Contacting devices

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CPC
G01R31/2863

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GPHYSICS G01Measuring instruments G01RMEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES G01R31/00Arrangements for testing electric properties Arrangements for locating electric faults Arrangements for electrical testing characterised by what is being tested not provided for elsewhere

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G01R31/2863Contacting devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical probe, probe card, measuring system, and measuring method
- Patent number 12,360,155
- Issue date Jul 15, 2025
- Kabushiki Kaisha Nihon Micronics
- Michitaka Okuta
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for burn-in board alignment and sealing betwee...
- Patent number 12,352,809
- Issue date Jul 8, 2025
- MSV SYSTEMS & SERVICES PTE LTD
- Teck Huat Tan
- G01 - MEASURING TESTING
Information Patent Grant
Integrated test cell using active thermal interposer (ATI) with par...
- Patent number 12,345,756
- Issue date Jul 1, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Karthik Ranganathan
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in system with multiple plugs on the test board
- Patent number 12,345,758
- Issue date Jul 1, 2025
- Meritech CO., Ltd.
- Byung Gook Chang
- G01 - MEASURING TESTING
Information Patent Grant
Controlling alignment during a thermal cycle
- Patent number 12,298,328
- Issue date May 13, 2025
- AEHR Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Grant
Test board and test device including the same
- Patent number 12,287,367
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Hyung Il Kim
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component handling apparatus and electronic component te...
- Patent number 12,282,057
- Issue date Apr 22, 2025
- Advantest Corporation
- Yuya Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing semiconductor devices and a rolling contactor...
- Patent number 12,282,060
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Nee Wan Khoo
- G01 - MEASURING TESTING
Information Patent Grant
Work press assembly for test handler
- Patent number 12,241,929
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Neng Chang
- G01 - MEASURING TESTING
Information Patent Grant
Test system support component exchange system and method
- Patent number 12,235,315
- Issue date Feb 25, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Paul Ferrari
- G01 - MEASURING TESTING
Information Patent Grant
Contact pins for test sockets and test sockets comprising the same
- Patent number 12,222,367
- Issue date Feb 11, 2025
- Okins Electronics Co., Ltd.
- Jin Kook Jun
- G01 - MEASURING TESTING
Information Patent Grant
Active thermal interposer device
- Patent number 12,216,154
- Issue date Feb 4, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Grant
Test socket for semiconductor integrated circuits
- Patent number 12,210,036
- Issue date Jan 28, 2025
- Smiths Interconnect Americas, Inc.
- Peter Ursu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal array with gimbal features and enhanced thermal performance
- Patent number 12,210,056
- Issue date Jan 28, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Gregory Cruzan
- G01 - MEASURING TESTING
Information Patent Grant
Flexible sideband support systems and methods
- Patent number 12,203,978
- Issue date Jan 21, 2025
- Advantest Corporation
- Srdjan Malisic
- G01 - MEASURING TESTING
Information Patent Grant
Contact probe, probe holder and probe unit
- Patent number 12,188,977
- Issue date Jan 7, 2025
- NHK Spring Co., Ltd.
- Tsuyoshi Inuma
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing a semiconductor package
- Patent number 12,169,219
- Issue date Dec 17, 2024
- TSE CO., LTD.
- Min Cheol Kim
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing electronic devices
- Patent number 12,163,999
- Issue date Dec 10, 2024
- AEHR Test Systems
- Donald P. Richmond
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Test system, test method, and non-transitory computer readable medium
- Patent number 12,146,910
