Patent Application
20240397266
The present application claims the benefit of priority to European Patent Application No. 21201399.9, filed Oct. 7, 2021: European Patent Application No. 21201404.7, filed Oct. 7, 2021; and European Patent Application No. 21201405.4, filed Oct. 7, 2021, each of which is incorporated by reference herein in its entirety.
The present invention relates to a speaker device, in particular a speaker device with an integrated suspension driver. The present invention further relates to a speaker device, particularly to a speaker device with a low profile and small form factor. The present invention even further relates to a speaker device, in particular a speaker device with an integrated printed circuit board.
Speakers are e.g. known from US patent publications U.S. Pat. No. 6,853,734, which discloses a resilient flat speaker damper, U.S. Pat. No. 7,366,318, which discloses a suspension for the voice coil of a loudspeaker drive unit, and U.S. Pat. No. 8,311,263, which discloses a spider arrangement for an electromagnetic vibrator usable in a loudspeaker.
The most important development in loudspeakers is to make loudspeakers more powerful and more compact, preferably without compromising on efficiency and cost. A loudspeaker is deemed powerful if it has a relatively high maximum sound pressure level and can easily reproduce lower frequencies, for instance below 100 Hz, taking the size of the driver and housing into account.
Compact loudspeaker systems are also often low in weight. Undesirable mechanical vibrations can occur when a loudspeaker diaphragm makes high excursions in a lightweight housing. One solution is to add a second driver facing away from the existing driver, an arrangement that is sometimes known as dual, opposing driver cancellation (DODC). An advantage of DODC is that mechanical vibrations from the two drivers cancel out. A disadvantage of DODC is that the housing is at least twice as large because the two drivers are arranged back-to-back against each other: this increase in housing size is undesirable for a compact loudspeaker system.
An alternative opposed driver configuration is described in U.S. Pat. No. 9,609,405 in which a number of drivers are placed side-by-side in the same lateral plane, with a first set of drivers facing one direction and a second set of drivers facing the opposite direction so that farces from the two sets of drivers cancel out. The configuration described in U.S. Pat. No. 9,609,405 achieves a low transverse profile, or height, comparable to a single driver by arranging the sets of drivers in a lateral plane. However, the drivers must be in an ‘A-B-B-A’ configuration to avoid vibrations and/or moments of force when the drivers are in use. Thus, a low transverse profile is achieved at the expense of a greater lateral profile.
Speaker units are well known in the prior art, such as speaker transducers comprising a cone-shape speaker membrane and a membrane driver or actuator coaxially arranged with respect to the speaker membrane at a back side thereof. These speakers have one coil, and thus require a limited amount of wiring to connect this coil to a terminal on the frame, or directly to an amplifier. Speakers with multiple drive units require more wiring, and if other functions need to be integrated (temperature sensing, proximity sensing, location etc.), while at the same time there is a requirement for high frame rigidity, a new solution had to be developed in order to create an attractive proposition for the speaker market.
A first aspect of the present invention seeks to provide a speaker device with reduced external dimensions and having a minimum of components whilst providing high performance and linearity.
According to the first aspect of the present invention, a speaker device is provided comprising a frame, a first diaphragm and a second diaphragm, wherein the frame comprises a first frame part on which the first diaphragm is mounted and an opposing second frame part on which the second diaphragm is mounted: a first speaker driver configured to drive the first diaphragm and a second speaker driver configured to drive the second diaphragm. The first speaker driver comprises a movable first coil bracket and a first diaphragm connecting member connected to the first diaphragm and the first coil bracket. The second speaker driver comprises a movable second coil bracket and a second diaphragm connecting member connected to the second diaphragm and the second coil bracket. A resilient first damper member connects the first coil bracket to the first frame part and a resilient second damper member connects the second coil bracket to the second frame part. The first frame part, the first coil bracket and the first damper member form a first single piece integrally formed unitary component, and wherein the second frame part, the second coil bracket and the second damper member form a second single piece integrally formed unitary component.
By providing the first and second frame parts, the first and second coil brackets, and the first and second damper members as a first and second single piece component respectively allows utilization of e.g. single step injection molding processes for manufacturing the first and second frame parts, the first and second coil brackets, and the first and second damper members. Such single step injection molding processes reduce manufacturing cost and manufacturing complexity considerably. Moreover, as the first and second frame parts, the first and second coil brackets, and the first and second damper members form first and second single piece components greatly facilitates a more compact and flatter design of the speaker device.
