Thermal management

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CPC
H05K7/20281

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20281Thermal management

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Nanosecond pulser ADC system
- Patent number 12,230,477
- Issue date Feb 18, 2025
- Eagle Harbor Technologies, Inc.
- Kenneth Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coolant distribution unit and control methods
- Patent number 12,225,688
- Issue date Feb 11, 2025
- Hoffman Enclosures Inc.
- Matthew R. Archibald
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Components for a fluid cooling system and fluid cooling system havi...
- Patent number 12,207,441
- Issue date Jan 21, 2025
- TECHN GmbH
- Nikolaus Kohl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Liquid cooling distribution in a modular electronic system
- Patent number 12,200,906
- Issue date Jan 14, 2025
- Cisco Technology, Inc.
- Rakesh Chopra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart components, systems and methods for transferring heat
- Patent number 12,200,914
- Issue date Jan 14, 2025
- Coolit Systems, Inc.
- Cameron Turner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device and cooling method
- Patent number 12,178,014
- Issue date Dec 24, 2024
- TMEIC Corporation
- Kento Kuwabara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microchannel heat sink device
- Patent number 12,178,006
- Issue date Dec 24, 2024
- Advanced Liquid Cooling Technologies Inc.
- Nan Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid-cooling heat dissipation apparatus, liquid-cooling data proc...
- Patent number 12,178,009
- Issue date Dec 24, 2024
- SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
- Fangyu Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent server-level testing of datacenter cooling systems
- Patent number 12,174,602
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Ali Heydari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for electromagnetic shielding of thermal fin packs
- Patent number 12,167,572
- Issue date Dec 10, 2024
- Microsoft Technology Licensing, LLC
- Jason A. Harrigan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for estimating flow rate in a liquid cooling sy...
- Patent number 12,146,778
- Issue date Nov 19, 2024
- Dell Products L.P.
- Richard M. Eiland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self cleaning cold plate
- Patent number 12,150,274
- Issue date Nov 19, 2024
- Dell Products L.P.
- Chun-Fa Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling system and electronic device
- Patent number 12,137,538
- Issue date Nov 5, 2024
- NEC Platforms, Ltd.
- Yasuhito Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for autonomously activable redundant cooling of...
- Patent number 12,137,536
- Issue date Nov 5, 2024
- OVH
- Alexandre Alain Jean-Pierre Meneboo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic shield of an integrated circuit package
- Patent number 12,137,545
- Issue date Nov 5, 2024
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling with shared exchanger for an information handling sy...
- Patent number 12,127,373
- Issue date Oct 22, 2024
- Dell Products L.P.
- Daniel A. Field
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling system
- Patent number 12,123,652
- Issue date Oct 22, 2024
- Cooler Master Co., Ltd.
- Yuan Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pump drive device
- Patent number 12,127,375
- Issue date Oct 22, 2024
- BEEHE ( TAICANG ) ELECTRIC CO., LTD.
- Ronghua Liu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Immersion cooling systems for electronic components
- Patent number 12,120,846
- Issue date Oct 15, 2024
- OVH
- Ali Chehade
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server memory array cooling hardware
- Patent number 12,108,566
- Issue date Oct 1, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system
- Patent number 12,108,567
- Issue date Oct 1, 2024
- BAE Systems plc
- Graham Andrew Holland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure regulator assembly for a coolant distribution unit
- Patent number 12,105,538
- Issue date Oct 1, 2024
- Hewlett Packard Enterprise Development LP
- Michael Scott
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Grant
Coolant distribution unit
- Patent number 12,101,914
- Issue date Sep 24, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of electronics using co-located microjet nozzles...
- Patent number 12,100,643
- Issue date Sep 24, 2024
- JetCool Technologies, Inc.
- Jordan Mizerak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Intelligent pod-based cooling loop with dry cooler for mobile datac...
- Patent number 12,101,907
- Issue date Sep 24, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System device aggregation in a liquid cooling environment
- Patent number 12,082,370
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron Gorius
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, apparatus, and computer program product for multiphase cool...
- Patent number 12,082,372
- Issue date Sep 3, 2024
- Nokia Technologies Oy
- Akshat Agarwal
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Image capturing apparatus comprising cooling capability based on te...
- Patent number 12,069,351
- Issue date Aug 20, 2024
- Canon Kabushiki Kaisha
- Yuki Nogawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ELECTROMAGNETIC SHIELDING OF THERMAL FIN PACKS
- Publication number 20250063694
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Jason A. HARRIGAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATACENTER LIQUID COOLING ARRANGEMENTS WITH POWER ESTIMATION AND RE...
