating provides the thermal contact so that the thermal well 5100 and the sensing probe 6000 are thermally coupled.
A wire 6710 is shown. The wire contains the leads. In some embodiments, there are two leads. Some of these embodiments are temperature sensing. In other embodiments, the wire contains three or more leads. Some of these embodiments are for temperature and conductivity sensing.
Referring now to
Referring now to
Referring now to
The flange, as shown and described with respect to
The sensing apparatus, in some embodiments, is used to sense conductivity. In some embodiments, this is in addition to temperature sensing. In those embodiments where both temperature and conductivity sensing is desired, the sensing probe typically includes at least three leads, where two of these leads may be used for temperature sensing and the third used for conductivity sensing.
Referring now to
Referring now to
A known volume of subject media may be used to determine conductivity. Thus, two sensors may be used and the volume of fluid between the two sensors can be determined. Conductivity sensing is done with the two electrical contacts (as described above), where one or both can be the sensor apparatus. The volume of subject media between the two contacts is known.
Conductivity sensing is done by determining the conductivity from each of the sensors and then determining the difference. If the difference is above a predetermined threshold, indicating an abnormal difference in conductivity between the first and second sensor (the designations “first” and “second” being arbitrary), then it can be inferred that air may be trapped in the subject media and a bubble detection alarm may be generated to indicate a bubble. Thus, if there is a large decrease in conductivity (and likewise, a large increase in resistance) between the first and second sensor, air could be trapped and bubble presence may be detected.
Leaks in a machine, system, device or container may be determined using the conductivity sensing. Where a sensing apparatus is in a machine, device or system, and that sensing apparatus senses conductivity, in one embodiment, a lead from the sensor apparatus (or electrical contacts) to an analyzer or computer machine may be present.
In some embodiments, the analyzer that analyzes the electrical signals between the contacts is connected to the metal of the machine, device, system or container. If the analyzer senses an electrical signal from the machine, then a fluid leak may be inferred.
3.2. Sensor Apparatus and Sensor Apparatus Systems Utilized in Connection with a Fluid Cassette
The cassette embodiments shown and described in this description include exemplary and some alternate embodiments. However, any variety of cassettes are contemplated that include similar or additional functionality. As well, the cassettes may have varying fluid paths and/or valve placement and may utilize pumping functions, valving functions, and/or other cassette functions. All of these embodiments are within the scope of the invention.
3.2.1. Flexible Membrane Fluid Cassette
Fluid cassettes, including flexible membrane fluid cassettes of the types described in U.S. Pat. Nos. 5,350,357 issued Sep. 27, 1994 and entitled Peritoneal Dialysis Systems And Methods Employing A Liquid Distribution And Pumping Cassette That Emulates Gravity Flow; 5,755,683 issued May 26, 1998 and entitled Cassette For Intravenous-Line Flow-Control System; 6,223,130 issued Apr. 24, 2001 entitled Apparatus And Method For Detection Of A Leak In A Membrane Of A Fluid Flow Control System; 6,234,997 issued May 22, 2001 entitled System And Method For Mixing And Delivering Intravenous Drugs; 6,905,479 issued Jun. 14, 2005 entitled Pumping Cartridge Having An Integrated Filter And Method For Filtering A Fluid With The Cartridge; and U.S. Pat. No. 7,544,179, issued Jun. 9, 2009, entitled System And Method For Delivering A Target Volume Of Fluid; and U.S. Pat. No. 7,632,078, issued Dec. 15, 2009, entitled Pump Cassette Bank, all of which are hereby incorporated herein by reference in their entireties, may be used in conjunction with the sensor apparatus and sensor apparatus systems described herein.
The cassette 2300 is preferably made of a rigid plastic material and the diaphragms are preferably made of flexible sheets of plastic, although many other materials may be utilized.
Exemplary cassette 2300 forms an array of interior cavities in the shapes of wells and channels. In exemplary cassette 2300, the interior cavities create multiple paths, such as fluid path 2303, to convey liquid (as
In certain embodiments, exemplary cassette 2300 may be utilized in conjunction with a device (not shown) that locally applies positive and negative pressure, including positive and negative fluid pressure of the type described in U.S. Pat. No. 5,350,357 and other of the patents and patent applications referenced above, on the diaphragm regions overlying the valve stations and pump chambers. While many different types of pump chambers and valves may be utilized with cassette of the types described herein (or, in certain embodiments, not included at all), exemplary pump chambers and valve stations of the type shown in
With further reference to
Again, with reference to
Referring now to
The length and width of the thermal well 5100 utilized with exemplary cassette 2300 can be any length and width having the desired or tolerable accuracy characteristics and which properly positions any sensor or sensing probe utilized with thermal well 5100 sufficiently in contact with the subject media contained in or flowing through fluid path 2306. The length of thermal well 5100 may impact the fluid flow of the subject media in fluid path 2303 to a certain extent. It also should be understood that the length of the thermal well 5100 may also impact the turbulence of the fluid flow. Thus, the length and width of the thermal well 5100 may be changed to have greater or lesser impact on the fluid flow and turbulence of the fluid, while mitigating the other variables.
The shape of the thermal well 5100 is also a variable. Any shape desired is contemplated. However, the shape of the thermal well 5100, as with the other variables, is determined in part based on the intended use of the sensor apparatus. For purposes of description, an exemplary embodiment is described herein. However, the shape in the exemplary embodiment is not meant to be limiting. All of the various embodiments of thermal wells described herein may be used in conjunction with cassettes, such as exemplary cassette 2300.