A second aspect of the present invention seeks to provide a speaker device with a low profile and small form factor whilst maintaining performance.
According to the second aspect of the present invention, a speaker device of this type is provided comprising a first side and a spaced apart opposing second side, a frame, a first diaphragm and a second diaphragm, wherein the first diaphragm is mounted in the frame at the first side and the second diaphragm is mounted in the frame at the second side. A first speaker driver is configured to drive the first diaphragm and a second speaker driver is configured to drive the second diaphragm, and wherein the first diaphragm and second diaphragm have different shapes.
By virtue of the first and second diaphragms having difference shapes allows for good sound range and performance whilst providing a small profile speaker device. That is, the first diaphragm may have a shape to meet first sound requirements and wherein the second diaphragm may have a shape to meet second sound requirements. Moreover, the different shapes for the first and second diaphragms may allow for a secondary speaker member, e.g. a tweeter, to be fitted next to the first or second diaphragm in compact manner if so desired.
For example, in an embodiment, the first diaphragm may be a substantially flat diaphragm and wherein the second diaphragm may be a concave diaphragm. Such flat and concave diaphragms may be configured to meet particular sound requirements whilst maintaining a low profile (e.g. thickness) for the speaker device.
A third aspect of the present invention seeks to provide a speaker unit having small dimensions and as many functions integrated in as little parts as possible, yet providing a linear response characteristic.
According to the third aspect of the present invention, a speaker device of this type is provided, comprising a frame having a first frame side and a spaced apart opposing second frame side, a first diaphragm mounted in the frame at the first frame side and an opposing second diaphragm mounted in the frame at the second frame side. A first speaker driver is configured to drive the first diaphragm and a second speaker driver is configured to drive the second diaphragm. A printed circuit board, PCB, is electrically connected to the first and second speaker driver and wherein the PCB provides one or more positions for connecting the speaker device to an external device, and wherein the first frame side and/or the second frame side of the frame comprises the PCB.
The PCB on the first frame side and/or the second frame side allows for a compact electrical arrangement for controlling the first and second speaker drivers as well as connecting the speaker device to external devices. Furthermore, the PCB increases structural rigidity of the first and/or the second frame side and as such rigidity of the entire frame is increased, thereby reducing resonance for example.
The present invention will be discussed in more detail below, with reference to the attached drawings, in which
Referring to the
It is further seen that the frame 102 comprises a first frame part 102a on which the first diaphragm 103 is mounted and an opposing second frame part 102b on which the second diaphragm 104 is mounted. The first frame part 102a comprises the aforementioned first side 101a and the second frame part 102b comprises the aforementioned second side 101b of the speaker device 101.
A first speaker driver 105 is configured to drive the first diaphragm 103 and a second speaker driver 106 is configured to drive the second diaphragm 104. The first speaker driver 105 comprises a movable, e.g. linearly up-down, first coil bracket 107 and a first diaphragm connecting member 108 connected to the first diaphragm 103 and the first coil bracket 107, i.e. thereby connecting the first diaphragm 103 to the moveable first coil bracket 107.
The second speaker driver 106 comprises a movable, e.g. linearly up-down, second coil bracket 109 and a second diaphragm connecting member 110 connected to the second diaphragm 104 and the second coil bracket 109, i.e. thereby connecting the second diaphragm 104 to the moveable second coil bracket 109.
In an advantageous embodiment, the first speaker driver 105 and the second speaker driver 106 are configured to drive the first diaphragm 103 and the second diaphragm 104, respectively, in mutually opposing directions. That is, when the speaker device 101 is in use, then the first and second diaphragms 103, 104 are driven in opposing directions such that the speaker device 101 exhibits improved dynamic balancing, e.g. where opposing movements of the first and second diaphragms 103, 104 reduce unwanted resonance, vibrations etc.
A resilient first damper member 111 is provided connecting the first coil bracket 107 to the first frame part 102a and a resilient second damper member 112 connects the second coil bracket 109 to the second frame part 102b.
The first frame part 102a, the first coil bracket 107 and the first damper member 111 form a first single piece integrally formed unitary component, and wherein the second frame part 102b, the second coil bracket 109 and the second damper member 112 form a second single piece integrally formed unitary component.
