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H01L23/552

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/552Protection against radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device to reduce signal loss in a transmission line
- Patent number 12,266,603
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Pablo Jesús Gardella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising a package provided with an interconnec...
- Patent number 12,266,613
- Issue date Apr 1, 2025
- STMicroelectronics (Grenoble 2) SAS
- Claire Laporte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 12,266,614
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask with fang design
- Patent number 12,266,615
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of conductive via or trench for intra module EMI shielding
- Patent number 12,261,127
- Issue date Mar 25, 2025
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,262,519
- Issue date Mar 25, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 12,255,152
- Issue date Mar 18, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,255,151
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SIP package structure
- Patent number 12,249,582
- Issue date Mar 11, 2025
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electromagnetic interference film and met...
- Patent number 12,243,833
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
- Patent number 12,243,834
- Issue date Mar 4, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Doo Soub Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,243,852
- Issue date Mar 4, 2025
- Kioxia Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, and method of manufacturing electronic...
- Patent number 12,243,858
- Issue date Mar 4, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing integrated circuit
- Patent number 12,243,822
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,237,272
- Issue date Feb 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping Jian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 12,237,271
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,237,273
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Mitsuo Ishido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures comprising a via structure with a first pr...
- Patent number 12,237,274
- Issue date Feb 25, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zongzheng Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,232,269
- Issue date Feb 18, 2025
- Murata Manufacturing Co., Ltd.
- Takahiro Kitazume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ground fencing
- Patent number 12,230,879
- Issue date Feb 18, 2025
- Apple Inc.
- Xiaofang Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component package including th...
- Patent number 12,230,586
- Issue date Feb 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...
- Publication number 20250112101
- Publication date Apr 3, 2025
- LINTEC CORPORATION
- Reina KAINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112169
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transformer Packages Providing Magnetostriction Management
- Publication number 20250112170
- Publication date Apr 3, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Andrew Thompson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112171
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE IMMUNITY
- Publication number 20250112172
- Publication date Apr 3, 2025
- Apple Inc.
- Michael D. EATON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250105161
- Publication date Mar 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...
- Publication number 20250105194
- Publication date Mar 27, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250105092
- Publication date Mar 27, 2025
- Panasonic Automotive Systems Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE AND PACKAGING METHOD
- Publication number 20250105168
- Publication date Mar 27, 2025
- Forehope Electronic (Ningbo) Co., Ltd.
- Zhenghong HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...
- Publication number 20250096212
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrates with Stiffener Interposers
- Publication number 20250096154
- Publication date Mar 20, 2025
- Intel Corporation
- Chin Mian CHOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250096073
- Publication date Mar 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE
- Publication number 20250096150
- Publication date Mar 20, 2025
- WALTON ADVANCED ENGINEERING INC.
- Chun Jung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096153
- Publication date Mar 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096179
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Wooyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME
- Publication number 20250096081
- Publication date Mar 20, 2025
- Alpha and Omega Semiconductor International LP
- Madhur Bobde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...
- Publication number 20250096151
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...
- Publication number 20250087598
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087617
- Publication date Mar 13, 2025
- NEPES CO., LTD.
- Dong Hoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087596
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE
- Publication number 20250087597
- Publication date Mar 13, 2025
- JOINSET CO., LTD.
- Sun-Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...
- Publication number 20250079279
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power converter package with shielding against common mode conducte...
- Publication number 20250079332
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas Munding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE
- Publication number 20250070037
- Publication date Feb 27, 2025
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...
- Publication number 20250070043
- Publication date Feb 27, 2025
- Heraeus Electronics GmbH & Co. KG
- Ming Hung CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Protection against radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device to reduce signal loss in a transmission line

Integrated devices in semiconductor packages and methods of forming...

Integrated circuit package structure

Semiconductor device and method of manufacturing the same

Electronic device comprising a package provided with an interconnec...

Molded laser package with electromagnetic interference shield and m...

Selective EMI shielding using preformed mask with fang design

Semiconductor packages including antenna pattern

Application of conductive via or trench for intra module EMI shielding

Module

Semiconductor device and method of forming a slot in EMI shielding...

Antenna modules employing three-dimensional (3D) build-up on mold p...

Module

Wire bond wires for interference shielding

SIP package structure

Semiconductor device with electromagnetic interference film and met...

Semiconductor package with EMI shield and fabricating method thereof

Semiconductor package and manufacturing method thereof

Electronic component module, and method of manufacturing electronic...

Interconnect structure having conductor extending along dielectric...

Method of manufacturing integrated circuit

Electronic device and method of manufacturing the same

Module and method of manufacturing the same

Module

Semiconductor structures comprising a via structure with a first pr...

Electronic component module

System and method for ground fencing

Printed circuit board and electronic component package including th...

Magnetic core inductors in interposer

Electronic package including lead frame having multiple conductive...

Patents Applicationslast 30 patents

CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

Transformer Packages Providing Magnetostriction Management

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

SEMICONDUCTOR STRUCTURE WITH ELECTROMAGNETIC INTERFERENCE IMMUNITY

SEMICONDUCTOR DEVICE PACKAGE

METHOD FOR FORMING CONDUCTIVE BLOCKS, A SEMICONDUCTOR PACKAGE AND A...

POWER CONVERSION APPARATUS

ELECTROMAGNETIC SHIELDING STRUCTURE AND PACKAGING METHOD

POWER SUPPLY MODULE WITH HIGH HEAT DISSIPATION CAPABILITY AND HIGH...

Package Substrates with Stiffener Interposers

ELECTRONIC DEVICE

ANTI-ELECTROMAGNETIC INTERFERENCE WAFER STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING INTERPOSER AND METHOD OF MAKING THE SAME

WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...

MECHANICAL MITIGATION OF NEUTRON SEE

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) S...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

APPARATUS FOR SHIELDING ELECTROMAGNETIC WAVE OF SEMICONDUCTOR PACKAGE

Semiconductor Package

ELECTRONIC DEVICE INCLUDING A SEMICONDUCTOR PACKAGE AND A METHOD OF...

Power converter package with shielding against common mode conducte...

Semiconductor Device and Method of Forming AIP Structure to Reduce...

SEMICONDUCTOR PACKAGE

RADIO FREQUENCY MODULE

METHOD FOR PRINTING AN ELECTRICALLY CONDUCTIVE LAYER ON A SURFACE O...