- Issue date Nov 19, 2024
- Kioxia Corporation
- Kazuhiko Nakahara
- G01 - MEASURING TESTING
Information Patent Grant
Module substrate for semiconductor module, semiconductor module and...
- Patent number 12,130,306
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Kwangkyu Bang
- G01 - MEASURING TESTING
Information Patent Grant
Test socket
- Patent number 12,105,138
- Issue date Oct 1, 2024
- Leeno Industrial Inc.
- Young taek Shin
- G01 - MEASURING TESTING
Information Patent Grant
Testing devices and method for testing semiconductor devices
- Patent number 12,092,655
- Issue date Sep 17, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders for use in semiconductor device testing, such as bur...
- Patent number 12,078,672
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- G01 - MEASURING TESTING
Information Patent Grant
Socket for electrical component
- Patent number 12,066,482
- Issue date Aug 20, 2024
- Enplas Corporation
- Yoshinobu Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test socket for performing a test on an electronic device
- Patent number 12,038,473
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiljoong Yun
- G01 - MEASURING TESTING
Information Patent Grant
Testing device and method for testing a device under test
- Patent number 12,032,001
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Jia Jin Lin
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component testing apparatus, sockets, and replacement pa...
- Patent number 12,025,654
- Issue date Jul 2, 2024
- Advantest Corporation
- Natsuki Shiota
- G01 - MEASURING TESTING
Information Patent Grant
Test socket having an automated lid
- Patent number 12,007,411
- Issue date Jun 11, 2024
- Teradyne, Inc.
- John P. Toscano
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in board seating
- Patent number 12,007,434
- Issue date Jun 11, 2024
- Micro Control Company
- Aidan Michael Fawcett
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in board and burn-in apparatus
- Patent number 11,994,552
- Issue date May 28, 2024
- Advantest Corporation
- Hiroaki Takeuchi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD...
- Publication number 20250224423
- Publication date Jul 10, 2025
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING
Information Patent Application
CHIP COOLING MODULE AND CHIP TESTING APPARATUS HAVING SAME
- Publication number 20250216445
- Publication date Jul 3, 2025
- CHROMA ATE INC.
- Yu-Wei Chuang
- G01 - MEASURING TESTING
Information Patent Application
SOCKET ASSEMBLY AND ELECTRONIC COMPONENT TEST APPARATUS
- Publication number 20250216442
- Publication date Jul 3, 2025
- Advantest Corporation
- Natsuki Shiota
- G01 - MEASURING TESTING
Information Patent Application
SOCKET SYSTEMS WITH INTEGRATED PARTIALLY-CONDUCTIVE SUBSTRATES AND...
- Publication number 20250208192
- Publication date Jun 26, 2025
- Chiplytics Inc.
- Matthew Skeels
- G01 - MEASURING TESTING
Information Patent Application
WORK PRESS ASSEMBLY FOR TEST HANDLER
- Publication number 20250199059
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Neng Chang
- G01 - MEASURING TESTING
Information Patent Application
INTERPOSER PACKAGE, MOUNTING METHOD, AND BURN-IN TEST APPARATUS
- Publication number 20250199060
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Masaki YOSHIMURA
- G01 - MEASURING TESTING
Information Patent Application
TEST ARRANGEMENT FOR OVER-THE-AIR TESTING AN ANGLED DEVICE UNDER TE...
- Publication number 20250172600
- Publication date May 29, 2025
- Advantest Corporation
- José MOREIRA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TEST TRAY FOR SEMICONDUCTOR DEVICES AND TEST APPARATUS USING THE SAME
- Publication number 20250164552
- Publication date May 22, 2025
- ATECO INC.
- Taek Seon LEE
- G01 - MEASURING TESTING
Information Patent Application
MULTI-WAFER INSPECTION SYSTEM
- Publication number 20250155492
- Publication date May 15, 2025
- SEMICS INC.
- Ki Tack PARK
- G01 - MEASURING TESTING
Information Patent Application
LIQUID COOLED TEST SYSTEM FOR TESTING SEMICONDUCTOR INTEGRATED CIRC...
- Publication number 20250138085
- Publication date May 1, 2025
