This application claims priority from Italian Patent Application Number RM2009A000070 filed Feb. 17, 2009 entitled “Shield for an Integrated Circuit,” the entire specification of which is hereby incorporated by reference.
1. Field of the Disclosure
The disclosure relates in general to a electrical shield, and more particularly, to a shield for an integrated circuit.
2. Background Art
Common to electrical assemblies is the shield which is used to isolate sensitive components on a circuit board assembly (i.e., a PCB). Commonly such shields comprise a metal or metallized member which has a substantially planar top wall with a substantially planar side wall extending from each edge of the top wall. The distal ends of such walls may include feet or flanges which assist with the soldering of the shield to the underlying circuit board assembly.
Generally, the shields lack strength when the PCB is subjected to mechanical loading, such as bending loads, torsional loads and plane loads. In such situations, the shield may be compromised. A compromise to the shield may, in turn, compromise the ability of the shield to isolate sensitive components.
Additionally, where a shield can be configured with adequate strength, the shield can be utilized to further enhance the stiffness of the resulting circuit board in under mechanical loading. Such a configuration can decrease stresses and strains relative to the integrated circuit therebelow as well as in the interface between the integrated circuits and the underlying circuit board.
The disclosure is directed to a shield for an integrated circuit, and an electrical assembly having a circuit board with an integrated circuit, wherein the shield is disposed over and around the integrated circuit.
The shield comprises an upper wall and a side wall assembly. The upper wall includes a top surface, a bottom surface and a perimeter. The side wall assembly depends from the perimeter of the upper wall. The side wall assembly has a proximal end, a distal end, an inner surface and an outer surface. The distal end defines a lower edge. At least a portion of the side wall assembly includes a plurality of surface variations along a length thereof, to, in turn, define a lower edge of the side wall assembly having a non-linear configuration. Such a non-linear configuration increases the rigidity of the shield.
In an exemplary embodiment, the plurality of surface variations extend from the proximal end of the side wall to the distal end of the side wall. Additionally, the perimeter of the upper wall comprises a plurality of substantially linear edges.
In an exemplary embodiment, the non-linear configurations comprise a plurality of peaks with outwardly concave circular segments positioned therebetween in a side by side orientation. The outwardly concave circular segments may be substantially identical to each other.
In another exemplary embodiment, the non-linear configurations comprise a plurality of peaks with one of the group consisting of outwardly concave circular segments, outwardly convex circular segments, intersecting linear segments, and combinations thereof between the plurality of peaks.
In another exemplary embodiment, the upper wall includes a plurality of substantially linear side edges that collectively define the perimeter. The side wall assembly comprises a plurality of side walls depending from each of the plurality of linear side edges. Each of the side walls has a plurality of indentations along a length thereof, to, in turn, define a lower edge of the side wall assembly having a curved configuration.
In an exemplary embodiment, the side wall has a nominal thickness and the surface variations define an overall thickness of the side wall between the proximal end and the distal end. The overall thickness of the side wall increases between the proximal end and the distal end.
In an exemplary embodiment, the overall thickness of the side wall may be greatest at the lower edge thereof.
In an exemplary embodiment, the overall thickness of the side wall is at least 20% greater than the nominal thickness of the side wall.
In an exemplary embodiment, the upper wall and the side walls comprise a single integrated metal member. The side walls are bent in a downward direction from the upper wall and the surface variations formed therein.
The shield can be incorporated into an electrical assembly. The electrical assembly includes a circuit board with a first surface and a second surface. An integrated circuit is positioned on one of the first and second surfaces and coupled to the circuit board (i.e., through soldering, wire wrapping or the like). It will be understood that the upper wall and the side wall assembly of the shield together define a cavity. The shield is installed such that the integrated circuit falls within the cavity of the shield. The shield is then coupled to the underlying circuit board (i.e., again through the use of solder or the like).
The disclosure will now be described with reference to the drawings wherein:
While this invention is susceptible of embodiment in many different forms, there is shown in the drawings and described herein in detail a specific embodiment with the understanding that the present disclosure is to be considered as an exemplification and is not intended to be limited to the embodiment illustrated.
It will be understood that like or analogous elements and/or components, referred to herein, may be identified throughout the drawings by like reference characters. In addition, it will be understood that the drawings are merely schematic representations of the invention, and some of the components may have been distorted from actual scale for purposes of pictorial clarity.
Referring now to the drawings and in particular to
The shield 10 is shown in
With reference to
Depending on the particular configuration, the non-linear configuration may comprise a plurality of peaks, such as peak 66 with outwardly concave segments 68 therebetween positioned in a side by side orientation. In the embodiment shown, and while not required, each of the outwardly concave segments are substantially identical in configuration. In other embodiments, these segments may be identical or dimensionally different. In other embodiments, there may be a plurality of outwardly convex or concave segments that are curved or that result from a plurality of linear segments, or a combination of both. For illustrative purposes, a number of non-linear configurations of lower edge 44 are shown in
In the embodiments shown, the segments 35 of the perimeter 34 of the upper wall 20 are generally linear, and the side wall assembly wall itself has a nominal thickness 60. As a result, at the proximal end 40 of the side wall assembly 22, the side wall assembly is substantially planar. The surface variations 50 tend to increase in amplitude between the proximal end 40 and the distal end 42. The side wall assembly, due to the surface variations 50 increases in width, such that it defines an overall thickness 62 in addition to the wall thickness itself, or the nominal thickness 60. Generally, the overall thickness of the side wall assembly is at least 20% greater than the nominal thickness 60. It will be understood that as the overall thickness increases, the strength of the sidewall assembly and increases, to a point. In the embodiment shown, the overall thickness is almost three times that of the nominal thickness. Of course, the nominal thickness can be varied for different applications as needed without departing from the scope of the present invention.
In use, and with reference to
With reference to
It has been found that with the shield of the present configuration, the shield is stiffer and provides benefits under mechanical loading (including shock loading). Through testing, for example, a fifteen percent reduction in strain has been demonstrated. Of course, depending on the particular configuration, the reduction in strain may be greater than 15%. Additionally, not only is the shield stiffer under mechanical loading (thereby better protecting the underlying integrated circuit), but the overall circuit board, i.e., the portions of the board outside of those covered by the shield also exhibit a reduction in strain under mechanical loading. Furthermore, the configuration of the side wall assemblies of the shield of the present disclosure, additionally retain more solder paste which aids in the attachment of the shield to the underlying circuit board.
The foregoing description merely explains and illustrates the invention and the invention is not limited thereto except insofar as the appended claims are so limited, as those skilled in the art who have the disclosure before them will be able to make modifications without departing from the scope of the invention.
Number | Date | Country | Kind |
---|---|---|---|
RM2009A000070 | Feb 2009 | IT | national |