In certain embodiments of sensor apparatus and sensor apparatus systems used in conjunction with a flexible membrane cassette, a sensing probe may be installed directly into sensing ports 2305 and 2306 (sensing ports 2305 and 2306 as shown in
As can be seen in
Heat transfer from the tip 6002 to the thermal sensor 6014 may be improved by the use of a thermal epoxy or thermal grease 6022.
Many different embodiments of sensing apparatus may be used in connection with a thermal well installed in a flexible cassette, including embodiments similar to those shown in
While several geometries have been described, many others could be shown to achieve desired performance characteristics.
In certain embodiments, exemplary cassette 2300 may be utilized in conjunction with a device (not shown) that locally applies positive and negative pressure, including positive and negative fluid pressure of the type described in U.S. Pat. No. 5,350,357 and other of the patents and patent applications referenced above, on the diaphragm regions overlying the valve stations and pump chambers. When cassette 2300 is utilized in conjunction with a pressure applying device (not shown), cassette 2300 may be connected to the device in a number of different ways and in a number of different positions. Preferably, in certain embodiments, cassette 2300 may be loaded in a device in other than a horizontal orientation, such as a vertical or substantially vertical orientation. Placement of the cassette in a vertical or substantially vertical orientation may offer certain advantages depending on the configuration of the cassette such as to avoid air entrapment and to optimize application of positive and negative pressure, including positive and negative fluid pressure of the type described in U.S. Pat. No. 5,350,357 and other of the patents and patent applications referenced above, to the cassette.
Referring now to
In certain embodiments, the thermal well 5100 and the sensing probe 6000 may include alignment features (of the type shown in
In various embodiments, the sensing probe 6000 is configured with respect to the housing 2800 (as shown in
In other embodiments, the sensing probe may be aligned and positioned by other housing configurations. Thus, the embodiments of the housing shown herein are only some embodiments of housings in which the sensor apparatus can be used. The sensor apparatus generally depends on being located amply with respect to the subject media. The configurations that accomplish this can vary depending on the subject media and the intended use of the sensing apparatus. Further, in some embodiments where the thermal well is not used, but rather, the sensing probe is used only. The housing configurations may vary as well.
In embodiments in which cassette 2300 is loaded into a device, such as a pressure applying device, in a vertical or substantially vertical orientation, it may be preferable for sensor ports 2305 and 2306 to be positioned in the bottom edge of cassette 2300 (the bottom edge as the cassette is shown in
The sensing apparatus, in some embodiments, is used to sense conductivity of the subject media within a fluid line within a cassette. In some embodiments, this is in addition to temperature sensing. In those embodiments where both temperature and conductivity sensing is desired, the sensing probe typically includes at least three leads, where two of these leads may be used for temperature sensing and the third used for conductivity sensing.
Referring now to
Referring now to
3.2.2. Pod Pump Cassette
Cassettes other than the flexible membrane cassette described above may be used in conjunction with the sensor apparatus and sensor apparatus systems described herein. Cassette, such as cassettes of the types described in Patent Application Publication No. 2008/0058697 entitled Heat Exchange Systems, Devices and Methods which was filed on Apr. 13, 2007; Patent Application Publication No. 2008/0175719, entitled Fluid Pumping Systems, Devices and Methods which was filed on Apr. 13, 2007; Patent Application Publication No. 2007/0253463, entitled Thermal and Conductivity Sensing Systems, Devices and Methods which was filed on Apr. 13, 2007, all of which are hereby incorporated herein by reference in their entireties, may be used in conjunction with the sensor apparatus and sensor apparatus systems described herein. Additionally, cassettes, cassette assemblies, and manifolds of the types described in the following applications, may be used in conjunction with the sensor apparatus and sensor apparatus systems described herein: U.S. Patent Application Publication No. US 2009/0004033, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0253911, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0253912, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0202591, entitled PUMPING CASSETTE.
In an exemplary embodiment of other cassettes used in conjunction with the sensor apparatus and sensor apparatus systems described herein, the cassette includes a top plate, a midplate and a bottom plate. In general, the top plate includes pump chambers, and potentially alternative or additional features; the midplate includes complementary fluid lines, metering pumps, valves and potentially alternative or additional features; and the bottom plate includes actuation chambers. In general, membranes are located between the midplate and the bottom plate; however, many alternative embodiments are possible. In the exemplary embodiment, the cassettes are formed by placing the membranes in their correct locations, assembling the plates in order and laser welding the plates. The cassettes may be constructed of a variety of materials. Generally, in the various exemplary embodiment, the materials used are solid and non flexible. In the preferred embodiment, the plates are constructed of polysilicone, but in other embodiments, the cassettes are constructed of any other solid material and in exemplary embodiment, of any thermoplastic.
Referring now to
However, in alternate embodiments, a combination temperature and conductivity sensor is used of the types described above. In such alternate embodiments, thermal wells of the types described above may be installed in the cassette. In such embodiments, thermal well 5100 may be installed in the cassette by use of any of the ways described herein, including adhesive, welding (ultrasonic and otherwise), o-ring, retaining plate, and otherwise.
In alternate embodiments, there are either no sensors in the cassette or only a temperature sensor, only one or more conductivity sensors or one or more of another type of sensor.
