TREA

the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Follow

Industry

  • CPC
  • H01L21/68707
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/68707the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Industries