According to the present invention, by providing the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109, and the first and second damper members 111, 112 as respective first and second single piece components allows utilization of single step injection molding processes for manufacturing the frame 102, e.g. the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109, and the first and second damper members 111, 112. Such single step injection molding processes reduce manufacturing cost and manufacturing complexity considerably. Moreover, because the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109, and the first and second damper members 111, 112 form first and second single piece components, respectively, greatly facilitates a more compact and flatter design of the speaker device 101. Most advantageously, the first and second single piece components as mentioned above do not reduce the performance of the speaker device 101, i.e. high performance and linearity are provided and maintained.
It is worth noting that, in an advantageous embodiment, the first frame part 102a, the first coil bracket 107, and the first damper member 111 form the first single piece component and wherein this first single piece component does not intersect or overlap itself at any point when viewed in a direction perpendicular to e.g. the first side 101a of the speaker device 101. Likewise, in an advantageous embodiment, the second frame part 102b, the second coil bracket 109, and the second damper member 112 form the second single piece component and wherein this second single piece component does not intersect or overlap itself at any point when viewed in a direction perpendicular to e.g. the second side 101b of the speaker device 101.
In an exemplary embodiment, the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109 and the first and second damper members 111, 112 form respective first and second single piece integrally formed unitary components, wherein the first and second unitary components each form a homogenous polymer part, allowing for efficient injection molding processes.
In an advantageous embodiment as depicted, the first diaphragm connecting member 108 and the second diaphragm connecting member 110 may be substantially rigid beam-like members, extending along the first and second diaphragms 103, 104, respectively, to provide good transfer of movement of the first and second coil brackets 107, 109 to the first and second diaphragms 103, 104.
It is further noted that in an exemplary embodiment the first speaker driver 105 may comprise a first magnet 105a and a moveable first coil 105b in magnetic engagement therewith, wherein the first coil 105b is connected to the first coil bracket 107. Likewise, the second speaker driver 106 may comprise a second magnet 106a and a moveable second coil 106b in magnetic engagement therewith, wherein the second coil 106b is connected to the second coil bracket 109. In an embodiment, the first coil 105b moveably extends around the first magnet 105a, and wherein the second coil 106b moveably extends around the second magnet 106a. In an exemplary embodiment, the frame 102, i.e. the first and second frame parts 102a, 102b may each comprise a plurality of cavities 115 each of which is arranged to receive a part of the first and second speaker drivers 105, 106, e.g. the first and second magnets 105a, 106a being receivable in the cavities 115.
In an advantageous embodiment, the first and second damper members 111, 112 may each have a thickness smaller than a thickness of the first and second frame part 102a. 102b respectively. By having such a smaller thickness for the first and second damper members 111, 112 allows for a resilient and flexible suspension of the first and second coil brackets 107, 109 during motion thereof.
As shown, in an advantageous embodiment, the first coil bracket 107 and the first damper member 111 form a side-by-side arrangement in a same first plane, and wherein the second coil bracket 109 and the second damper member 112 form a side-by-side arrangement in a same second plane. The side-by-side arrangements facilitate injection molding processes and e.g. removal of the first frame part 102a, the first coil bracket 107 and the first damper member 111 from a mold and removal of the second frame part 102b, the second coil bracket 109 and the second damper member 112 from a mold. In this embodiment, the first coil bracket 107 and the first damper member 111 may be considered to be arranged at a same or similar first distance as measured from e.g. the first side 101a of the speaker device 101, wherein the first coil bracket 107 and the first damper member 111 are then arranged next or adjacent to each other in the shared first plane, e.g, wherein the shared first plane is substantially parallel to the first side 101a. Likewise, the second coil bracket 109 and the second damper member 112 may be considered to be arranged at a same or similar second distance as measured from e.g. the second side 101b of the speaker device 101, wherein the second coil bracket 109 and the second damper member 112 are then arranged next or adjacent to each other in the shared second plane, e.g, wherein the shared second plane is substantially parallel to the second side 101b. In an advantageous embodiment, the same first plane and the same second plane may coincide to further reduce external dimensions of the speaker device 101.
In an exemplary embodiment, the first damper member 111 may comprise at least two resilient first damper legs 111a, 111b each of which connects the first coil bracket 107 to the first frame part 102a, and wherein the second damper member 112 comprises at least two resilient second damper legs 112a, 112b each of which connects the second coil bracket 109 to the second frame part 102b. The at least two first damper legs 111a, 111b and the at least two second damper legs 112a, 112b allow for a resilient and flexible but robust and durable connection of the first and second coil brackets 107, 109 to the first and second frame parts 102a, 102b respectively.
