This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2013-51592, filed on Mar. 14, 2013; the entire contents of which are incorporated herein by reference.
Embodiments described herein relate generally to a solid-state imaging device.
In solid-state imaging devices, lens shading correction is performed to compensate for attenuation of the light intensity in the peripheral portion due to vignetting of the lens. To correct the lens shading, there is a method of setting the digital gain in the peripheral portion higher than the digital gain in the central portion.
According to an embodiment, a solid-state imaging device includes a pixel array, a digital gain circuit, and a shading correction circuit. In the pixel array, pixels that accumulate photoelectrically converted charge are arranged in a matrix and the pixel array can control an exposure time of the pixels for each line. The digital gain circuit adjusts a digital gain of an output signal of the pixel array. The shading correction circuit corrects shading of the pixel array by controlling the exposure time of the pixels and the digital gain.
A solid-state imaging device according to an embodiment will be explained below in detail with reference to the accompanying drawings. The present invention is not limited to the following embodiment.
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In the CMOS sensor 11, pixels that accumulate photoelectrically converted charge are arranged in a matrix. Moreover, the CMOS sensor 11 can control the exposure period of pixels for each line. The digital gain circuit 12 can adjust the digital gain of an output signal S1 from the CMOS sensor 11. The ROM 13 can store an ideal curve that indicates the relationship between a vertical line and the ideal gain necessary for ideally correcting shading of the CMOS sensor 11. The ideal curve can be represented by a function of cos4. The shading correction circuit 14 can correct shading of the CMOS sensor 11 by controlling the exposure period of pixels and the digital gain.
The exposure time calculating unit 14A can limit the exposure curve which indicates the relationship between the reset timing controlling the exposure period of pixels and the vertical lines to a predetermined curve and can calculate the exposure period of pixels such that shading of the CMOS sensor 11 can be corrected within the limitation. This exposure curve can be limited to, for example, a quadratic curve or a quartic curve. The gain information calculating unit 14B can calculate the digital gain such that the difference is compensated for between the exposure gain obtained on the basis of the exposure curve and the ideal gain indicated by the ideal curve. The number-of-line-steps setting unit 14C can set the number of line steps for the exposure curve such that number of vertical lines whose reset timings match is reduced.
In the shading correction circuit 14, the exposure period of pixels is calculated and the number of line steps for the exposure curve are set on the basis of an ideal curve S2 stored in the ROM 13, and they are output from the CMOS sensor 11 as exposure information S3. Moreover, in the shading correction circuit 14, the digital gain is calculated such that the difference is compensated for between the exposure gain obtained on the basis of the exposure curve and the ideal gain indicated by the ideal curve, and the calculated digital gain is output from the digital gain circuit 12 as gain information S4.
Then, in the CMOS sensor 11, the exposure period of pixels is controlled for each line and the number of line steps at the time of reset is set on the basis of the exposure information S3, and the output signal S1 at this point is output to the digital gain circuit 12. Then, in the digital gain circuit 12, the digital gain of the output signal S1 is adjusted such that the difference is compensated for between the exposure gain obtained on the basis of the exposure curve and the ideal gain indicated by the ideal curve, and the adjusted output signal S1 is output as a corrected output S5.
The difference between the exposure gain obtained on the basis of the exposure curve and the ideal gain indicated by the ideal curve is compensated for by using the digital gain; therefore, the SNR can be improved when compared with the case where lens shading correction is performed by using only the digital gain. Moreover, even in the case where the exposure time is short (for example, 1H=1 horizontal period) and the case where the exposure time is long (for example, 1V=1 vertical period), the lens shading correction accuracy can be improved by combining the exposure gain and the digital gain when compared with the case where lens shading correction is performed by using only the exposure gain. Furthermore, the exposure curve is limited to a predetermined curve; therefore, it is possible to estimate the timing at which a synchronous reset occurs. Therefore, the timings of the synchronous resets can be dispersed by setting the number of line steps in accordance with the exposure curve. Thus, the number of lines that cause a synchronous reset can be reduced, thereby enabling the load on the CMOS sensor 11 to be reduced.