- Publication number 20250056771
- Publication date Feb 13, 2025
- OVH
- Ali CHEHADE
- G05 - CONTROLLING REGULATING
Information Patent Application
SYSTEMS AND METHODS FOR MONITORING A FLUID LINE IN A VEHICLE
- Publication number 20250056763
- Publication date Feb 13, 2025
- GM GLOBAL TECHNOLOGY OPERATIONS LLC
- Pulasti Bandara
- B60 - VEHICLES IN GENERAL
Information Patent Application
INTEGRATED CABINET AND DATA CENTER COMPUTER ROOM
- Publication number 20250048599
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOELECTRIC COUPLER FOR SELECTIVE HEAT TRANSFER BETWEEN COOLANT...
- Publication number 20250035346
- Publication date Jan 30, 2025
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SYSTEM AND METHOD FOR ALL-IN-ONE COMPACT REFRIGERATION USING A LIQU...
- Publication number 20250040084
- Publication date Jan 30, 2025
- DELL PRODUCTS, L.P.
- Yu-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR COOLANT SYSTEM AND METHOD OF CONTROLLING THE SAME
- Publication number 20250031345
- Publication date Jan 23, 2025
- Hyundai Motor Company
- Jae Min CHAE
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL REGULATING DEVICE
- Publication number 20250024637
- Publication date Jan 16, 2025
- Northrop Grumman Systems Corporation
- ERIN MARIE THOMSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE REGULATOR ASSEMBLY FOR A COOLANT DISTRIBUTION UNIT
- Publication number 20250013253
- Publication date Jan 9, 2025
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Michael Scott
- F15 - FLUID-PRESSURE ACTUATORS HYDRAULICS OR PNEUMATICS IN GENERAL
Information Patent Application
EMERGENCY COOLING FOR LIQUID-COOLED SYSTEMS
- Publication number 20250016960
- Publication date Jan 9, 2025
- Harman Becker Automotive Systems GmbH
- Valod NOSHADI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE
- Publication number 20240427390
- Publication date Dec 26, 2024
- Raytheon Company
- Christopher M. Cosner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Novel 3D Artificial Intelligence Computer System
- Publication number 20240422941
- Publication date Dec 19, 2024
- Banqiu Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROFLUID COOLING FOR NON-UNIFORM HEATMAP
- Publication number 20240422940
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Malgorzata Jadwiga Zimon
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electric Heating Device
- Publication number 20240407132
- Publication date Dec 5, 2024
- Eberspacher catem GmbH & Co. KG
- Michael Niederer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CLEANING COLD PLATE
- Publication number 20240407133
- Publication date Dec 5, 2024
- Dell Products L.P.
- Chun-Fa Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS
- Publication number 20240397607
- Publication date Nov 28, 2024
- International Business Machines Corporation
- DUSTIN DEMETRIOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING LIQUID CIRCULATION UNIT, METHOD FOR CONTROLLING SAME, AND P...
- Publication number 20240389266
- Publication date Nov 21, 2024
- Mitsubishi Heavy Industries, Ltd.
- Minoru Matsuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite Thermostatic Cooling System
- Publication number 20240389265
- Publication date Nov 21, 2024
- Wexten Precise Industries Co., Ltd.
- Ling-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS
- Publication number 20240379328
- Publication date Nov 14, 2024
- Timothy M. Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW MANAGEMENT IN A HEAT-GENERATING DEVICE
- Publication number 20240373589
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240365506
- Publication date Oct 31, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-PHASE IMMERSION LIQUID COOLING SYSTEM, LIQUID COOLING METHOD...
- Publication number 20240365508
- Publication date Oct 31, 2024
- SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
- Qian CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM AND RELATED IMMERSION COOLING METHOD
- Publication number 20240365509
- Publication date Oct 31, 2024
- Wiwynn Corporation
- Hsien-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID COOLING CABINET EQUIPMENT AND CONTROL METHOD THEREOF
- Publication number 20240357767
- Publication date Oct 24, 2024
- Lite-On Technology Corporation
- Kun-Sung CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL SYSTEMS FOR AIR-ASSISTED AND LIQUID-COOLED ENCLOSURES
- Publication number 20240357775
- Publication date Oct 24, 2024
- Microsoft Technology Licensing, LLC
- Mark Edward Shaw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY
- Publication number 20240343962
- Publication date Oct 17, 2024
- BASF SE
- Masayuki Hirosue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLED MULTI-CHIP COLD PLATES
- Publication number 20240341057
- Publication date Oct 10, 2024
- The Research Foundation for the State University of New York
- Bahgat G. Sammakia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...
- Publication number 20240314973
- Publication date Sep 19, 2024
- Intel Corporation
- Chen ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCHEDULING JOBS FOR PROCESSOR-BASED NODES TO REGULATE COOLANT FLOW...
- Publication number 20240306352
- Publication date Sep 12, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Torsten Wilde
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM AND METHOD FOR ELECTRONIC DEVICES
- Publication number 20240292567
- Publication date Aug 29, 2024
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- FWU-BIN HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanosecond pulser ADC system

