BRIEF DESCRIPTION OF THE DRAWINGS
The objects and features of the present invention will become more apparent from consideration of the following detailed description taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic cross-sectional view of part of an array of photodiodes taken along a straight line I shown in FIG. 2;
FIG. 2 is a top plan view schematically showing part of the array of photodiodes of an embodiment of a solid-state image sensor according to the present invention;
FIG. 3 is a top plan view, like FIG. 2, schematically showing part of the array of photodiodes of an alternative embodiment of a solid-state image sensor according to the present invention;
FIG. 4 is schematic cross-sectional view of part of an array of photodiodes of a conventional solid-state image sensor to be compared with the solid-state image sensor according to the present invention;
FIG. 5 schematically illustrates an example of an image circle formed in a lower-sensitivity photodiode in the array of photodiodes of a conventional solid-state image sensor shown in FIG. 4;
FIG. 6 schematically illustrates, like FIG. 5, an example of an image circle formed in a lower-sensitivity photodiode in the array of photodiodes of a solid-state image sensor shown in FIG. 1;
FIGS. 7A and 7B schematically illustrate an exemplified way of fabricating in-layer lenses in the illustrative embodiment; and
FIG. 8 is another schematic cross-sectional view of, like FIG. 1, part of the array of photodiodes taken along a straight line I shown in FIG. 2.