Patent Application
20210075169
This invention relates to a socket for electrical component that is electrically connected to an electrical component such as a semiconductor device (hereinafter referred to as an “IC package”).
Conventionally, an IC socket in which contact pins are disposed is known as this type of a socket for electrical component. The IC socket is disposed on a wiring substrate and the IC package to be inspected is accommodated, so that the terminals of the IC package and the electrodes of the wiring substrate are electrically connected through the contact pins to conduct tests such as electrical continuity tests.
Such an IC socket is known to be of the so-called open-top type which is open above the socket and which is configured to take in and take out the IC package from above the socket. (See, e.g., Patent Document 1).
[Patent Document 1] Japanese Patent Application Publication No. 2006-127936
However, in an open-top type IC socket such as Patent Document 1, when an IC package, which, for example, extremely dislikes adherence of foreign matter on an upper surface of the package, is housed, it is inevitable that foreign matter adheres to the upper surface of the IC package because the IC socket is the open-top type.
Accordingly, the object of the present invention is to provide a socket (IC socket) for electrical component that can make it difficult to attach foreign matter to the upper surface of an electrical component (IC package) even in an open-top type.
In order to achieve such a problem, the invention of claim 1 is characterized in that a socket for electrical component comprising: a socket body having a housing portion for accommodating an electrical component; a contact pin configured to be electrically connected to a terminal of the electrical component; an operating member provided movably up and down on the socket body; and a pad which is opened and closed by an up and down movement of the operating member and covers an upper side of the electrical component in a closed state,
The socket for electrical component according to claim 2, in addition to the invention according to claim 1, is characterized in that the annular portion is a part of a guide member which is provided in the socket body for guiding the electrical component to the accommodating area.
The socket for electrical component according to claim 3, in addition to the invention according to claim 1, is characterized in that a cover unit having an arm rotatably supported on the socket body is provided, and the pad is rotatably supported on the arm.
The socket for electrical component according to claim 4, in addition to the invention according to claim 3, is characterized in that the cover unit places the pad outwardly above the accommodating area by making a back surface of the pad abut with the socket body or the operating member.
The socket for electrical component according to claim 5, in addition to the inventions according to claim 1, is characterized in that the contact pin is opened and closed by the up and down movement of the operating member.
The socket for electrical component according to claim 6, in addition to the invention according to claim 1, is characterized in that a plurality of the pads which open and close in different directions each other are provided, and the accommodating space is closed when the plurality of the pads are closed and abut the annular portion.
According to the invention of claim 1, the housing portion for an electrical component is provided with an annular portion surrounding a side periphery of an accommodating area, and an accommodating space, which is configured to be closed in the housing portion, is formed when the pad is closed and abuts the annular portion. Therefore, when the electrical component is housed in the socket for electrical component and used, it is possible to prevent foreign matter from being attached to the upper surface of the electrical component if the electrical component is accommodated in the accommodating space and the pad is closed.
According to the invention of claim 2, since the annular portion is a part of a guide member which guides the electrical component to the accommodating area, it is not necessary to construct the annular portion by further another member, so that the structure of the socket for electrical component which has the pad to form the accommodating space can be simplified.
According to the invention of claim 3, a cover unit having an arm rotatably supported on the socket body is provided, and the pad is rotatably supported on the arm. Therefore, the pad can be moved by rotating the arm with respect to the socket body, and further the pad can be rotated more than the rotation angle of the arm by rotating the pad with respect to the arm, so that it is easy to open broadly the upper part above the accommodating area provided in the housing portion.
According to the invention of claim 4, since the cover unit places the pad outwardly above the accommodating area by making a back surface of the pad abut with the socket body or the operating member, the structure for opening and closing the pad securely by rotating the pad with respect to the arm can be provided compactly. Accordingly, the cover unit that is easier to open wider above the accommodating area of the housing portion can be configured in less space above the socket body of the socket for electrical component of an open-top type.
According to the invention of claim 5, since the contact pin is opened and closed by the up and down movement of the operating member, the opening and closing of the accommodating space by the pad can be linked with the opening and closing of the contact pin. Accordingly, while the electrical component is accommodated in the accommodating space and connected to the contact pin, the accommodating space can be securely closed, and foreign matter can be securely difficult to be attached to the electrical component during use of the socket for electrical component.
According to the invention of claim 6, a plurality of the pads which open and close in different directions each other are provided, and the accommodating space is closed when the plurality of the pads are closed and abut the annular portion. Accordingly, the operating range of each pad can be reduced and the opening and closing can be easily made, and the electrical components can be easily taken in and taken out.
Hereinafter, embodiments of the present invention will be described.