Referring now to
Referring now to
Referring next to
Referring now to
Referring now to
Thus, in the exemplary embodiment, the sensors 1318, 1320, 1322 are used to collect data regarding fluid being pumped into the mixing chamber. Referring back to
3.3. Sensor Apparatus and Sensor Apparatus Systems Utilized in Connection with a Manifold
The thermal wells 133a, 133b provide for both thermal and electrical interconnections between the base unit 11 and the disposable unit 16. Among other things, such thermal and electrical interconnections allow the controller 49 to monitor blood temperature as the blood enters and exits the heat-exchanger bag 21 and also allow the controller 49 to take other measurements (e.g., to detect the presence of blood or air in the heat-exchanger bag 21 and to perform leak detection) as discussed below. In this embodiment, each of the thermal wells 133a, 133b is coupled so as to have a portion residing directly in the fluid path (i.e., in contact with the blood) so as to permit better transmission of blood temperature from the disposable unit 16 to the base unit 11. In lieu of, or in addition to, the thermal wells, the disposable unit 16 may include other temperature probes/sensors and interfaces by which the controller 49 can monitor blood temperature as the blood enters and exits the heat-exchanger bag 21.
While the exemplary embodiment shown in
It should be noted that one or more pumps (e.g., pump pods) may be integral with a manifold such as the manifold 130 and placed in a base unit as a single cartridge. The assembly could include pneumatic connections from the pneumatic ports (which are connected to the base unit) directly to the pump actuation chambers so that no external tubing would be needed to make the pneumatic connections to the pump pods. The assembly could additionally or alternatively include fluidic connections (e.g., from the pump outlets to the interface with the heat-exchanger bag) so that no external tubing would be needed between the pump outlets and the manifold or bag.
3.4. Sensor Apparatus and Sensor Apparatus Systems Utilized in Connection with a Sensor Manifold
In various embodiments of the inventions described herein, a sensor apparatus systems may be utilized that comprises a sensor manifold. A sensor manifold may allow subject media to be moved from one environment to another environment that is more conducive to obtaining sensor readings. For example, the cassette manifold may be contained in an area that is not subject to various types of environment conditions, such as temperature and/or humidity, which would not be preferable for sensor apparatus such as a sensing probe. Alternatively, sensing apparatus and sensing apparatus system may be delicate and may be probe to greater malfunctions than other components of a system. Separating the sensor apparatus and the sensor apparatus systems from the remainder of the system by use of a sensor manifold may allow the sensing apparatus and sensing apparatus systems to be repaired or replaced with minimal impact to the remainder of the system. Alternative, the sensor manifold may be replaced either more or less frequently than other components of the system.
With reference to
With further reference to
Again, with reference to
Referring again to
The length and width of the thermal well 5100 utilized with exemplary cassette 2300 can be any length and width having the desired or tolerable accuracy characteristics and which properly positions any sensor or sensing probe utilized with thermal well 5100 sufficiently in contact with the subject media contained in or flowing through fluid path 2306. The length of thermal well 5100 may impact the fluid flow of the subject media in fluid path 2303 to a certain extent. It also should be understood that the length of the thermal well 5100 may also impact the turbulence of the fluid flow. Thus, the length and width of the thermal well 5100 may be changed to have greater or lesser impact on the fluid flow and turbulence of the fluid, while mitigating the other variables.
The shape of the thermal well 5100 is also a variable. Any shape desired is contemplated. However, the shape of the thermal well 5100, as with the other variables, is determined in part based on the intended use of the sensor apparatus. For purposes of description, an exemplary embodiment is described herein. However, the shape in the exemplary embodiment is not meant to be limiting. All of the various embodiments of thermal wells described herein may be used in conjunction with cassettes, such as exemplary cassette 2300.
Heat transfer from the tip 6002 to the thermal sensor 6014 may be improved by the use of a thermal epoxy or thermal grease 6022.
Many different embodiments of sensing apparatus may be used in connection with a thermal well installed in a flexible cassette manifold, including embodiments similar to those shown in
In certain embodiments of sensor apparatus and sensor apparatus systems used in conjunction with a flexible membrane cassette, a sensing probe may be installed directly into sensing ports 3904, 3905, and 3906 (shown in
In embodiments in which cassette manifold 3900 is used in conjunction with a sensing probe attached to a house, it may be preferable for sensor ports 3904, 3905, and 3906 to be positioned in the bottom edge of cassette manifold 3900 (the bottom edge as the cassette manifold is shown in
While several geometries have been described, many others could be shown to achieve desired performance characteristics.
The sensing apparatus, in some embodiments, is used to sense conductivity of the subject media within a fluid line within a cassette. In some embodiments, this is in addition to temperature sensing. In those embodiments where both temperature and conductivity sensing is desired, the sensing probe typically includes at least three leads, where two of these leads may be used for temperature sensing and the third used for conductivity sensing.
Referring now to
Referring now to
For the various embodiments described herein, the cassette may be made of any material, including plastic and metal. The plastic may be flexible plastic, rigid plastic, semi-flexible plastic, semi-rigid plastic, or a combination of any of these. In some of these embodiments the cassette includes one or more thermal wells. In some embodiments one or more sensing probes and/or one or more other devices for transferring information regarding one or more characteristics of such subject media are in direct contact with the subject media. In some embodiments, the cassette is designed to hold fluid having a flow rate or pressure. In other embodiments, one or more compartments of the cassette is designed to hold mostly stagnant media or media held in the conduit even if the media has flow.
In some embodiments, the sensor apparatus may be used based on a need to separate the subject media from the sensing probe. However, in other embodiments, the sensing probe is used for temperature, conductivity, and/or other sensing directly with subject media.
