Claims
- 1. A silver halide photosensitive material comprising a sensitizing amount of a tetra-substituted urea compound having the structural formula: ##STR5## wherein X is a middle chalcogen atom;
- each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently can represent an alkylene, cycloalkylene, carbocyclic arylene or heterocyclic arylene, alkarylene or aralkylene group; or taken together with the nitrogen atom to which they are attached, R.sub.1 and R.sub.2 or R.sub.3 and R.sub.4 can complete a 5 to 7 member heterocyclic ring; and
- each of A.sub.1, A.sub.2, A.sub.3 and A.sub.4 independently is hydrogen or represents a carboxylic, sulfinic, sulfonic, hydroxamic, mercapto, sulfonamido or primary or secondary amino nucleophilic group;
- with the proviso that at least one of A.sub.1 R.sub.1 to A.sub.4 R.sub.4 contains a nucleophilic group bonded to a urea nitrogen atom through a 2 or 3 member chain.
- 2. The photosensitive material of claim 1 wherein X is sulfur.
- 3. The photosensitive material of claim 2 wherein the nucleophilic group is a carboxylic, sulfinic, sulfonic or hydroxamic group.
- 4. The photosensitive material of claim 1 wherein the nucleophilic group is a carboxylic group.
- 5. The photosensitive material of claim 1 wherein the nucleophilic group is a primary or a secondary amino group.
- 6. The photosensitive material of claim 1 wherein the urea compound is present in an amount of from about 10.sup.-6 to about 10.sup.-2 mol thereof per mol of silver halide.
- 7. The photosensitive material of claim 6 wherein the urea compound is present in an amount of from about 10.sup.-5 to aboout 10.sup.-3 mol thereof per mol of silver halide.
- 8. The photosensitive material of claim 1 wherein the compound is: ##STR6##
- 9. The photosensitive material of claim 1 wherein the compound is: ##STR7##
- 10. The photosensitive material of claim 1 wherein the compound is: ##STR8##
- 11. The photosensitive material of claim 1 wherein the compound is: ##STR9##
- 12. The photosensitive material of claim 1 wherein the compound is: ##STR10##
- 13. In a process for the sensitization of a silver halide emulsion, the improvement which comprises adding, during preparation of said emulsion, from about 10.sup.-6 to about 10.sup.-2 mol per mol of silver halide of a compound having the structural formula: ##STR11## wherein X is a middle chalcogen atom;
- each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently can represent an alkylene, cycloalkylene, carbocyclic arylene, heterocyclic arylene, alkarylene or aralkylene group, or taken together with the nitrogen atom to which they are attached, R.sub.1 and R.sub.2 or R.sub.3 and R.sub.4 can complete a 5 to 7 member heterocyclic ring; and
- each of A.sub.1, A.sub.2, A.sub.3 and A.sub.4 independently is hydrogen or represents a carboxylic, sulfinic, sulfonic, hydroaminic, mercapto, sulfonamido or primary or secondary amino nucleophilic group;
- with the proviso that at least one of A.sub.1 R.sub.1 to A.sub.4 R.sub.4 contains a nucleophilic group bonded to a urea nitrogen atom through a 2 or 3 member chain.
- 14. The process of claim 13 wherein X is sulfur.
- 15. The process of claim 14 wherein the nucleophilic group is a carboxylic, sulfinic, sulfonic or hydroxamic group.
- 16. The process of claim 13 wherein the nucleophilic group is a carboxylic group.
- 17. The process of claim 13 wherein the nucleophilic group is a primary or a secondary amino group.
- 18. The process of claim 13 wherein the compound is present in an amount of from about 10.sup.-5 to about 10.sup.-3 mol thereof per mol of silver halide.
- 19. The process of claim 13 wherein the compound has the structural formula: ##STR12##
- 20. The process of claim 13 wherein the compound has the structural formula: ##STR13##
- 21. The process of claim 13 wherein the compound has the structural formula: ##STR14##
- 22. The process of claim 13 wherein the compound has the structural formula: ##STR15##
- 23. The process of claim 13 wherein the compound has the structural formula: ##STR16##
Parent Case Info
This is a continuation-in-part of application Ser. No. 18,388, filed Feb. 25, 1987, now abandoned.
US Referenced Citations (6)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0082408 |
Jul 1978 |
JPX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
18388 |
Feb 1987 |
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