Claims
- 1. A sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminates during the sintering thereof comprising:
- an unfired ceramic substrate laminate having nonoxide metallic lines and vias and containing a polymeric binder which upon heating depolymerizes into carbon; and
- a reducible metal oxide prior to sintering on at least one surface of the substrate laminate wherein the reducible metal oxide is chosen such that when the substrate laminate is sintered in an atmosphere which is oxidizing with respect to the carbon, the reducible metal oxide undergoes reduction to form an adherent layer of metallurgy on the surface of the multilayer ceramic substrate.
- 2. The sintering arrangement of claim 1 wherein the metallic liens and vias are copper or copper alloys.
- 3. The sintering arrangement of claim 1 wherein the reducible metal oxide is a copper oxide selected from the group consisting of CuO and Cu.sub.2 O.
- 4. The sintering arrangement of claim 1 wherein the polymeric binder comprises polyvinyl butyral resin.
- 5. The sintering arrangement of claim 1 wherein the ceramic substrate laminate comprises a ceramic selected from the group consisting of cordierite glass ceramics and spodumene glass ceramics.
- 6. A sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminates during the sintering thereof, comprising:
- an unfired multilayer ceramic substrate laminate having nonoxide metallic lines and vias and a polymeric binder which upon heating depolymerizes into carbon; and
- at least one setter tile proximate with the multilayer ceramic substrate laminate, the setter tile comprising refractory oxide and a reducible metal oxide prior to sintering wherein the reducible metal oxide is chosen such that upon sintering the ceramic substrate laminate in an atmosphere which is oxidizing with respect to the carbon, the reducible metal oxide undergoes reduction to the non-oxide form.
- 7. The sintering arrangement of claim 6 wherein the setter tile is in direct contact with the ceramic substrate laminate.
- 8. The sintering arrangement of claim 6 wherein the setter tile comprises a plurality of layers of refractory oxide having the reducible metal oxide screened thereon.
- 9. The sintering arrangement of claim 6 wherein the setter tile comprises refractory oxide having the reducible metal oxide dispersed therein.
- 10. The sintering arrangement of claim 6 wherein the setter tile is partially sintered.
- 11. The sintering arrangement of claim 6 wherein the refractory oxide is selected from the group consisting of alumina, silica, magnesia, zirconia and mixtures thereof.
- 12. The sintering arrangement of claim 1 wherein the metallic liens and vias are copper or copper alloys.
- 13. The sintering arrangement of claim 6 wherein the reducible metal oxide is a copper oxide selected from the group consisting of CuO and Cu.sub.2 O.
- 14. The sintering arrangement of claim 6 wherein the polymeric binder comprising polyvinyl butyral resin.
- 15. The sintering arrangement of claim 6 wherein the ceramic substrate laminate comprises a ceramic selected from the group consisting of cordierite glass ceramics and spodumene glass ceramics.
Parent Case Info
This is a division of application Ser. No. 07/523,949, filed May 16, 1990, now U.S. Pat. No. 5,053,361, which is a division of application Ser. No. 07/220,192 filed Jul. 18, 1988, now U.S. Pat. No. 4,971,738.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4714570 |
Nakatani et al. |
Dec 1987 |
|
5004640 |
Nakatani et al. |
Apr 1991 |
|
5021296 |
Suzuki et al. |
Jun 1991 |
|
Divisions (2)
|
Number |
Date |
Country |
Parent |
523949 |
May 1990 |
|
Parent |
220192 |
Jul 1988 |
|