Protection against radiation

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H01L23/552

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/552Protection against radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
IGBT chip integrating temperature sensor
- Patent number 12,368,082
- Issue date Jul 22, 2025
- Huawei Technologies Co., Ltd.
- Boning Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for shielding at least one quantum component
- Patent number 12,362,288
- Issue date Jul 15, 2025
- Teknologian tutkimuskeskus VTT Oy
- Janne Lehtinen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,339
- Issue date Jul 15, 2025
- Kabushiki Kaisha Toshiba
- Kenichi Agawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly, electronic device, and preparation method of...
- Patent number 12,354,967
- Issue date Jul 8, 2025
- Huawei Technologies Co., Ltd.
- Zhaozheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-role semiconductor device substrates, semiconductor device as...
- Patent number 12,354,939
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,349,327
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module carrying a plurality of electronic devices
- Patent number 12,349,302
- Issue date Jul 1, 2025
- STMicroelectronics S.r.l.
- Luca Maggi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-core transformer package with ferrite electro-magnetic interfer...
- Patent number 12,347,789
- Issue date Jul 1, 2025
- HIGH TECHNOLOGY LIMITED
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded inductor with magnetic core having mold flow enhancing channels
- Patent number 12,347,603
- Issue date Jul 1, 2025
- Texas Instruments Incorporated
- Joel Nathan Brassfield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass substrates having signal shielding for use with semiconductor...
- Patent number 12,347,788
- Issue date Jul 1, 2025
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 12,341,108
- Issue date Jun 24, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,341,109
- Issue date Jun 24, 2025
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layer shielding st...
- Patent number 12,327,799
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for selective EMI shielding using a...
- Patent number 12,327,800
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,826
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient stabilized SOI FETs
- Patent number 12,322,713
- Issue date Jun 3, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slotted absorber
- Patent number 12,317,465
- Issue date May 27, 2025
- Cisco Technology, Inc.
- Jianquan Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interference filter and electrostatic discharge / electrical surge...
- Patent number 12,316,105
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yupeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System packaging for cellular modem and transceiver system of heter...
- Patent number 12,315,853
- Issue date May 27, 2025
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with compartment shield formed from metal bars...
- Patent number 12,308,327
- Issue date May 20, 2025
- STATS ChipPAC Pte. Ltd.
- YongKook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded radio-frequency devices configured to provide shielding fo...
- Patent number 12,308,325
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Pietro Natale Alessandro Chyurlia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 12,308,326
- Issue date May 20, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOL...
- Publication number 20250239513
- Publication date Jul 24, 2025
- QUALCOMM Incorporated
- Yue LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERTER
- Publication number 20250233080
- Publication date Jul 17, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Shibo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250233081
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20250234589
- Publication date Jul 17, 2025
- Zinite Corporation
- Douglas W. BARLAGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BLOCKING ELEMENT FORMED ON A SURFACE O...
- Publication number 20250226272
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Pilsung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Molded IPD-CoW
- Publication number 20250226334
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- Kai Chong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor layout pattern including high-voltage device, and sem...
- Publication number 20250227938
- Publication date Jul 10, 2025
- UNITED MICROELECTRONICS CORP.
- Hung-Chan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250218973
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE
- Publication number 20250218974
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE
- Publication number 20250218976
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH INSULATOR VIA BETWEEN CHIPLETS
- Publication number 20250218977
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...
- Publication number 20250218975
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250218978
- Publication date Jul 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Hui-Ping JIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250218979
- Publication date Jul 3, 2025
- KIOXIA Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Selective Shielding Usin...
- Publication number 20250218985
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250201727
- Publication date Jun 19, 2025
- CXMT Corporation
- Qingchun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20250201729
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201726
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20250201730
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING
- Publication number 20250203884
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaio-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20250201728
- Publication date Jun 19, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer on Subs...
- Publication number 20250201733
- Publication date Jun 19, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT WITH INTEGRATED EMI SHIELDING
- Publication number 20250192067
- Publication date Jun 12, 2025
- APPLIED OPTOELECTRONICS, INC.
- William G. MAHONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...
- Publication number 20250194173
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS

Protection against radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

IGBT chip integrating temperature sensor

Semiconductor device and method of making double shielding layers o...

Device for shielding at least one quantum component

Semiconductor device

Chip package assembly, electronic device, and preparation method of...

Electronic component module

Multi-role semiconductor device substrates, semiconductor device as...

Module

Electronic module carrying a plurality of electronic devices

Air-core transformer package with ferrite electro-magnetic interfer...

Molded inductor with magnetic core having mold flow enhancing channels

Glass substrates having signal shielding for use with semiconductor...

Shielded semiconductor package with open terminal and methods of ma...

Compartmentalized shielding of a module utilizing self-shielded sub...

Chip package and manufacturing method thereof

Semiconductor device and method of manufacturing thereof

Semiconductor device and method of forming multi-layer shielding st...

Semiconductor device and method for selective EMI shielding using a...

Semiconductor package

Semiconductor device and manufacturing method thereof

Transient stabilized SOI FETs

Semiconductor device and method of forming microelectromechanical s...

Antenna and device configurations

Slotted absorber

Interference filter and electrostatic discharge / electrical surge...

System packaging for cellular modem and transceiver system of heter...

Electronic component module, sub-module, and method for manufacturi...

Semiconductor device with compartment shield formed from metal bars...

Shielded radio-frequency devices configured to provide shielding fo...

Electronic component with lid to manage radiation feedback

Patents Applicationslast 30 patents

CAVITY TAPE FOR PACKAGE PROTECTION

INTEGRATED DEVICE SUBSTRATE INCLUDING EMBEDDED ELECTROMAGNETIC ISOL...

POWER MODULE AND POWER CONVERTER

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

THIN FILM SEMICONDUCTOR SWITCHING DEVICE

SEMICONDUCTOR PACKAGE WITH A BLOCKING ELEMENT FORMED ON A SURFACE O...

Semiconductor Device and Method of Making a Molded IPD-CoW

Semiconductor layout pattern including high-voltage device, and sem...

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE

ELECTROMAGNETIC SHILEDING FOR LEADLESS SEMICONDUCTOR PACKAGE

COAXIAL THROUGH INSULATOR VIA BETWEEN CHIPLETS

WAFER-LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES WITH LIGHT BLO...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming Selective Shielding Usin...

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

Selective EMI Shielding Using Preformed Mask with Fang Design

Reflowable Vapor Chamber Lid

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Molded Laser Package with Electromagnetic Interference Shield and M...

METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

Semiconductor Device and Method of Forming Protective Layer on Subs...

RF COMPONENT WITH INTEGRATED EMI SHIELDING

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...