This application is a divisional application of Ser. No. 08/872,951; filed Jun. 11, 1997.
Number | Name | Date | Kind |
---|---|---|---|
3840978 | Lynch et al. | Oct 1974 | |
4023724 | Wakita et al. | May 1977 | |
4152172 | Jensen et al. | May 1979 | |
4187972 | Vella | Feb 1980 | |
4205441 | Turner | Jun 1980 | |
4768698 | Brown et al. | Sep 1988 | |
4771932 | Kim | Sep 1988 | |
4896019 | Hyun | Jan 1990 | |
4914995 | Osborn | Apr 1990 | |
4954453 | Venutolo | Sep 1990 | |
5145099 | Wood et al. | Sep 1992 | |
5216803 | Nolan et al. | Jun 1993 | |
5280668 | Fortune | Jan 1994 | |
5375318 | Catalano | Dec 1994 | |
5429460 | Campian | Jul 1995 | |
5478009 | Interrante et al. | Dec 1995 | |
5709698 | Adams et al. | Jan 1998 |
Entry |
---|
McNutt and Schink, "Chip Removal and . . . " IBM Tech. Bull., vol. 24, No. 2, pp. 1288-1289, Jul. 1981. |
Putlitz, "An Overview of . . . " The International Journal of Microcircuits and Electronic Packaging, vol. 15, No. 3, pp. 113-125, third quarter 1992. |
Metals Handbook, Ninth ed. vol. 3, pp. 421-422 and 461-462, 1980. |
Number | Date | Country | |
---|---|---|---|
Parent | 872951 | Jun 1997 |