In some embodiments, the thermal well may be part of a disposable portion of a device, machine, system or container. Thus, the thermal well may be in direct contact with subject media and may be the only component that is contaminated by same. In these embodiments, the sensing probe may be part of a machine, device, system or container, and be disposable or non-disposable.
With reference to
Referring again to
Referring now to
However, in alternate embodiments, a combination temperature and conductivity sensor is used of the types described above. In such alternate embodiments, thermal wells of the types described above may be installed in the cassette. In such embodiments, the thermal well may be installed in the cassette by use of any of the ways described herein, including adhesive, welding (ultrasonic and otherwise), o-ring, retaining plate, and otherwise.
Referring now to
Although the above discussion discloses various exemplary embodiments of the invention, it should be apparent that those skilled in the art can make various modifications that will achieve some of the advantages of the invention without departing from the true scope of the invention. While the principles of the invention have been described herein, it is to be understood by those skilled in the art that this description is made only by way of example and not as a limitation as to the scope of the invention. Other embodiments are contemplated within the scope of the present invention in addition to the exemplary embodiments shown and described herein. Modifications and substitutions by one of ordinary skill in the art are considered to be within the scope of the present invention.
This application is a continuation of U.S. patent application Ser. No. 11/871,821, filed Oct. 12, 2007, which claims the benefit of U.S. Provisional Patent Application Ser. No., 60/904,024, filed on Feb. 27, 2007 and U.S. Provisional Patent Application Ser. No. 60/921,314, filed on Apr. 2, 2007, which are hereby incorporated herein by reference in their entireties. This application is also a continuation-in-part of U.S. patent application Ser. No. 11/787,112, filed Apr. 13, 2007, which claims the benefit of U.S. Provisional Patent Application Ser. No., 60/904,024, filed on Feb. 27, 2007; U.S. Provisional Patent Application Ser. No. 60/921,314, filed on Apr. 2, 2007; U.S. Provisional Patent Application Ser. No. 60/835,490, filed on Aug. 4, 2006 and U.S. Provisional Patent Application Ser. No. 60/792,073, filed on Apr. 14, 2006, which are hereby incorporated herein by reference in their entireties. This application is also related to the following United States patent Applications, which are hereby incorporated herein by reference in their entireties: U.S. Patent Application Publication No. US 2009/0004033, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0253911, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0253912, entitled PUMPING CASSETTE; U.S. Patent Application Publication No. US 2008/0202591, entitled PUMPING CASSETTE; and U.S. Patent Application Publication No. US 2008/0208111, entitled PERITONEAL DIALYSIS SENSOR APPARATUS SYSTEMS, DEVICES AND METHODS.
Number | Name | Date | Kind |
---|---|---|---|
3200648 | Waggaman | Aug 1965 | A |
3508656 | Serfass et al. | Apr 1970 | A |
3656873 | Schiff | Apr 1972 | A |
RE27849 | Wortman | Dec 1973 | E |
3936729 | Winslow | Feb 1976 | A |
4161264 | Malmgren et al. | Jul 1979 | A |
4309592 | Le Boeuf | Jan 1982 | A |
4479760 | Bilstad et al. | Oct 1984 | A |
4479761 | Bilstad et al. | Oct 1984 | A |
4664891 | Cosentino et al. | May 1987 | A |
4680445 | Ogawa | Jul 1987 | A |
4927411 | Pastrone et al. | May 1990 | A |
4976162 | Kamen | Dec 1990 | A |
5062774 | Kramer et al. | Nov 1991 | A |
5088515 | Kamen | Feb 1992 | A |
5100554 | Polaschegg | Mar 1992 | A |
5110477 | Howard et al. | May 1992 | A |
5125069 | O'Boyle | Jun 1992 | A |
5206522 | Danby et al. | Apr 1993 | A |
5245693 | Ford et al. | Sep 1993 | A |
5247434 | Peterson et al. | Sep 1993 | A |
5267956 | Beuchat | Dec 1993 | A |
5274245 | Lee | Dec 1993 | A |
5278072 | Wall et al. | Jan 1994 | A |
5302093 | Owens et al. | Apr 1994 | A |
5306242 | Joyce et al. | Apr 1994 | A |
5324422 | Colleran et al. | Jun 1994 | A |
5326476 | Grogan et al. | Jul 1994 | A |
5350357 | Kamen et al. | Sep 1994 | A |
5378126 | Abrahamson et al. | Jan 1995 | A |
5381510 | Ford et al. | Jan 1995 | A |
