This application claims priority to Taiwan Application Serial Number 95141028, filed Nov. 6, 2006, which is herein incorporated by reference.
1. Field of Invention
The present invention relates to an electrical current producing apparatus. More particularly, the present invention relates to an electrical current producing apparatus responsive to light.
2. Description of Related Art
As world populations grow and more third world countries start large economic developments, people need more and more energy than before. After energy crisis, people are subject to a dearth of energy. Therefore, many countries begin seeking replacement energy or new energy resources. Solar energy is one of the replacement energy or the new energy resources.
In 1970s, Bell Labs produce silicone solar cells to start development of commercial solar cells. This silicone solar cells convert photons from the sun (solar light) into electricity using electrons. This conversion is called the photovoltaic effect, and the field of research related to solar cells is known as photovoltaics. Although the efficiency of silicone solar cells (made of single crystal silicone) is 12%˜15%, the silicone solar cells are difficult to be manufactured and expensive. Therefore, the silicone solar cells are not available to all.
Accordingly, dye-sensitized solar cells are developed to solve the above mentioned problems. However, the efficiency of the dye-sensitized solar cells is still insufficient. Therefore, how to improve the efficiency of the dye-sensitized solar cells responsive to visible light is a serious challenge for many researchers.
According to one embodiment of the present invention, a solar cell includes a pair of electrodes, an electrolyte and a titanium dioxide layer. The electrolyte is positioned between the electrodes. The titanium dioxide layer is positioned between one of the electrodes and the electrolyte. Furthermore, the titanium dioxide layer has a rough surface opposite the electrolyte, and a range of ratios of oxygen ions to titanium ions is about 2˜1.9 in the titanium dioxide layer.
According to another embodiment of the present invention, a method for manufacturing a photo-electrochemical layer includes the following steps: A conducting substrate is provided. Then, a titanium dioxide layer is formed on a part of the conducting substrate by a sputtering process.
According to further another embodiment of the present invention, a method for manufacturing a photo-electrochemical layer includes the following steps: A conducting substrate is provided. Then, a titanium dioxide layer is formed on a part of the conducting substrate. Next, the titanium dioxide layer is etched.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The invention can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
Reference is made to
Reference is made to
Reference is made to
In this embodiment, the thickness of the titanium dioxide layer 130 may be about 0.5˜1.5 μm. Furthermore, the titanium dioxide layer 130 may not need to be doped with any impurities. However, the above mentioned parameters are only examples. In fact, the thickness of the titanium dioxide layer and whether the titanium dioxide layer is doped should depend on practical requirements.
Another embodiment of the present invention is a method for manufacturing a photo-electrochemical layer. The method includes the following steps: A conducting substrate is provided. Then, a titanium dioxide layer is formed on a part of the conducting substrate by a sputtering process. In the titanium dioxide layer formed by sputtering, a range of ratios of oxygen ions to titanium ions is about 2˜1.9. Accordingly, the titanium dioxide layer formed by sputtering has a lower energy band gap than conventional titanium dioxide layers do such that the titanium dioxide layer formed by sputtering can be responsive to visible light.
After the titanium dioxide layer is formed, the titanium dioxide layer may be etched to enhance the surface roughness of the titanium dioxide layer, thereby the efficiency of the photo-electrochemical layer is raised as well. The titanium dioxide layer may be etched by a wet etching process. Reference is made to
In this embodiment, the reaction gas of the sputtering process may be argon or combination of both argon and oxide. The pressure of the reaction gas of the sputtering process may be about 1˜10 Pa. The temperature of the conducting substrate may be about 400˜600 K during the sputtering process. The reaction time of the sputtering process may be about 60˜120 minutes. The above mentioned parameters of the sputtering process are only examples, and the possibility of choice need not be limited to them. In fact, the parameters of the sputtering process should depend on practical requirements.
In yet another embodiment of the present invention, the titanium dioxide layer may be formed by other methods, e.g. sintering or a sol-gel process. Then, the titanium dioxide layer may be etched to enhance the surface roughness of the titanium dioxide layer such that the efficiency of the photo-electrochemical layer responsive to visible light can be raised.
In this embodiment, the titanium dioxide layer may be etched by a wet etching process. The etching solution of the wet etching process may be an aqueous solution of hydrofluoric acid. The concentration of the hydrofluoric acid in the aqueous solution may be about 0.1˜0.01 wt. %. The reaction time of the wet etching process may be about 15˜180 minutes. Similarly, the above mentioned parameters of the wet etching process are only examples, and the possibility of choice need not be limited to them. In fact, the parameters of the wet etching process should depend on practical requirements.
According to the embodiments of the present invention mentioned above, some examples are given thereinafter.
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Reference is made to
(1) A part of a conducting glass is covered with tinfoil.
(2) The conducting glass is fixed on a substrate.
(3) The substrate is put into a chamber, and the pressure of the chamber is then controlled to 10−4 Pa.
(5) Argon is introduced with a pressure of 2 Pa in 25 s.c.c.m. for 20 minutes in order to remove contaminations on the surface of substrates.
(6) A titanium dioxide layer is formed on the conducting glass by a sputtering process, wherein the rotating speed of the sputtering process is 5 rpm, the power of the sputtering process is 300 W, the input DC voltage of the sputtering process is −0.45 kV, the reaction temperature of the sputtering process is 873 K and a distance between a target and the substrate during the sputtering process is set at 75 mm.
(7) The sputtering process operates for 90 minutes, and the chamber is cooled to less than 100° C.
(8) The conducting glass with the titanium dioxide layer (called the photo-electrochemical layer) is taken out, wherein the thickness of the titanium dioxide layer is 1˜3 μm.
Furthermore, still another wavelength versus photo-current curve 630 is for another photo-electrochemical layer which has been etched. Particularly, this photo-electrochemical layer is formed by the above mentioned steps (1)-(7), and the photo-electrochemical layer is then etched by an aqueous solution of 0.045 wt. % hydrofluoric acid for 120 minutes.
IPCE(%)=[1240×photo-current density(μA×cm−2)]/[wavelength(nm)×photonflux(μW×cm-2)]
Reference is made to
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims.
Number | Date | Country | Kind |
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95141028 | Nov 2006 | TW | national |