Coolant distribution unit and control methods

Components for a fluid cooling system and fluid cooling system havi...

Liquid cooling distribution in a modular electronic system

Smart components, systems and methods for transferring heat

Cooling device and cooling method

Microchannel heat sink device

Liquid-cooling heat dissipation apparatus, liquid-cooling data proc...

Intelligent server-level testing of datacenter cooling systems

Systems and methods for electromagnetic shielding of thermal fin packs

Systems and methods for estimating flow rate in a liquid cooling sy...

Self cleaning cold plate

Liquid submerged, horizontal computer server rack and systems and m...

Cooling system and electronic device

Systems and methods for autonomously activable redundant cooling of...

Electromagnetic shield of an integrated circuit package

Liquid cooling with shared exchanger for an information handling sy...

Liquid cooling system

Pump drive device

Immersion cooling systems for electronic components

Server memory array cooling hardware

Thermal management system

Pressure regulator assembly for a coolant distribution unit

Coolant distribution unit

Thermal management of electronics using co-located microjet nozzles...

Intelligent pod-based cooling loop with dry cooler for mobile datac...

Cooling system in electronics cabinet comprising thermally coupled...

System device aggregation in a liquid cooling environment

Method, apparatus, and computer program product for multiphase cool...

Image capturing apparatus comprising cooling capability based on te...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR ELECTROMAGNETIC SHIELDING OF THERMAL FIN PACKS

DATACENTER LIQUID COOLING ARRANGEMENTS WITH POWER ESTIMATION AND RE...

SYSTEMS AND METHODS FOR MONITORING A FLUID LINE IN A VEHICLE

INTEGRATED CABINET AND DATA CENTER COMPUTER ROOM

THERMOELECTRIC COUPLER FOR SELECTIVE HEAT TRANSFER BETWEEN COOLANT...

SYSTEM AND METHOD FOR ALL-IN-ONE COMPACT REFRIGERATION USING A LIQU...

VEHICULAR COOLANT SYSTEM AND METHOD OF CONTROLLING THE SAME

THERMAL REGULATING DEVICE

PRESSURE REGULATOR ASSEMBLY FOR A COOLANT DISTRIBUTION UNIT

EMERGENCY COOLING FOR LIQUID-COOLED SYSTEMS

PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE

Novel 3D Artificial Intelligence Computer System

MICROFLUID COOLING FOR NON-UNIFORM HEATMAP

Electric Heating Device

SELF CLEANING COLD PLATE

COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS

COOLING LIQUID CIRCULATION UNIT, METHOD FOR CONTROLLING SAME, AND P...

Composite Thermostatic Cooling System

PULSED VOLTAGE SOURCE FOR PLASMA PROCESSING APPLICATIONS

FLOW MANAGEMENT IN A HEAT-GENERATING DEVICE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

SINGLE-PHASE IMMERSION LIQUID COOLING SYSTEM, LIQUID COOLING METHOD...

IMMERSION COOLING SYSTEM AND RELATED IMMERSION COOLING METHOD

LIQUID COOLING CABINET EQUIPMENT AND CONTROL METHOD THEREOF

CONTROL SYSTEMS FOR AIR-ASSISTED AND LIQUID-COOLED ENCLOSURES

NOVEL USE FOR COOLANTS WITH LOW ELECTRICAL CONDUCTIVITY

LIQUID COOLED MULTI-CHIP COLD PLATES

IMPROVEMENTS TO FLOW ENHANCEMENT STRUCTURE FOR IMMERSION COOLED ELE...

SCHEDULING JOBS FOR PROCESSOR-BASED NODES TO REGULATE COOLANT FLOW...

HEAT DISSIPATION SYSTEM AND METHOD FOR ELECTRONIC DEVICES