5385540 | Abbott et al. | Jan 1995 | A |
5401342 | Vincent et al. | Mar 1995 | A |
5410255 | Bailey | Apr 1995 | A |
5421823 | Kamen et al. | Jun 1995 | A |
5429485 | Dodge | Jul 1995 | A |
5431626 | Bryant et al. | Jul 1995 | A |
5438510 | Bryant et al. | Aug 1995 | A |
5441343 | Pylkki et al. | Aug 1995 | A |
5474683 | Bryant et al. | Dec 1995 | A |
5482440 | Dennehey et al. | Jan 1996 | A |
5486286 | Peterson et al. | Jan 1996 | A |
5487827 | Peterson et al. | Jan 1996 | A |
5496273 | Pastrone et al. | Mar 1996 | A |
5542919 | Simon et al. | Aug 1996 | A |
5586438 | Fahy | Dec 1996 | A |
5593290 | Greisch et al. | Jan 1997 | A |
5628908 | Kamen et al. | May 1997 | A |
5634896 | Bryant et al. | Jun 1997 | A |
5638737 | Mattson et al. | Jun 1997 | A |
5645531 | Thompson et al. | Jul 1997 | A |
5680111 | Danby et al. | Oct 1997 | A |
5729653 | Magliochetti et al. | Mar 1998 | A |
5730720 | Sites et al. | Mar 1998 | A |
5747824 | Jung et al. | May 1998 | A |
5755683 | Houle et al. | May 1998 | A |
5875282 | Jordan et al. | Feb 1999 | A |
5899873 | Jones et al. | May 1999 | A |
5932110 | Shah et al. | Aug 1999 | A |
5938634 | Packard | Aug 1999 | A |
5947931 | Bierman | Sep 1999 | A |
5989423 | Kamen et al. | Nov 1999 | A |
6062068 | Bowling | May 2000 | A |
6070761 | Bloom et al. | Jun 2000 | A |
6101406 | Hacker et al. | Aug 2000 | A |
6136201 | Shah et al. | Oct 2000 | A |
6153102 | Kenley et al. | Nov 2000 | A |
6195887 | Danby et al. | Mar 2001 | B1 |
6210361 | Kamen et al. | Apr 2001 | B1 |
6223130 | Gray et al. | Apr 2001 | B1 |
6234997 | Kamen et al. | May 2001 | B1 |
6270673 | Belt et al. | Aug 2001 | B1 |
6302653 | Bryant et al. | Oct 2001 | B1 |
6331778 | Daily et al. | Dec 2001 | B1 |
6336911 | Westerbeck | Jan 2002 | B1 |
6347633 | Groth et al. | Feb 2002 | B1 |
6382923 | Gray | May 2002 | B1 |
6406426 | Reuss et al. | Jun 2002 | B1 |
6406452 | Westerbeck | Jun 2002 | B1 |
6413233 | Sites et al. | Jul 2002 | B1 |
6415797 | Groth et al. | Jul 2002 | B1 |
6416293 | Bouchard et al. | Jul 2002 | B1 |
6468241 | Gelfand et al. | Oct 2002 | B1 |
6485263 | Bryant et al. | Nov 2002 | B1 |
6503062 | Gray et al. | Jan 2003 | B1 |
6517510 | Stewart et al. | Feb 2003 | B1 |
6579253 | Burbank et al. | Jun 2003 | B1 |
6595944 | Balschat et al. | Jul 2003 | B2 |
6660974 | Faries, Jr. et al. | Dec 2003 | B2 |
6673314 | Burbank et al. | Jan 2004 | B1 |
6709417 | Houle et al. | Mar 2004 | B1 |
6726656 | Kamen et al. | Apr 2004 | B2 |
6743201 | Doing et al. | Jun 2004 | B1 |
6749403 | Bryant et al. | Jun 2004 | B2 |
6750468 | Malmstrom et al. | Jun 2004 | B2 |
6752172 | Lauer | Jun 2004 | B2 |
6768085 | Faries, Jr. et al. | Jul 2004 | B2 |
6775473 | Augustine et al. | Aug 2004 | B2 |
6788885 | Mitsunaga et al. | Sep 2004 | B2 |
6806947 | Ekdahl et al. | Oct 2004 | B1 |
6814547 | Childers et al. | Nov 2004 | B2 |
6826948 | Bhatti et al. | Dec 2004 | B1 |
6860866 | Graf et al. | Mar 2005 | B1 |
6877713 | Gray et al. | Apr 2005 | B1 |
6905479 | Bouchard et al. | Jun 2005 | B1 |
6929751 | Bowman, Jr. et al. | Aug 2005 | B2 |
6949079 | Westberg et al. | Sep 2005 | B1 |
7083719 | Bowman, Jr. et al. | Aug 2006 | B2 |
7122210 | Elisabettini et al. | Oct 2006 | B2 |
7147613 | Burbank et al. | Dec 2006 | B2 |
7168334 | Drott | Jan 2007 | B1 |
7175606 | Bowman, Jr. et al. | Feb 2007 | B2 |
7238164 | Childers et al. | Jul 2007 | B2 |
7300413 | Burbank et al. | Nov 2007 | B2 |
7318892 | Connell et al. | Jan 2008 | B2 |
7327273 | Hung et al. | Feb 2008 | B2 |
7410294 | Shiraki et al. | Aug 2008 | B2 |
7544179 | Distler et al. | Jun 2009 | B2 |
7632078 | Demers et al. | Dec 2009 | B2 |
7736328 | Childers et al. | Jun 2010 | B2 |
7794141 | Perry et al. | Sep 2010 | B2 |
20020056672 | Lyle et al. | May 2002 | A1 |
20020103453 | Burbank et al. | Aug 2002 | A1 |
20020150476 | Lucke et al. | Oct 2002 | A1 |
20020179595 | Nagele | Dec 2002 | A1 |
20030114795 | Faries et al. | Jun 2003 | A1 |
20030220599 | Lundtveit et al. | Nov 2003 | A1 |
20030220607 | Busby et al. | Nov 2003 | A1 |
20030229302 | Robinson et al. | Dec 2003 | A1 |
20040019313 | Childers et al. | Jan 2004 | A1 |
20040091374 | Gray | May 2004 | A1 |
20040101026 | Nitta et al. | May 2004 | A1 |
20040138607 | Burbank et al. | Jul 2004 | A1 |
20050020958 | Paolini et al. | Jan 2005 | A1 |
20050069425 | Gray et al. | Mar 2005 | A1 |
20050095154 | Tracey et al. | May 2005 | A1 |
