Patent Application
20220256743
The present disclosure relates to card cages and more particularly to a liquid cooled card cage for addressing internal and external heat sources for use with 3U printed circuit cards, and the like.
Card cages provide support for circuit cards and backplane electrical interconnection, as well as, ease of installation, repair, of circuit cards. In some cases, card cages support 3U Compact PCI (cPCI) systems. Generally, a card cage has an enclosed design to minimizes overall space requirements, but maintains functionality for cooling, EMC, and I/O access. In some cases, the rear section supports signal transition cards and backplane electrical interconnection designed to specific connector requirements.
Generally card cages are cooled by a fan mounted on the bottom with air vents in some or all of the side walls. In some cases the fans may be mounted on one or more surfaces of the card cage to create air cooled systems. In some cases, the card cage also has portions that act as a heat sink/cold plate to cool via conduction.
In certain prior systems the addition of liquid cooling has been used. In prior versions, the heat exchangers are numerous and the plumbing to and from is extensive, prone to leaks, and much harder to build, and assemble. Wherefore it is an object of the present disclosure to overcome the above-mentioned shortcomings and drawbacks associated with the conventional card cages.
One aspect of the present disclosure is a liquid cooled card cage, comprising: a top plate and a bottom plate; a single system inlet port and a single system outlet port; and a pair of side walls and at least one center wall; the top plate, the bottom plate, the pair of side walls, and the center wall are configured to form a card cage with at least four slots for accommodating 3U cards; and the card cage being configured such that each plate and each wall is in fluid communication via flow passages and all surfaces of the card cage are useable for cooling.
One embodiment of the liquid cooled card cage is wherein the flow passages are finned. In some cases, the fins of the flow passages are spaced 20 fpi.
Another embodiment of the liquid cooled card cage is wherein at least one external wall of the card cage is configured for mounting non-standard boards and heat sinking the non-standard boards to the external walls. In some cases, the liquid cooled card cage further comprises mass loading spare slots for weight such that a thermal performance of the card cage is sized to account for the spare slots having heat dissipation.
Yet another embodiment of the liquid cooled card cage is wherein orificing at one or more connection points between adjacent plates and walls maintains a pressure drop from the single inlet to the single outlet of no more than 5 psi. In some cases, the card cage does not require any tuning post fabrication. In certain embodiments, the card cage is a compact combination vacuum/dip brazed card cage with integral liquid cooling passages.
Still yet another embodiment of liquid cooled card cage is wherein the single system inlet port and the single system outlet port are both located on the top plate.
Another aspect of the present disclosure is a method of cooling circuit cards, comprising: providing a single inseparable compact combination vacuum/dip brazed card cage having a top plate, a bottom plate, a pair of side walls, and at least on center wall each with integral liquid cooling passages, wherein all surfaces of the card cage are used for cooling; flowing fluid in via a single system inlet port and out via a single system outlet port; flowing fluid from the top plate to a pair of side walls, at least one center wall, and to a bottom plate; and maintaining a pressure drop from the single inlet port to the single outlet port of no more than 5 psi; the card cage being configured to accept at least four 3U circuit cards.
One embodiment of the method of cooling circuit cards is wherein orificing at one or more connection points between adjacent plates and walls regulates system pressure.
Another embodiment of the method of cooling circuit cards further comprises connecting the card cage to test equipment and a chiller to enable subsystem testing prior to assembly into a system.
Yet another embodiment of the method of cooling circuit cards is wherein the liquid cooling passages are finned. In some cases, the fins of the liquid cooling passages are spaced at about 20 fpi.
In certain embodiments, at least one external wall of the card cage is configured for mounting non-standard boards and heat sinking the non-standard boards to the external walls. In certain embodiments, the method of cooling circuit cards further comprises mass loading spare slots for weight such that a thermal performance of the card cage is sized to account for the spare slots having heat dissipation. In some cases, the card cage does not require any tuning post fabrication.
Still yet another embodiment of the method is wherein the single system inlet port and the single system outlet port are both located on the top plate.
Yet another aspect of the present disclosure is a liquid cooled card cage, comprising: a top plate and a bottom plate; a single system inlet port and a single system outlet port; and a pair of side walls and at least one center wall; the top plate, the bottom plate, the pair of side walls, and the center wall are configured to form a card cage with at least four slots for accommodating 3U cards; and the card cage being configured such that each plate and each wall is in fluid communication via flow passages and all surfaces of the card cage are useable for cooling, wherein orificing at one or more connection points between adjacent plates and walls maintains a pressure drop from the single inlet port to the single outlet port of no more than 5 psi.
One embodiment of the liquid cooled card cage is wherein the flow passages are finned. In some cases, the fins of the flow passages are spaced 20 fpi.
Another embodiment of the liquid cooled card cage is wherein at least one external wall of the card cage is configured for mounting non-standard boards and heat sinking the non-standard boards to the external walls.
These aspects of the disclosure are not meant to be exclusive and other features, aspects, and advantages of the present disclosure will be readily apparent to those of ordinary skill in the art when read in conjunction with the following description, appended claims, and accompanying drawings.
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee. The foregoing and other objects, features, and advantages of the disclosure will be apparent from the following description of particular embodiments of the disclosure, as illustrated in the accompanying drawings in which like reference characters refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the disclosure.