- Antares Advanced Test Technologies (Suzhou) Limited
- Jiachun Zhou
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR BURN-IN MACHINE COOLING SYSTEM
- Publication number 20250130275
- Publication date Apr 24, 2025
- Micro Control Company
- Aidan Michael Fawcett
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR BURN-IN MACHINE POWER REGULATOR HAVING MULTIPLE POWER...
- Publication number 20250132754
- Publication date Apr 24, 2025
- Micro Control Company
- Kevin Roland Deters
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR BURN-IN BOARD
- Publication number 20250130274
- Publication date Apr 24, 2025
- Micro Control Company
- Aidan Michael Fawcett
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR TEST DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250123323
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Haewook PARK
- G01 - MEASURING TESTING
Information Patent Application
MULTIPLE TILE TWO-LAYERED MOTHERBOARD TESTER
- Publication number 20250102564
- Publication date Mar 27, 2025
- Intelligent Memory Limited
- Peter Poechmueller
- G01 - MEASURING TESTING
Information Patent Application
SHELL FOR WAFER LEVEL BURN-IN (WLBI) CHIP TEST, METHOD FOR LOADING...
- Publication number 20250093405
- Publication date Mar 20, 2025
- Microtest S.p.A.
- Giuseppe AMELIO
- G01 - MEASURING TESTING
Information Patent Application
WAFER TEST CASSETTE, WAFER TEST SYSTEM AND WAFER TEST METHOD
- Publication number 20250093406
- Publication date Mar 20, 2025
- XINGR TECHNOLOGIES (ZHEJIANG) LIMITED
- CHOON LEONG LOU
- G01 - MEASURING TESTING
Information Patent Application
ACTIVE THERMAL INTERPOSER DEVICE
- Publication number 20250093408
- Publication date Mar 20, 2025
- ADVANTEST TEST SOLUTIONS, INC.
- Samer Kabbani
- G01 - MEASURING TESTING
Information Patent Application
CONTACT PROBE, PROBE HOLDER AND PROBE UNIT
- Publication number 20250035699
- Publication date Jan 30, 2025
- NHK Spring Co., Ltd.
- Tsuyoshi Inuma
- G01 - MEASURING TESTING
Information Patent Application
METHODS AND APPARATUS TO DISENGAGE A TEST HEAD FROM AN INTEGRATED C...
- Publication number 20250012853
- Publication date Jan 9, 2025
- Intel Corporation
- David Daniel Wieneke
- G01 - MEASURING TESTING
Information Patent Application
TEST DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING TES...
- Publication number 20250012854
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jihyun CHOI
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...
- Publication number 20240402217
- Publication date Dec 5, 2024
- Smiths Interconnect Americas, Inc.
- Khaled Elmadbouly
- G01 - MEASURING TESTING
Information Patent Application
CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED
- Publication number 20240377454
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Raffy CELIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST SOCKET AND ASSEMBLY DEVICE THEREOF
- Publication number 20240361352
- Publication date Oct 31, 2024
- okins electronics Co.,Ltd
- Jin Kook JUN
- G01 - MEASURING TESTING
Information Patent Application
WORK PRESS ASSEMBLY FOR TEST HANDLER
- Publication number 20240353477
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Neng Chang
- G01 - MEASURING TESTING
Information Patent Application
PROBE MOUNTING STRUCTURE AND RELIABILITY TEST SYSTEM FOR WAFER-LEVE...
- Publication number 20240310433
- Publication date Sep 19, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE
- Publication number 20240295600
- Publication date Sep 5, 2024
- SEMIGHT INSTRUMENTS CO., LTD
- Zhe LIAN
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED ACTUATOR TEST SYSTEM AND METHOD FOR OPERATING THE SAME
- Publication number 20240264223
- Publication date Aug 8, 2024
- PAMTEK Co., Ltd.
- Jae Woong KIM
- G01 - MEASURING TESTING
Information Patent Application
CONTACT INSPECTION DEVICE
- Publication number 20240248117
- Publication date Jul 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- Byungsu KIM
- G01 - MEASURING TESTING
Information Patent Application
CONTROLLING ALIGNMENT DURING A THERMAL CYCLE
- Publication number 20240230714
- Publication date Jul 11, 2024
- Aehr Test Systems
- Scott E. Lindsey
- G01 - MEASURING TESTING

