Claims
- 1. Solder for bonding metallic material, comprising:solder material; and photosetting flux which is mixed with said solder material and hardens by the irradiation of light, wherein said photosetting flux is composed of at least flux base material, flux base material solvent, a photopolymerization initiator and photosetting prepolymer, and a heat polymerization initiator, which starts the polymerization of said photosetting flux at a temperature higher than the melt temperature of said solder material and which hardens by the irradiation of light.
- 2. Solder as defined in claim 1, wherein said photosetting prepolymer is urethane acrylate.
- 3. Solder as defined in claim 1, wherein said photopolymerization initiator is benzoin isopropyl ether.
- 4. Solder as defined in claim 1, wherein said photosetting prepolymer is urethane acrylate, and said photopolymerization initiator is benzoin isopropyl ether.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-267858 |
Sep 1995 |
JP |
|
Parent Case Info
This application is a division of application Ser. No. 08/714,308, filed Sep. 18, 1996, now U.S. Pat. No. 5,871,592.
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