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H01L23/552

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/552Protection against radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated antenna-in-package structure
- Patent number 12,211,773
- Issue date Jan 28, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump pad array on substr...
- Patent number 12,211,778
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- Hermes T. Apale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 12,211,808
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,205,862
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level design and wiring pattern for a semiconductor package
- Patent number 12,205,904
- Issue date Jan 21, 2025
- Nepes Co., Ltd.
- Yong Tae Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded enclosure comprising modular containers
- Patent number 12,207,454
- Issue date Jan 21, 2025
- MEPS Real-Time, Inc.
- Paul M. Elizondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 12,205,858
- Issue date Jan 21, 2025
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 12,205,828
- Issue date Jan 21, 2025
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,199,010
- Issue date Jan 14, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Hayata Onaga
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package comprising first molding layer and second mol...
- Patent number 12,198,997
- Issue date Jan 14, 2025
- Nepes Co., Ltd.
- Su Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including electromagnetic interference (EMI) s...
- Patent number 12,191,261
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Yao Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel gate driver package with grounded shield metal
- Patent number 12,191,259
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display apparatus
- Patent number 12,191,260
- Issue date Jan 7, 2025
- Xiamen Tianma Display Technology Co., Ltd.
- Yihua Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic component device and laminated film...
- Patent number 12,183,686
- Issue date Dec 31, 2024
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using an EMI-absorbing metal bar
- Patent number 12,183,687
- Issue date Dec 31, 2024
- STATS ChipPAC Pte. Ltd.
- KyouYong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,176,297
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display device
- Patent number 12,169,603
- Issue date Dec 17, 2024
- Beijing Boe Display Technology Co., Ltd.
- Xiao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package
- Patent number 12,165,984
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,165,988
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Min Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a heat-dissipation member and electroni...
- Patent number 12,161,019
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Byoungkyoo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250038134
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Junbae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...
- Publication number 20250038059
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038088
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING EMI SHIELDING FILM
- Publication number 20250038125
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Sanghyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20250038127
- Publication date Jan 30, 2025
- Lodestar Licensing Group, LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE
- Publication number 20250038133
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Chi-Shun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Antenna-in-Package St...
- Publication number 20250038058
- Publication date Jan 30, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Structure for Shielding Semiconductors From Ultraviolet...
- Publication number 20250038124
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chang Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING...
- Publication number 20250038126
- Publication date Jan 30, 2025
- MEDIATEK INC.
- De-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038061
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250031454
- Publication date Jan 23, 2025
- Innolux Corporation
- Ming-Jou Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
- Publication number 20250030386
- Publication date Jan 23, 2025
- Skyworks Solutions, Inc.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250029935
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Kyuil Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022809
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...
- Publication number 20250022816
- Publication date Jan 16, 2025
- MURATA MANUFACTURING CO., LTD.
- Takaya NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE VIA
- Publication number 20250022961
- Publication date Jan 16, 2025
- ZINITE CORPORATION
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20250023227
- Publication date Jan 16, 2025
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250014999
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES
- Publication number 20250014804
- Publication date Jan 9, 2025
- EMPOWER SEMICONDUCTOR, INC.
- Artin Der Minassians
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD
- Publication number 20250006578
- Publication date Jan 2, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240429177
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429183
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter, Package Structure, and Heat Dissipation Structure
- Publication number 20240421100
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xingzhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240413032
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shaopeng Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS

Protection against radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated antenna-in-package structure

Semiconductor device and method of forming bump pad array on substr...

Semiconductor device with partial EMI shielding removal using laser...

Semiconductor device and method of forming semiconductor package wi...

Semiconductor device and method of forming discrete antenna modules

Module

Wafer-level design and wiring pattern for a semiconductor package

Shielded enclosure comprising modular containers

Electronic component module and method for manufacturing electronic...

Packaging structure and fabrication method thereof

Power conversion apparatus

Semiconductor package comprising first molding layer and second mol...

Methods of forming microelectronic device assemblies and packages

Semiconductor device including electromagnetic interference (EMI) s...

Package structure and method for fabricating the same

Multi-channel gate driver package with grounded shield metal

Display panel and display apparatus

Method for producing electronic component device and laminated film...

Semiconductor device and method using an EMI-absorbing metal bar

Selective underfill assembly and method therefor

Semiconductor device package

Semiconductor package

Method for forming an electrical connection between an electronic c...

Array substrate and display device

Semiconductor device package

Semiconductor package with electromagnetic interference shielding

Semiconductor devices and methods of manufacturing semiconductor de...

Flip chip package unit comprising thermal protection film and assoc...

Electronic package and manufacturing method thereof

Display apparatus including a heat-dissipation member and electroni...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

APPARATUS AND METHOD FOR FORMING EMI SHIELDING FILM

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DIE

Semiconductor Device and Method of Forming an Antenna-in-Package St...

Methods and Structure for Shielding Semiconductors From Ultraviolet...

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

ELECTRONIC DEVICE

ELECTRONIC DEVICE

POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

RADIO FREQUENCY MODULE AND MANUFACTURING METHOD OF RADIO FREQUENCY...

ACTIVE VIA

Antenna-in-Package Devices and Methods of Making

SEMICONDUCTOR PACKAGES

EMBEDDED AND DISTRIBUTED INDUCTIVE DEVICES

PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

Power Converter, Package Structure, and Heat Dissipation Structure

INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE

EMBEDDED SEMICONDUCTOR DEVICE