20050126998 | Childers | Jun 2005 | A1 |
20050130332 | Ishii et al. | Jun 2005 | A1 |
20050131332 | Kelly et al. | Jun 2005 | A1 |
20050230292 | Beden et al. | Oct 2005 | A1 |
20050274658 | Rosenbaum et al. | Dec 2005 | A1 |
20060093531 | Tremoulet et al. | May 2006 | A1 |
20060184084 | Ware et al. | Aug 2006 | A1 |
20060195064 | Plahey et al. | Aug 2006 | A1 |
20060241550 | Kamen et al. | Oct 2006 | A1 |
20060251533 | Nighy et al. | Nov 2006 | A1 |
20070112297 | Plahey et al. | May 2007 | A1 |
20070135758 | Childers et al. | Jun 2007 | A1 |
20070253463 | Perry et al. | Nov 2007 | A1 |
20070255527 | Schick et al. | Nov 2007 | A1 |
20080015493 | Childers et al. | Jan 2008 | A1 |
20080033346 | Childers et al. | Feb 2008 | A1 |
20080058697 | Kamen et al. | Mar 2008 | A1 |
20080058712 | Plahey | Mar 2008 | A1 |
20080077068 | Orr | Mar 2008 | A1 |
20080097283 | Plahey | Apr 2008 | A1 |
20080105600 | Connell et al. | May 2008 | A1 |
20080125693 | Gavin et al. | May 2008 | A1 |
20080132828 | Howard | Jun 2008 | A1 |
20080161751 | Plahey et al. | Jul 2008 | A1 |
20080175719 | Tracey et al. | Jul 2008 | A1 |
20080202591 | Grant et al. | Aug 2008 | A1 |
20080203023 | Burbank et al. | Aug 2008 | A1 |
20080205481 | Faries et al. | Aug 2008 | A1 |
20080208103 | Demers et al. | Aug 2008 | A1 |
20080208111 | Kamen et al. | Aug 2008 | A1 |
20080216898 | Grant et al. | Sep 2008 | A1 |
20080240929 | Kamen et al. | Oct 2008 | A1 |
20080253427 | Kamen et al. | Oct 2008 | A1 |
20080253911 | Demers et al. | Oct 2008 | A1 |
20080253912 | Demers et al. | Oct 2008 | A1 |
20090004033 | Demers et al. | Jan 2009 | A1 |
20090007642 | Busby et al. | Jan 2009 | A1 |
20090008331 | Wilt et al. | Jan 2009 | A1 |
20090009290 | Kneip et al. | Jan 2009 | A1 |
20090012447 | Huitt et al. | Jan 2009 | A1 |
20090012448 | Childers et al. | Jan 2009 | A1 |
20090012449 | Lee et al. | Jan 2009 | A1 |
20090012450 | Shah et al. | Jan 2009 | A1 |
20090012452 | Slepicka et al. | Jan 2009 | A1 |
20090012453 | Childers et al. | Jan 2009 | A1 |
20090012454 | Childers | Jan 2009 | A1 |
20090012455 | Childers et al. | Jan 2009 | A1 |
20090012456 | Childers et al. | Jan 2009 | A1 |
20090012457 | Childers et al. | Jan 2009 | A1 |
20090012458 | Childers et al. | Jan 2009 | A1 |
20090012460 | Steck et al. | Jan 2009 | A1 |
20090012461 | Childers et al. | Jan 2009 | A1 |
20090088675 | Kelly et al. | Apr 2009 | A1 |
20090095679 | Demers et al. | Apr 2009 | A1 |
20090101566 | Crnkovich et al. | Apr 2009 | A1 |
20090107902 | Childers et al. | Apr 2009 | A1 |
20090112151 | Chapman et al. | Apr 2009 | A1 |
20090113335 | Sandoe et al. | Apr 2009 | A1 |
20090114582 | Grant et al. | May 2009 | A1 |
20090137940 | Orr | May 2009 | A1 |
20090154524 | Girelli | Jun 2009 | A1 |
20090173682 | Robinson et al. | Jul 2009 | A1 |
20090192367 | Braig et al. | Jul 2009 | A1 |
20090222119 | Plahey et al. | Sep 2009 | A1 |
20090294359 | Hopping et al. | Dec 2009 | A1 |
20100056975 | Dale et al. | Mar 2010 | A1 |
20100116740 | Fulkerson et al. | May 2010 | A1 |
20100191180 | Childers et al. | Jul 2010 | A1 |
20100191181 | Childers et al. | Jul 2010 | A1 |
20100312162 | Masaoka et al. | Dec 2010 | A1 |
20110071465 | Wang et al. | Mar 2011 | A1 |
20110092893 | Demers et al. | Apr 2011 | A1 |
20110092894 | McGill et al. | Apr 2011 | A1 |
20110098635 | Helmore et al. | Apr 2011 | A1 |
20110105877 | Wilt et al. | May 2011 | A1 |
20110106002 | Helmore et al. | May 2011 | A1 |
20110125085 | McGill et al. | May 2011 | A1 |
20110218600 | Kamen et al. | Sep 2011 | A1 |
Number | Date | Country |
---|---|---|
3 328 744 | Feb 1985 | DE |
0 687 474 | Dec 1995 | EP |
0 815 882 | Jan 1998 | EP |
0 829 266 | Mar 1998 | EP |
0 992 255 | Apr 2000 | EP |
2 131 893 | Dec 2009 | EP |
2 335 753 | Jun 2011 | EP |
2 423 241 | Aug 2006 | GB |
WO 9420158 | Sep 1994 | WO |
WO 9837801 | Sep 1998 | WO |
WO 9902206 | Jan 1999 | WO |
WO 9910028 | Mar 1999 | WO |
WO 0015278 | Mar 2000 | WO |
WO 0137895 | May 2001 | WO |
WO 03080268 | Oct 2003 | WO |
WO 2004041081 | May 2004 | WO |
WO 2005016443 | Feb 2005 | WO |
WO 2005044339 | May 2005 | WO |
WO 2006120415 | Nov 2006 | WO |
WO 2007120812 | Oct 2007 | WO |
WO 2007126360 | Nov 2007 | WO |
WO 2008106191 | Sep 2008 | WO |
WO 2008106440 | Sep 2008 | WO |
WO 2008106452 | Sep 2008 | WO |
WO 2008106538 | Sep 2008 | WO |
WO 2009006496 | Jan 2009 | WO |
WO 2009044221 | Apr 2009 | WO |
WO 2009051669 | Apr 2009 | WO |
