1. Field of Invention
This invention relates to a fluidic actuator and more particularly to a fluidic actuator which may be used in a semiconductor substrate processing machine.
2. Related Art
Integrated circuits are formed on circular semiconductor wafers. The formation of the integrated circuits includes numerous processing steps such as deposition of various layers, etching particular layers, and multiple bakes.
Often some of these steps take place in large semiconductor wafer processing systems that have countless moving parts and that may move the semiconductor wafers multiple times during the various processing steps. One of the steps involved may be the coating and developing of a photoresist layer on the wafer. These steps take place in what are known as “modules” within the semiconductor wafer processing systems. These modules often include wafer chucks on which the wafers are set and moveable dispense heads that deposit various solutions onto the wafers. Typically the movement, particularly the vertical movement, of the dispense heads is accomplished with one-speed pneumatic actuators.
Because of the large size of some of the components involved, considerable vibration and jolting is experienced by the modules, and the entire system, when the motion of the dispense heads, or any piece of the system that uses the one-speed pneumatic actuators, is ceased. This vibration and jolting leads to a decrease in the longevity, durability, and reliability of the various components of the semiconductor wafer processing systems. Furthermore, the vibration and jolting can cause the various solutions to leak or drip onto the wafers or other components at unwanted times, leading to reduced yields of operable integrated circuits and increased maintenance costs of the wafer processing systems.
The invention provides a fluidic actuator and a control system for the fluidic actuator. A first component of the actuator may have two openings interconnected by a passageway. A second component may be moveably housed within the passageway and divide the passageway into two portions. A fluid delivery system may be connected to the two openings. The fluid delivery system may supply a first pressure of fluid to the first portion of the passageway causing the second component to move within the passageway at a first speed. When the second component is in a selected position within the passageway, the fluid delivery system may reduce the pressure of the fluid, causing a reduction in speed of the second component. The fluid induced actuator may be used in a semiconductor substrate processing system.
The invention is described by way of example with reference to the accompanying drawings, wherein:
a-4e are cross-sectional schematic views of the fluidic actuator and a control system, illustrating operation of the fluidic actuator; and
The computer controller 16 may lie on top of the coater modules 14 and, although not shown in detail, be electrically connected to the coater modules 14 and the photoresist pump drawers 18, and include a computer with a memory for storing a set of instructions and a processor connected to the memory for executing the instructions, as is commonly understood in the art.
The base 20 may be attached to the frame 12 of the module stack 10 and be substantially cubic in shape. The wafer chuck, or substrate support, 22 may be on top of the base 20, circular in shape, and connected to the base 20 to rotate about a central axis thereof. The wafer chuck 22 may have an upper surface, which although not shown in detail, is substantially flat and in a plane to support a semiconductor wafer. Although not shown, it should be understood that the base 20 may include an electric motor, or other actuator, to rotate the wafer chuck 22 about the central axis thereof, along with a semiconductor substrate, or wafer, supported by the wafer chuck 22. The catch cup 24 may substantially be an annular, ring-shaped body attached to the top of the base 20, which tapers toward the central axis of the wafer chuck 22 the further the catch cup 24 extends from the base 20. The TEBR arm 26 may be attached to the base 20 so that it may translate transverse to the plane of the wafer chuck 22 and rotate over the wafer chuck 22.
As shown in
The photoresist supply line 30 may be attached to the dispense head 36 of the dispense arm 28 at one end thereof and, referring back to
a-4e illustrate the Z-motion actuator 40 and a Z-motion control system 42, which is not shown in
The second component 46 may be slideably connected to the first component 44 through the slot 56 and may include a piston 58 housed within the passageway 52 of the first component 44. The second component 46 may be linearly moveable between a first, lower position and a second, upper position relative to the first component 44, and likewise, the piston 58 may be moveable between a first, lower position and a second, upper position within the passageway 52 of the first component 44. A distance between the first and second positions may be between 50 and 120 millimeters, which may correspond to the height 54 of the passageway 52. The piston 58 may divide and pneumatically seal the passageway 52 into a first portion 60, below the piston 58, and a second portion 62, above the piston 58. The first opening 48 may be adjacent to the first portion 60, and the second opening 50 may be adjacent to the second portion 62. The first component 44 and the second component 46 may be pneumatically sealed so that air may not pass into or out of the passageway 52 through the slot 56. The second component 46 may be attached to the horizontal piece 34 of the dispense arm 28 at an upper end thereof
The Z-motion control system 42 may include controller hardware 64, a sensor system 66, and a pump 68. The pump 68 may be a pneumatic pump with a high pressure side and low pressure side.