One embodiment a liquid cooled card cage according to the principles of the present disclosure provides for reduced packaging complexity for waste heat management of card cage components and support elements (e.g., power supplies) that otherwise might be located elsewhere and require additional coolant lines. In one embodiment, multiple heat exchangers and liquid cooling paths are combined into a single geometry that utilizes all surfaces of the card cage for cooling. This greatly reduces coolant connections, pressure drops, and potential coolant leak points. In some cases, fewer components result in less weight and far less complex liquid cooling plumbing requirements. In certain embodiments, a single inseparable card cage is provided. In certain embodiments, the card cage is an inseparable compact combination vacuum/dip brazed card cage. This approach has application for any liquid cooled designs requiring compact packaging and high heat load dissipation of electronics.
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By using vacuum brazed plates, no leaks in the plate can be ensured as well as integrating fin stock, pin fins, flow channels, etc. Then external machining of these plates to mate with each other can be dip brazed or bolted and O-ring sealed to seal plate to plate. At that point, plates may be pinned and aligned such that no machining of the internal card guides after assembly of the card cage would be needed. Also, each plate can be leak checked, pressure tested, pressure drop tested, and tuned.
This embodiment shows a card cage having a single fluid inlet port 12 and a single fluid outlet port 14. In this embodiment, both the single fluid inlet port and the single fluid outlet port are located on the top plate. In other embodiments one of the ports may be located on a different plate (e.g., bottom). Internal liquid flow is balanced throughout the entire card cage. Fluid flows through the inlet port 12 in the top plate 2, and out an outlet on each of the card cage walls (6, 8, 10), and then out via the outlet port 14 in the top plate 2 as will be shown in more detail in
In one embodiment, the fluid inlet port 12 and the fluid outlet port 14 are NPT threaded into a heat exchanger to accept standard couplers from NPT thread to coolant line tubing. These couplers can have internal orificing for use as a choke of the flow for pressure drop balancing. For systems where multiple heat exchangers are run in parallel, balancing flow is especially important for the proper amount of cooling for the differing thermal loads within the system.
Internal to the heat exchanger depicted, balancing for flow is also needed to ensure each plate receives the proper flow for the thermal load attached to each plate. Plate to plate sealed openings (via O-rings) in this depiction, use orifice washers to balance the flow for this parallel path heat exchanger. As used herein, ports are the system inlet and system outlet for heat exchangers; openings are internal inlets/outlets from plate to plate; and chokes are orifices or reducers that vary in opening size and are used to force more or less flow into a particular plate, parallel path, or whole heat exchanger.
In certain embodiments, 3D printing may be used. However, post machining of long channels that need to be held to tight tolerances would be needed. Additionally, grown materials, specifically Aluminum blends such as AlSiMg, do not have the same thermal conductivity as pure Aluminum such as 6061 or 6063 and may be less favored for certain applications. Lastly, thermal paths are easier to implement with fin stock and flow path geometry as shown in the methods described herein.
In one embodiment, fluid flows into fluid inlet port 12 and splits fluid out to all five of the plates. There are internal paths in the top plate that feed the side plates. The first side plate also passes fluid into the bottom plate. The outlet side of the bottom plate also passes through the first plate back to the top plate. Finally, the top plate outlet path combines fluid from all the plates to exit the fluid outlet port 14. This is depicted in
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In one embodiment, a plurality of cards is combined in card cage (e.g., up to 250 watts) with four other boards (e.g., up to 230 watts) where otherwise these would have been serviced by many separate heat exchangers. This approach combines many of the control electronics into a single sub assembly that is capable of being built and tested separately prior to being integrated into a larger system. In certain embodiments, the system spreads the heat and ensures the boards do not exceed their max board mounting temperatures while occupying a smaller footprint (e.g., less that half a cubic foot) and having fewer heat exchangers and tubing/connections.
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In certain embodiments of the card cage of the present disclosure, the card cage brings four or more cooling systems into a single chassis. In some cases, the number of 3U cards in the card cage has room for expansion. That is, a current system only needed 4 of the 6 slots and dummy cards were installed in the two unused slots to maintain mass during testing. Thermal analysis was performed assuming those slots had heat loads so when the system only had four cards, the temperature rise in the card cage was even lower. If the system has six cards installed, the card cage's thermal treatment can still meet system requirements.
While various embodiments of the present invention have been described in detail, it is apparent that various modifications and alterations of those embodiments will occur to and be readily apparent to those skilled in the art. However, it is to be expressly understood that such modifications and alterations are within the scope and spirit of the present invention, as set forth in the appended claims. Further, the invention(s) described herein is capable of other embodiments and of being practiced or of being carried out in various other related ways. In addition, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having,” and variations thereof herein, is meant to encompass the items listed thereafter and equivalents thereof as well as additional items while only the terms “consisting of” and “consisting only of” are to be construed in a limitative sense.
The foregoing description of the embodiments of the present disclosure has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. Many modifications and variations are possible in light of this disclosure. It is intended that the scope of the present disclosure be limited not by this detailed description, but rather by the claims appended hereto.
A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the scope of the disclosure. Although operations are depicted in the drawings in a particular order, this should not be understood as requiring that such operations be performed in the particular order shown or in sequential order, or that all illustrated operations be performed, to achieve desirable results.
While the principles of the disclosure have been described herein, it is to be understood by those skilled in the art that this description is made only by way of example and not as a limitation as to the scope of the disclosure. Other embodiments are contemplated within the scope of the present disclosure in addition to the exemplary embodiments shown and described herein. Modifications and substitutions by one of ordinary skill in the art are considered to be within the scope of the present disclosure.
This disclosure was made with United States Government support under a classified Contract No. awarded by a classified agency. The United States Government has certain rights in this disclosure.
