Claims
- 1. A method of measuring solder bumps formed on a work to be measured, comprising the steps ofirradiating a light beam on each solder bump disposed on the work set on a table; measuring an apex height of each solder bump by receiving a light reflected from each solder bump; determining a regression plane constituted by said solder bumps by referring to said apex heights measured; and determining a relative apex height of each solder bump relative to said determined regression plane.
- 2. A solder bump measuring method according to claim 1, further comprising the steps of:judging whether a relative apex height of each solder bump is within a predetermined value; and displaying positions of solder bumps judged to be of inferior quality on display means.
- 3. A solder bump measuring method according to claim 1, further comprising the steps of:calculating a standard deviation regarding a relative apex height of each solder bump; and judging whether the work is good or bad by referring to an apex height of each solder bump and said standard deviation.
- 4. A method of measuring solder bumps formed on a work to be measured, comprising the steps of:irradiating a light beam on a surface of said work and a surface of each solder bump on said work set on a table; measuring a height of said surface of said work and an apex height of each solder bump by receiving light reflected from said surface of said work and said surface of each solder bump of said work set on said table; determining a regression plane constituted by said surface of said work from measured results; and determining a relative apex height of each solder bump relative to said determined regression plane.
Priority Claims (1)
Number |
Date |
Country |
Kind |
7-316283 |
Dec 1995 |
JP |
|
Parent Case Info
This is a divisional application of U.S. Ser. No. 09/289,386, filed Apr. 12, 1999 now U.S. Pat. No. 6,196,441, issued Mar. 6, 2001.
US Referenced Citations (20)
Foreign Referenced Citations (4)
Number |
Date |
Country |
0436322 |
Jul 1991 |
EP |
2-80905 |
Mar 1990 |
JP |
5152407 |
Jun 1993 |
JP |
5235136 |
Sep 1993 |
JP |
Non-Patent Literature Citations (2)
Entry |
IBM Technical Disclosure Bulletin, vol. 34, No. 10B, Machine Vision Technique for Increasing of Chip Alignment Data, Mar. 1992.* |
IBM Technical Disclosure Bulletin, vol. 37, No. 5, Manual Inspection Assembly, May 1994. |