The controller hardware 64 may include a printed circuit board 70, multiple valves 72, and an airflow system 74. The printed circuit board 70 may be connected to the sensor system 66 and may also be connected to the valves 72. The valves 72 may also be connected to the airflow system 74, which is in turn connected to the pump 68. The airflow system 74 may include a series of manifolds and passageways connected to the high-pressure side of the pump 68 to deliver pressurized air, or another fluid, from the pump 68 to the valves 72.
As illustrated in
Referring to
In use, although not illustrated, a semiconductor substrate, such as a wafer with a diameter of, for example 200 or 300 mm, may be placed on the wafer chuck 22 of the coater module 14. The computer controller 16 may control the Z-motion control system 42 to move the dispense arm 28.
a illustrates the second component 46 in the first position. The up high-pressure valve 76 may be opened, releasing a relatively high pressure, such as 85 psi, of air into the first portion 60 of the passageway 52. As indicated by the arrow, the pressure within the first portion 60 may be sufficiently high to exert a first upward force on the piston 58 to lift the piston 58, along with the remainder of the second component 46, which may be connected to the horizontal piece 34 of the dispense arm 28 thereby, as illustrated in
Referring to
c illustrates the piston 58 in the second position within the passageway 52 of the first component 44. When the piston 58 reaches the second position, the second component 46 may be stopped. Because of the reduced speed of the second component 46, the jolting or vibration caused by the stoppage of the second component 46 may be minimized.
Referring to
As illustrated in
The computer controller 16, along with the control system 42, may act like a switch and open the down high-pressure valve 80 connected to the second opening 50 of the first component 44 of the Z-motion actuator 40. A relatively high pressure of air, such as 85 psi, may be delivered into the second portion 62 of the passageway 52 of the first component 44 of the Z-motion actuator 40. The relatively high pressure above the piston 58 may exert a first downward force on top of piston 58 causing the piston 58, along with the second component 46, to move downwards at a first downward speed, which may or may not be the same as the first upward speed.
As illustrated in
As illustrated in
This cycle may be continually repeated as one semiconductor wafer is processed and replaced with another semiconductor wafer.
One advantage is that because the speed of the second component is reduced before stopping, the jolting or vibration experienced by the Z-motion actuator, and the entire system, is reduced. Therefore, the longevity, durability, and reliability of the system are improved. Another advantage is that because the speed of the second component can be varied, the precision of the movement of the actuator is increased and further control over the actuator is gained. A further advantage is that because of the reduced jolting and vibration, any leaking or dripping of the solution deposited by the dispense head is minimized.
Other embodiments may be used in other types of semiconductor wafer processing systems. The fluid induced actuator may also be used in other systems and machines besides those related to wafer processing. Various gases, such as nitrogen, and liquids, such as oil, and other fluids may be used to induce the movement of the actuator besides air. Separate pumps may be connected to each of the openings in the first component. Additional valves may be added to the system so that the speed of the actuator changes more than once while the actuator is being moved between the first and second positions. The pressures supplied to the first and second portions of the passageway may be varied so that a different reduction in speed, and perhaps even an increase in speed, results at some point between the first and second positions.
While certain exemplary embodiments have been described and shown in the accompanying drawings, it is to be understood that such embodiments are merely illustrative and not restrictive of the current invention, and that this invention is not restricted to the specific constructions and arrangements shown and described since modifications may occur to those ordinarily skilled in the art.
This application is a divisional of U.S. Non-Provisional application of Ser. No. 11/654,121, filed Jan. 16, 2007, now allowed, which is a divisional of U.S. Non-Provisional application Ser. No. 10/743,964, filed Dec. 22, 2003, now U.S. Pat. No. 7,351,288, which are all incorporated herein in their entireties by reference.
Number | Date | Country | |
---|---|---|---|
Parent | 11654121 | Jan 2007 | US |
Child | 12769798 | US | |
Parent | 10743964 | Dec 2003 | US |
Child | 11654121 | US |