Contacting devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical probe, probe card, measuring system, and measuring method

Apparatus and method for burn-in board alignment and sealing betwee...

Integrated test cell using active thermal interposer (ATI) with par...

Burn-in system with multiple plugs on the test board

Controlling alignment during a thermal cycle

Test board and test device including the same

Electronic component handling apparatus and electronic component te...

Apparatus for testing semiconductor devices and a rolling contactor...

Work press assembly for test handler

Test system support component exchange system and method

Contact pins for test sockets and test sockets comprising the same

Active thermal interposer device

Test socket for semiconductor integrated circuits

Thermal array with gimbal features and enhanced thermal performance

Flexible sideband support systems and methods

Contact probe, probe holder and probe unit

Apparatus for testing a semiconductor package

Apparatus for testing electronic devices

Test system, test method, and non-transitory computer readable medium

Module substrate for semiconductor module, semiconductor module and...

Test socket

Testing devices and method for testing semiconductor devices

Heat spreaders for use in semiconductor device testing, such as bur...

Socket for electrical component

Test socket for performing a test on an electronic device

Testing device and method for testing a device under test

Electronic component testing apparatus, sockets, and replacement pa...

Test socket having an automated lid

Burn-in board seating

Burn-in board and burn-in apparatus

Patents Applicationslast 30 patents

SYSTEM FOR TESTING AN INTEGRATED CIRCUIT OF A DEVICE AND ITS METHOD...

CHIP COOLING MODULE AND CHIP TESTING APPARATUS HAVING SAME

SOCKET ASSEMBLY AND ELECTRONIC COMPONENT TEST APPARATUS

SOCKET SYSTEMS WITH INTEGRATED PARTIALLY-CONDUCTIVE SUBSTRATES AND...

WORK PRESS ASSEMBLY FOR TEST HANDLER

INTERPOSER PACKAGE, MOUNTING METHOD, AND BURN-IN TEST APPARATUS

TEST ARRANGEMENT FOR OVER-THE-AIR TESTING AN ANGLED DEVICE UNDER TE...

TEST TRAY FOR SEMICONDUCTOR DEVICES AND TEST APPARATUS USING THE SAME

MULTI-WAFER INSPECTION SYSTEM

LIQUID COOLED TEST SYSTEM FOR TESTING SEMICONDUCTOR INTEGRATED CIRC...

SEMICONDUCTOR BURN-IN MACHINE COOLING SYSTEM

SEMICONDUCTOR BURN-IN MACHINE POWER REGULATOR HAVING MULTIPLE POWER...

SEMICONDUCTOR BURN-IN BOARD

SEMICONDUCTOR TEST DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTIPLE TILE TWO-LAYERED MOTHERBOARD TESTER

SHELL FOR WAFER LEVEL BURN-IN (WLBI) CHIP TEST, METHOD FOR LOADING...

WAFER TEST CASSETTE, WAFER TEST SYSTEM AND WAFER TEST METHOD

ACTIVE THERMAL INTERPOSER DEVICE

CONTACT PROBE, PROBE HOLDER AND PROBE UNIT

METHODS AND APPARATUS TO DISENGAGE A TEST HEAD FROM AN INTEGRATED C...

TEST DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING TES...

SYSTEMS AND METHODS FOR COAXIAL TEST SOCKET AND PRINTED CIRCUIT BOA...

CONTACTOR FOR MULTI DEVICE SOCKETS AND RELATED

TEST SOCKET AND ASSEMBLY DEVICE THEREOF

WORK PRESS ASSEMBLY FOR TEST HANDLER

PROBE MOUNTING STRUCTURE AND RELIABILITY TEST SYSTEM FOR WAFER-LEVE...

CHIP TESTING DEVICE AND PACKAGE TESTING MACHINE

INTEGRATED ACTUATOR TEST SYSTEM AND METHOD FOR OPERATING THE SAME

CONTACT INSPECTION DEVICE

CONTROLLING ALIGNMENT DURING A THERMAL CYCLE