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Moreover, the solid-state imaging device includes a vertical scanning circuit 2 that scans the pixels PC to be a read target in the vertical direction, a load circuit 3 that reads signals from the pixels PC for each column to the vertical signal line Vlin by performing a source follower operation with respect to the pixels PC, a column ADC circuit 4 that detects a signal component of each pixel PC in a CDS for each column, a horizontal scanning circuit 5 that scans the pixels PC to be a read target in the horizontal direction, a reference voltage generating circuit 6 that outputs a reference voltage VREF to the column ADC circuit 4, and a timing control circuit 7 that controls the read timing and charge accumulation timing of each pixel PC. A ramp wave can be used for the reference voltage VREF.
The timing control circuit 7 includes an exposure time control unit 7A. The exposure time control unit 7A includes an exposure reset-timing control unit 7B and a read timing control unit 7C. The exposure time control unit 7A controls the exposure period of the pixels PC for each line. The exposure reset-timing control unit 7B controls the reset timing of charge accumulated in the pixels PC of the pixel array unit 1. The read timing control unit 7C controls the read timing of charge accumulated in the pixels PC.
Then, the pixels PC in the row direction RD are selected by scanning the pixels PC in the vertical direction by the vertical scanning circuit 2. Then, the load circuit 3 performs a source follower operation with respect to the pixels PC, whereby signals read from the pixels PC are transmitted via the vertical signal line Vlin and sent to the column ADC circuit 4. Moreover, in the reference voltage generating circuit 6, a ramp wave is set as the reference voltage VREF and is sent to the column ADC circuit 4. Then, in the column ADC circuit 4, a count operation of counting a clock is performed until the signal level read from the pixels PC and the reset level match the level of the ramp wave, and the difference between the signal level and the reset level at this point is obtained, whereby the signal component of each pixel PC is detected in the CDS and is output as the output signal S1.
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The source of the read transistor Td is connected to the photodiode PD and a read signal READ is input to the gate of the read transistor Td. Moreover, the source of the reset transistor Tc is connected to the drain of the read transistor Td, a reset signal RESET is input to the gate of the reset transistor Tc, and the drain of the reset transistor Tc is connected to a power supply potential VDD. Furthermore, a row selection signal ADRES is input to the gate of the row select transistor Ta, and the drain of the row select transistor Ta is connected to the power supply potential VDD. Moreover, the source of the amplifying transistor Tb is connected to the vertical signal line Vlin, the gate of the amplifying transistor Tb is connected to the drain of the read transistor Td, and the drain of the amplifying transistor Tb is connected to the source of the row select transistor Ta.
The horizontal control line Hlin in
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After the charge accumulated in the photodiode PD during the non-exposure period NX is discharged to the power supply potential VDD, when the read signal READ becomes a low level, accumulation of effective signal charge is started in the photodiode PD so as to transition to an exposure period EX from the non-exposure period NX.
Next, when the row selection signal ADRES becomes a high level (ta2), the row select transistor Ta of the pixel PC is turned on and the power supply potential VDD is applied to the drain of the amplifying transistor Tb.
Then, when the reset signal RESET becomes a high level in a state where the row select transistor Ta is on (ta3), the reset transistor Tc is turned on and extra charge generated in the floating diffusion FD due to the leakage current or the like is reset. Then, a voltage in accordance with the reset level of the floating diffusion FD is applied to the gate of the amplifying transistor Tb, and the voltage of the vertical signal line Vlin follows the voltage applied to the gate of the amplifying transistor Tb, whereby the pixel signal VSIG at a reset level is output to the vertical signal line Vlin.
Then, the pixel signal VSIG at a reset level is input to the column ADC circuit 4 and is compared with the reference signal VREF. Then, the pixel signal VSIG at a reset level is converted to a digital value on the basis of the comparison result and is stored.
Next, when the read signal READ becomes a high level in a state where the row select transistor Ta is on (ta4), the read transistor Td is turned on and the charge accumulated in the photodiode PD during the exposure period EX is transferred to the floating diffusion FD. Then, a voltage in accordance with the signal read level of the floating diffusion FD is applied to the gate of the amplifying transistor Tb and the voltage of the vertical signal line Vlin follows the voltage applied to the gate of the amplifying transistor Tb, whereby the pixel signal VSIG at a signal read level is output to the vertical signal line Vlin.
Then, the pixel signal VSIG at a signal read level is input to the column ADC circuit 4 and is compared with the reference voltage VREF. Then, the difference between the pixel signal VSIG at a reset level and the pixel signal VSIG at a signal read level is converted to a digital value on the basis of the comparison result and the obtained digital value is output as the output signal S1 in accordance with a first exposure period FX1.
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While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2013-051592 | Mar 2013 | JP | national |