Claims
- 1. In a spatula for supporting a semiconductor wafer comprising an elongated blade of predetermined length and thickness and having a width less than the diameter of said wafer, the length of said blade terminating in a free end and a supported end, the improvement comprising:
- a recess comprising a reduced thickness portion adjacent to but spaced from the free end of said blade, said recess forming a pair of arcs across the width of the blade, said pair of arcs having a common center and a diameter slightly greater then the diameter of said wafer;
- a ridge at said free end, said ridge defining an arc having the same diameter as said pair of arcs but having a center displaced slightly from said common center toward said free end;
- whereby said spatula can be inserted between wafers in a cassette to engage a wafer initially with said ridge and remove it slightly so that said spatula can be re-inserted into the cassette to support said wafer in said recess.
- 2. The spatula as set forth in claim 1 wherein the thickness of said blade at said ridge is greater than said predetermined thickness.
- 3. The spatula as set forth in claim 1 wherein the width of said blade is greater than the flat on said semiconductor wafer.
Parent Case Info
This application is a continuation of prior application Ser. No. 07/377,498, filed July 10, 19889, now abandoned which is a divisional of Ser. No. 07/185,730, filed on Apr. 25, 1988, now Pat. No. 4,867,631.
US Referenced Citations (5)
Foreign Referenced Citations (3)
Number |
Date |
Country |
19620 |
Jan 1985 |
JPX |
273441 |
Dec 1986 |
JPX |
291335 |
Dec 1986 |
JPX |
Divisions (1)
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Number |
Date |
Country |
Parent |
185730 |
Apr 1988 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
377498 |
Jul 1989 |
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