WO 2009094179 | Jul 2009 | WO |
WO 2009094182 | Jul 2009 | WO |
WO 2009094183 | Jul 2009 | WO |
WO 2009094184 | Jul 2009 | WO |
WO 2009094185 | Jul 2009 | WO |
WO 2009094186 | Jul 2009 | WO |
Entry |
---|
International Preliminary Report on Patentability for Application No. PCT/US2008/055000 mailed Sep. 11, 2009 and claims as pending for International Application No. PCT/US2008/055000 as of Sep. 11, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2008/055168 mailed Sep. 11, 2009 and claims as pending for International Application No. PCT/US2008/055168 as of Sep. 11, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2008/055021 mailed Sep. 11, 2009 and claims as pending for International Application No. PCT/US2008/055021 as of Sep. 11, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2008/055000 mailed Aug. 1, 2008 and claims as pending for International Application No. PCT/US2008/055000 as of Aug. 1, 2008. |
International Search Report and Written Opinion for Application No. PCT/US2008/055168 mailed Nov. 10, 2008 and claims as pending for International Application No. PCT/US2008/055168 as of Nov. 10, 2008. |
International Search Report and Written Opinion for Application No. PCT/US2008/011663 mailed Feb. 20, 2009 and claims as pending for International Application No. PCT/US2008/011663 as of Feb. 20, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2008/055021 mailed Jul. 23, 2008 and claims as pending for International Application No. PCT/US2008/055021 as of Jul. 23, 2008. |
Invitation to Pay Additional Fees for Application No. PCT/US2008/055168 mailed Aug. 5, 2008 and claims as pending for International Application No. PCT/US2008/055168 as of Aug. 5, 2008. |
Notice of Allowance for U.S. Appl. No. 11/787,112, filed Apr. 13, 2007, published as US 2007-0253463 on Nov. 1, 2007, which Notice of Allowance is dated Jun. 30, 2009, and claims as allowed for U.S. Appl. No. 11/787,112 as of Jun. 30, 2009. |
Notice of Allowance for U.S. Appl. No. 11/787,112, filed Apr. 13, 2007, published as US 2007-0253463 on Nov. 1, 2007, which Notice of Allowance is dated Jan. 12, 2010, and claims as allowed for U.S. Appl. No. 11/787,112 as of Jan. 12, 2010. |
Notice of Allowance for U.S. Appl. No. 11/787,112, filed Apr. 13, 2007, published as US 2007-0253463 on Nov. 1, 2007, which Notice of Allowance is dated Apr. 29, 2010, and claims as allowed for U.S. Appl. No. 11/787,112 as of Apr. 29, 2010. |
Notice of Allowance for U.S. Appl. No. 11/787,112, filed Apr. 13, 2007, published as US 2007-0253463 on Nov. 1, 2007, which Notice of Allowance is dated Jul. 19, 2010. |
Office Action for U.S. Appl. No. 11/787,112, filed Apr. 13, 2007, published as US 2007-0253463 on Nov. 1, 2007, which Office Action is dated Nov. 21, 2008, and claims as pending for U.S. Appl. No. 11/787,112 as of Nov. 21, 2008. |
Office Action for U.S. Appl. No. 11/871,821, filed Oct. 12, 2007, published as US 2008-0240929 on Oct. 2, 2008, which Office Action is dated Sep. 23, 2009, and claims as pending for U.S. Appl. No. 11/871,821 as of Sep. 23, 2009. |
Office Action for U.S. Appl. No. 11/871,828, filed Oct. 12, 2007, published as US 2008-0208111 on Aug. 28, 2008, which Office Action is dated Mar. 11, 2010, and claims as pending for U.S. Appl. No. 11/871,828 as of Mar. 11, 2010. |
International Search Report and Written Opinion for Application No. PCT/US2008/055136 mailed Jul. 24, 2008. |
International Preliminary Report on Patentability for Application No. PCT/US2008/055136 mailed Sep. 11, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2009/000439 mailed Jun. 3, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000439 mailed Aug. 5, 2010. |
Invitation to Pay Additional Fees for Application No. PCT/US2009/000436 mailed Jun. 4, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2009/000436 mailed Sep. 25, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000436 mailed Aug. 5, 2010. |
Invitation to Pay Additional Fees for Application No. PCT/US2009/000440 mailed Jun. 4, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2009/000440 mailed Sep. 25, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000440 mailed Aug. 5, 2010. |
Invitation to Pay Additional Fees for Application No. PCT/US2009/000433 mailed Jun. 4, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2009/000433 mailed Sep. 25, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000433 mailed Aug. 5, 2010. |
