SENSOR ELEMENT STRUCTURE, SENSOR ELEMENT ARRAY, AND MANUFACTURING METHOD OF SENSOR ELEMENT ARRAY

Abstract

Even when only a few antigens exist in a specimen, a change in a dielectric constant and a change in an optical spectrum accompanied thereto in the periphery of a conductive member are made larger, so that sensing at high sensitivity can be performed. A structure including a protrusion including a dielectric material protruded on a substrate and a conductive member provided on a first surface of the protrusion, in which the maximum value of the cross-sectional area in the cross-section in parallel with a first surface of the conductive member is larger than the area of the first surface.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are schematic diagrams illustrating one example of a sensor element array of the present invention, and FIG. 1C is a schematic diagram showing one example of a conventional sensor element array.

FIGS. 2A and 2B are schematic diagrams illustrating one example of the sensor element array of the present invention.

FIGS. 3A, 3B and 3C are schematic diagrams describing the detection process of an antigen by the sensor element array of the present invention.

FIGS. 4A, 4B and 4C are schematic diagrams illustrating the sensor element array of a first example.

FIG. 5 is a schematic diagram illustrating a sensing device of first and second example.

FIG. 6 is a spectrum view representing a surface Plasmon resonance by a sensor element structure of the present invention.

FIGS. 7A, 7B and 7C are schematic diagram illustrating a sensor element array of a second example.

FIG. 8 is a schematic diagram showing a sensing device of a third example.

FIGS. 9A and 9B are schematic diagrams illustrating one example of the sensor element structure and the sensor element array of the present invention.

Claims

1. A sensor element structure, comprising: a protrusion formed on a substrate and protruded from the substrate, anda conductive member located on a first surface of the protrusion and in parallel with the substrate,wherein the maximum of cross-section of the conductive member in parallel with the first surface is larger than the area of the first surface.

2. The sensor element structure according to claim 1, wherein the conductive member comprises a thin film.

3. The sensor element structure according to claim 1, wherein the conductive member comprises metal.

4. The sensor element structure according to claim 1, wherein the conductive member comprises a semiconductor.

5. A sensor element array, wherein the sensor element structure according to claim 1 is periodically plurally disposed.

6. The sensor element array according to claim 5, wherein a plurality of conductive members isolated electrically is periodically disposed.

7. The sensor element array according to claim 6, wherein a ratio of the maximum cross-section to the surface area of the first surface is in the range of not less than 1.01 to not more than 400.

8. The sensor element array according to claim 5, wherein the conductive member is comprised of a periodical arrangement of a plurality of isolated openings.

9. The sensor element array according to claim 8, wherein a ratio of the maximum cross-section to the surface area of the first surface is in the range of not less than 1.01 to not more than 10.0.

10. A sensing device, comprising: a sensor element array according to claim 5;a reaction well accommodating the sensor element array;a specimen supplying portion and a specimen discharge portion connected to the reaction well through a channel;a light irradiating portion disposed so as to irradiate a light to the array; anda photodetector disposed so as to detect a light from the sensor element array.

11. A manufacturing method of a sensor element array, comprising the steps of: preparing a dielectric material substrate;depositing an electrically conductive material layer on the dielectric material substrate;providing a mask pattern on the electrically conductive material layer;selectively etching mask pattern on the electrically conductive material layer; andetching the mask pattern on the dielectric material substrate.