This application is a division of 09/266,659 filed Mar. 11, 1999.
Number | Name | Date | Kind |
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3840978 | Lynch et al. | Oct 1974 | |
4023724 | Wakita et al. | May 1977 | |
4152172 | Jensen et al. | May 1979 | |
4187972 | Vella | Feb 1980 | |
4768698 | Brown et al. | Sep 1988 | |
4771932 | Kim | Sep 1988 | |
4896019 | Hyun | Jan 1990 | |
4914995 | Osborn | Apr 1990 | |
4954453 | Venutolo | Sep 1990 | |
5145099 | Wood et al. | Sep 1992 | |
5216803 | Nolan et al. | Jun 1993 | |
5280668 | Fortune | Jan 1994 | |
5375318 | Catalano | Dec 1994 | |
5429460 | Campian | Jul 1995 | |
5478009 | Interrante et al. | Dec 1995 | |
5854805 | Reid et al. | Dec 1998 |
Entry |
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R.D. McNutt and K. Schink. "Chip Removal and Chip Site Dressing" IBM Tech. Dis. Bull. pp. 1288-1289, Jul. 1981. |
Metals Handbook 9th ed. vol. 3, 1980. |
Metals Handbook, 9th ed. vol. 3, pp. 421-422, 461-462, 1980. |
K.J. Puttlitz, "An Overview of Flip-Chip Replacement Tchnology On MLC Mutlichip Modules", The International Journal of Microcircuits and Electronic Packaging, vol. 15, No. 3, pp. 113-126 (1992). |
Number | Date | Country | |
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Parent | 266659 | Mar 1999 |