The IC socket 10 as a “socket for electrical component” of this embodiment has a housing portion 14 disposed on the wiring substrate 11 and containing the IC package 12 as an “electrical component” on the upper surface as shown in
The IC package 12 of this embodiment is formed in a substantially square-shaped plate-like shape. As shown in
The IC socket 10 includes a socket body 17 which has a housing portion 14 disposed on the wiring substrate 11 to accommodate the IC package 12, as shown in
Specifically, the socket body 17 exhibits a substantially rectangular shape in planar view and, as shown in
As shown in
As shown in
The housing portion 14 of the socket body 17 is provided with an accommodating area 18 for the IC package 12. In the accommodating area 18, the upper ends of the plurality of contact pins 27 are disposed to be positioned to correspond to the solder balls 13 of the IC package 12.
In this embodiment, a guide member 26 as shown in
The guide member 26 is provided with a central opening 34 in which the upper ends of the plurality of contact pins 27 are disposed at the center. At a plurality of positions, specifically at four corners, a guide surface 35 and a placement surface 36 corresponding to the outer circumferential shape of the IC package 12 are provided.
The guide surface 35 is formed on a tapered surface so that it expands upwardly and is positioned on the placement surface 36 by guiding the four corners of the IC package 12 received from the upper portion, thereby allowing the IC package 12 to be precisely positioned in the accommodating area 18.
In this embodiment, the guide member 26 is provided with an annular portion 20 that continuously surrounds the entire periphery of the side of the accommodating area 18, and the central opening 34, the guide surface 35 and the displacement surface 36 are arrange inside the annular portion 20.
The annular portion 20 includes an annular continuous surface 37 of a continuously annular planar shape at a height spaced upper from the upper surface of the IC package 12 accommodated in the accommodating area 18.
As shown in
As shown in
As shown in
The arm 38 is biased to a rotational direction for closing the pad 21 by a biasing means not shown.
The pad 21 of the cover unit 22 is formed in a substantial plate shape such that the outer shape in the planar view is larger than the inner circumference edge of the IC package 12 accommodated in the socket body 17 and the annular continuous surface 37 of the annular portion 20.
As shown in
On the back surface, on the protruding position shifted from the center position to the center of rotation of the arm, the pad shaft 45 is provided parallel to the pad abutment surface 46. The pad shaft 45 is rotatably supported on the pad support portion 42 of the arm 38.
As shown in
As shown in
Further, as shown in
Further, as shown in
As described above, the slide plate 32 locks one of the pair of clip pieces 28 at each contact pin 27, so that the pair of clip pieces can be opened and closed as shown in
Next, an operation when the IC package 12, as shown in
First, from the state that the operation member 23 is opened and is positioned in the raised position, the operation member 23 is pushed down against the biasing force of the biasing means 51 as shown in
When the operating member 23 is further lowered, the arm 38 further rotates so that the back surface of the pad 21 abuts the pad abutment portion 53 of the operating member 23. Thereby, the pad 21 further rotates toward the direction of further opening with respect to the arm 38 and the pad 21 is disposed outside of the upper portion above the accommodating area 18 and, and the housing portion 14 takes the open state (hereinafter referred to as the “open state”).
Further, as illustrated in
In this state, as shown in
After the IC package 12 is housed in the housing portion 14, the pressure of the operating member 23 is released to raise the operating member 23. Then, as shown in
Further, by raising the operating member 23, as shown in
At this time, since the arm 38 is biased in the closing direction, the pad 21 is abutted against the annular portion 20 of the guide member 26 with sufficient pressure. When the pad 21 is closed and abuts the annular continuous surface 37, the accommodating space 47 closed for the IC package 12 is formed on the housing portion 14, and the IC package 12 is positioned in a predetermined position therein.
Then, for example, a conductive test such as a burn-in test is performed on the IC package 12.
According to the IC socket 10 of this embodiment, the housing portion 14 for the IC package 12 is provided with the annular portion 20 surrounding the side periphery of the accommodating area 18, and the accommodating space 47, which is configured to be closed in the housing portion 14, is formed when the pad 21 is closed and abuts the annular portion 14. Therefore, when the IC package is housed in the IC socket 10 and used, it is possible to prevent foreign matter from being attached to the upper surface of the IC package if the IC package is accommodated in the accommodating space 47 and the pad 21 is closed.
Furthermore, since the pad 21 is spaced upwardly from the upper surface of the IC package 12 by abutting the annular portion 20, the pad 21 does not come into direct contact with the upper surface of the IC package 12 accommodated. Therefore, even if the IC package 12 has a different configuration on the upper surface, if the IC package 12 can be accommodated in the accommodating space 47 and connected to the contact pins 27, the pad 21 can be commonly used to make it difficult to attach foreign matter regardless of the shape of the upper surface.
