Claims
- 1. A process for chemically resharpening forming tools, smoothing tools, and cutting tools which comprises the steps of:
- providing a solution comprising 1% to 99% by volume of at least one acid and further introducing at least one whetting agent into said solution to enhance resharpening characteristics of said solution;
- immersing a tool in said solution; and
- subsequently removing said tool from said solution.
- 2. A process for chemically resharpening forming tools, smoothing tools, and cutting tools as described in claim 1, wherein said solution includes up to 10% by volume of said at least one whetting agent which includes phosphonic ester polymers, precipitated silica, hydrotopes, linier alkylbenzene sulfonates, sulfo esters, alkyl sulfate, sodium dodecylbenzene sulfonate, sodium lauryl sulfate, ethylene oxide propylene oxide polymers, and sodium sulfo methylethyl laurate.
- 3. A process for chemically resharpening forming tools, smoothing tools, and cutting tools which comprises the steps of:
- providing a solution comprising 1% to 99% by volume of at least one acid and further introducing at least one accelerant into said solution to substantially enhance said acid thus effecting improved resharpening characteristics of said solution;
- immersing a tool in said solution; and
- subsequently removing said tool from said solution.
- 4. A process for chemically resharpening forming tools, smoothing tools, and cutting tools, as described in claim 3, wherein said solution includes up to 25% by volume of said at least one accelerant which includes sulfuric acid, gluconic acid, chromic acid, chromic fluoride, and dodecelbenzenesulfonic acid.
BACKGROUND OF THE INVENTION
This invention relates to a solution and process for chemically sharpening smoothing tools, forming tools, and cutting tools, such as files and the like, which are made of metal and can be used to smooth, form, or cut wood, metal, plastic, laminate, and the like. The application being submitted here is a continuation-in-part patent application of patent application Ser. No. 08/133,995, filed Oct. 12, 1993, now U.S. Pat. No. 5,382,319.
US Referenced Citations (4)
Foreign Referenced Citations (1)
Number |
Date |
Country |
130272 |
Jul 1919 |
GBX |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
133995 |
Oct 1993 |
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