Extended European Search Report for EP Application No. 10192384.5 filed Jan. 23, 2009, published as EP 2335753 on Jun. 22, 2011, which Extended European Search Report is dated May 6, 2011, and claims as pending for EP Application No. 10192384.5 as of May 6, 2011. |
International Search Report and Written Opinion for Application No. PCT/US2009/000437 mailed Jun. 3, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000437 mailed Aug. 5, 2010. |
Invitation to Pay Additional Fees for Application No. PCT/US2009/000441 mailed Jun. 24, 2009. |
International Search Report and Written Opinion for Application No. PCT/US2009/000441 mailed Oct. 2, 2009. |
International Preliminary Report on Patentability for Application No. PCT/US2009/000441 mailed Aug. 5, 2010. |
Examination Report for EP Application No. 08730761.7 filed Feb. 26, 2008, publsihed as EP 2131893 on Dec. 16, 2009, which Examination Report is dated Sep. 23, 2011, and claims as pending for EP Application No. 08730761.7 as of Sep. 23, 2011. |
Invitation to Pay Additional Fees for PCT/US2011/043196 mailed Nov. 7, 2011. |
International Search Report and Written Opinion for PCT/US2011/043196 mailed Feb. 17, 2012. |
Office Action for U.S. Appl. No. 11/787,213, filed Apr. 13, 2007, published as 2008-0058697 on Mar. 6, 2008, which Office Action is dated Mar. 18, 2010, and claims as pending for U.S. Appl. No. 11/787,213 as of Mar. 18, 2010. |
U.S. Appl. No. 11/871,787, filed Oct. 12, 2007, Demers et al. |
U.S. Appl. No. 11/871,821, filed Oct. 12, 2007, Kamen et al. |
PCT/US2008/055136, mailed Jul. 24, 2008, International Search Report and Written Opinion. |
PCT/US2008/055136, mailed Sep. 11, 2009, International Preliminary Report on Patentability. |
PCT/US2009/000439, mailed Jun. 3, 2009, International Search Report and Written Opinion. |
PCT/US2009/000439, mailed Aug. 5, 2010, International Preliminary Report on Patentability. |
PCT/US2009/000436, mailed Jun. 4, 2009, Invitation to Pay Additional Fees. |
PCT/US2009/000436, mailed Sep. 25, 2009, International Search Report and Written Opinion. |
PCT/US2009/000436, mailed Aug. 5, 2010, International Preliminary Report on Patentability. |
PCT/US2009/000440, mailed Jun. 4, 2009, Invitation to Pay Additional Fees. |
PCT/US2009/000440, mailed Sep. 25, 2009, International Search Report and Written Opinion. |
PCT/US2009/000440, mailed Aug. 5, 2010, International Preliminary Report on Patentability. |
Office Action for U.S. Appl. No. 11/871,787, filed Oct. 12, 2007, published as US 2008-0253911 on Oct. 16, 2008, which Office Action is dated Apr. 14, 2011, and claims as pending for U.S. Appl. No. 11/871,787 as of Apr. 14, 2011. |
Office Action for U.S. Appl. No. 12/038,474, filed Feb. 27, 2008, published as US 2008-0253427 on Oct. 16, 2008, which Office Action is dated Feb. 7, 2011, and claims as pending for U.S. Appl. No. 12/038,474 as of Feb. 7, 2011. |
Office Action for U.S. Appl. No. 12/038,474, filed Feb. 27, 2008, published as US 2008-0253427 on Oct. 16, 2008, which Office Action is dated Sep. 1, 2011, and claims as pending for U.S. Appl. No. 12/038,474 as of Sep. 1, 2011. |
Office Action for U.S. Appl. No. 11/871,828, filed Oct. 12, 2007, published as US 2008-0208111 on Aug. 28, 2008, which Office Action is dated Nov. 26, 2010, and claims as pending for U.S. Appl. No. 11/871,828 as of Nov. 26, 2010. |
Misra, The basics of hemodialysis equipment. Hemodial Int. Jan. 2005;9(1):30-6. |
Smith, Temperature Correction in Conductivity Measurements. Limnology and Oceanography. 1962;7(3):330-334. |
U.S. Appl. No. 13/352,250, filed Jan. 17, 2012, Demers et al. |
Notice of Allowance for U.S. Appl. No. 11/871,828, filed Oct. 12, 2007, published as US 2008-0208111 on Aug. 28, 2008, which Notice of Allowance is dated Sep. 27, 2012, and claims as allowed for U.S. Appl. No. 11/871,828 as of Sep. 27, 2012. |
Office Action for JP Application No. 2009-551818, filed Feb. 27, 2008, which Office Action is dated Oct. 16, 2012. |
Number | Date | Country | |
---|---|---|---|
20100327849 A1 | Dec 2010 | US |
Number | Date | Country | |
---|---|---|---|
60792073 | Apr 2006 | US | |
60835490 | Aug 2006 | US | |
60904024 | Feb 2007 | US | |
60921314 | Apr 2007 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11871821 | Oct 2007 | US |
Child | 11787112 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11787112 | Apr 2007 | US |
Child | 12730197 | US |