In a significant case, the housing portion 14 can be commonly used to accommodate the IC package 12 having a different configuration on the upper surface in the housing portion 14 and to use the IC socket 10. For example, when the specifications of the IC package 12 to be accommodated are changed, the IC socket 10 may be used without changing the configuration of the housing portion 14.
Furthermore, since the pad 21 is spaced from the upper surface of the IC package 12, it can be ensured to prevent the pad 21 from contacting the upper surface of the IC package 12. For example, even in the case that the IC package 12 would be shifted in its position, the pad 21 can be prevented from contacted.
Further, according to the IC socket 10 of this embodiment, since the annular portion 20 is a part of the guide member 26 which guides the IC package 12 to the accommodating area 18, it is not necessary to construct the annular portion 20 by further another member, so that the structure of the IC socket 10 which has the pad 21 to form the accommodating space 47 can be simplified.
Furthermore, when the guide member 26 for guiding the IC package 12 to the accommodating area 18 is precisely formed and it is the annular portion 20, the shape of the abutment portion with the pad 21 can also be precisely formed and the accommodating space 47, which can be securely closed, can be easily formed.
Further, according to the IC socket 10 of this embodiment, the cover unit 22 having the arm 38 rotatably supported on the socket body 17 is provided, and the pad 21 is rotatably supported on the arm 22. Therefore, the pad 21 can be moved by rotating the arm 38 with respect to the socket body 17, and further the pad 21 can be rotated more than the rotation angle of the arm 38 by rotating the pad 21 with respect to the arm 38, so that it is easy to open broadly the upper part above the accommodating area 18 provided in the housing portion 14.
In particular, in the IC socket 10 of this embodiment, since the cover unit 22 places the pad 21 outwardly above the accommodating area 18 by making the back surface of the pad 21 abut with the operating member 23, the structure for opening and closing the pad 21 securely by rotating the pad 21 with respect to the arm 38 can be provided compactly.
Accordingly, the cover unit 22 that is easier to open wider above the accommodating area 18 of the housing portion 14 can be configured in less space above the socket body 17 of the IC socket 10 of an open-top type.
Further, according to the IC socket 10 of this embodiment, since the contact pin 27 is opened and closed by the up and down movement of the operating member 23, the opening and closing of the accommodating space 47 by the pad 21 can be linked with the opening and closing of the contact pin 27. Accordingly, while the IC package 12 is accommodated in the accommodating space 47 and connected to the contact pin 27, the accommodating space 47 can be securely closed, and foreign matter can be securely difficult to be attached to the IC package 12 during use of the IC socket 10.
It should be noted that the above-described embodiment may be modified from time to time within the scope of the present invention. For example, in the above-described embodiment, an example of a flat or slightly concave shape of the surface of the pad 21 facing the accommodating area 18 has been described, but is not particularly limited, but may be of a corresponding shape such that the pad 21 and the annular portion 20 may close the entire periphery of the accommodating space 47.
For example, the surface of the pad 21 facing the accommodating area may have a largely concave shape and may provide a space in the recess of the surface of the pad 21 to accommodate the IC package 12. In that case, the annular portion 20 may be formed of a flat area provided on the outer periphery of the accommodating area 18.
In addition, although the above-described embodiment described an example in which the pad 21 in an open state comes into contact with the pad abutment portion 53 provided in the operating member 23, it is possible to provide a pad abutment portion in the socket body 17 to come into contact with the pad contact without any difference.
The socket body 17 of the IC socket 10 of this embodiment includes a plurality of pads 21 in different directions, specifically opposite one another, as illustrated in
In this embodiment, the tip portions of the pair of pads 21 are provided with opposing contact portions 57 at each end so that when each pad 21 is closed, the tip portions are in close contact with each other over their entire length, as illustrated in
Others are the same as that of the embodiment 1 of the invention.
Even in this IC socket 10, the operation member 23 is operated and the IC package 12 is accommodated in the accommodating area 18 in the open state as shown in
The IC socket 10 of the embodiment 2 of the invention as described above may have the same effect as that of the embodiment 1 of the invention.
Furthermore, in this embodiment, as shown in
Furthermore, the IC socket 10 according to the embodiment 2 of the present invention may be modified accordingly within the scope of the present invention. For example, as shown in
Furthermore, like the embodiment 1 of the invention, each part may be modified from time to time within the scope of the invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2017-248412 | Dec 2017 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2018/045829 | 12/13/2018 | WO | 00 |
