Claims
- 1. A process for the electrodeposition of silver on a conductive copper or copper alloy substrate which comprises as a step of said process strike plating the substrate in the areas desired to be electroplated with a silver strike solution containing less than about 5 g/l of silver metal in the form of an alkali silver thiosulfate complex, free thiosulfate, and a mercaptan in an amount sufficient to prevent or retard silver deposition by immersion on the substrate and, as a further step of said process, subsequently electroplating the strike plated areas of the substrate by electrodeposition of silver thereon to the desired thickness from an electrodeposition bath solution which contains higher amounts of silver than are contained in the strike solution.
- 2. The process of claim 1 in which the mercaptan is thiolactic acid, thiomalic acid or thioglycerol.
- 3. The process of claim 1 wherein the silver strike solution is substantially free of free cyanide.
- 4. The process of electrodepositing silver on a copper or copper alloy conductive substrate which comprises as a step of said process treating the substrate with a mercaptan compound in the absence of a silver compound, and as a subsequent step of said process electroplating silver thereover with a silver cyanide plating solution containing 10 g/l of free cyanide or less or a silver thiosulfate plating solution containing 5 g/l of silver metal or less.
- 5. The process of claim 4 in which the mercaptan compound is a mercapto derivative of polyglycol or an organic acid.
- 6. The process of claim 4 in which the mercaptan compound is thiomalic acid, thioglycerol or thiolactic acid.
Parent Case Info
This is a division of application Ser. No. 937,849 filed Aug. 29, 1978 and now U.S. Pat. No. 4,247,372.
US Referenced Citations (4)
Divisions (1)
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Number |
Date |
Country |
Parent |
937849 |
Aug 1978 |
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