Note that the at least two resilient first damper legs 111a, 111b and the at least two resilient second damper legs 112a, 112b may each have a curved or arched shape and are arranged to allow for resilient movement with respect to the first and second frame parts 102a, 102b. That is, the at least two resilient first damper legs 111a, 111b may be considered to be loosely suspended between the first coil bracket 107 and the first frame part 102a. Likewise, the at least two resilient second damper legs 112a, 112b may be considered to be loosely suspended between the second coil bracket 9) and the second frame part 102b.
As mentioned earlier, the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109, and the first and second damper members 111, 112 form respective first and second single piece integrally formed unitary components. As such, in the embodiment above, the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109, and the at least two resilient first damper legs 111a, 111b and the at least two resilient second damper legs 112a, 112b form first and second single piece integrally formed unitary components respectively.
To achieve difference in rigidity and resilience of parts and sections of the first and second unitary components, an embodiment is provided wherein the first and second frame parts 102a, 102b, the first and second damper members 111, 112, and the first and second coil brackets 107, 109 each comprise one or more walls, wherein each wall has a wall thickness between 0.3 mm and 5 mm. So by changing the wall thickness at particular parts or sections allows specific rigidity and resiliency requirements to be fulfilled. Likewise, in an embodiment the first and second frame parts 102a, 102b, the at least two resilient first damper legs 111a, 111b and the at least two resilient second damper legs 112a, 112b, and the first and second coil brackets 107, 109 each comprise one or more walls, wherein each wall has a wall thickness between 0.3 mm and 5 mm.
In an embodiment, the one or more walls of each of the first and second damper members 111, 112 have a minimum wall thickness of 0.3 mm, thereby achieving sufficient resiliency and flexibility for movement of the first and second coil brackets 107, 109 without sacrificing robustness and durability of the first and second damper members 111, 112.
In an embodiment, the one or more walls of each of the at least two resilient first damper legs 111a, 111b and the at least two resilient second damper legs 112a, 112b have a minimum wall thickness of 0.3 mm, thereby achieving sufficient resiliency and flexibility for movement of the first and second coil brackets 107, 109 without sacrificing robustness and durability of the at least two first damper legs 111a, 111b and the at least two second damper legs 112a, 112b.
In an embodiment, the one or more walls of the first and second frame parts 102a. 102b and the one or more walls of each of the first and second coil brackets 107, 109 have a maximum wall thickness of 5 mm. This maximum wall thickness provides sufficient rigidity and keeps dimensions as small as possible for the frame 102, i.e. the first and second frame parts 102a, 102b, and the first and second coil brackets 107, 109 to withstand deformation and to allow the first and second coil brackets 107, 109 to transfer their movement to the first and second diaphragm connecting members 108, 110.
In an embodiment, the first and second diaphragm connecting members 108, 110 may also have one or more walls each of which has a maximum wall thickness of 5 mm to achieve sufficient rigidity but to keep dimensions as small as possible. Such a maximum wall thickness is readily achieved for the first and second diaphragm connecting members 108, 110 when formed as substantially flat beam-like diaphragm connecting members as shown.
As further depicted, the first and second damper members 111, 112, in particular the at least two resilient first damper legs 111a, 111b and the at least two resilient second damper legs 112a, 112b, may have a relative small wall thickness as outlined above, e.g. around 0.3 mm or somewhat thicker. Because the first and second frame parts 102a, 102b, the first and second coil brackets 107, 109 and the first and second damper members 111, 112 can be injection molded by virtue of the first and second single piece design as mentioned above, problems may occur regarding deformation, shrinkage and/or warping phenomena during the injection molding processes. To address these injection molding issues, an embodiment is provided wherein the speaker device 101 further comprises a first damper support part 113 extending between the first damper member 111 and the first frame part 102a, and wherein a second damper support part 114 extends between the second damper member 112 and the second frame part 102b. The first and second damper support parts 113, 114 prevent unwanted deformation, shrinkage, and/or warping during injection molding, so that the first and second damper members 111, 112 maintain a required shape and resiliency after the injection molding processes have been completed.
Referring to the
By virtue of the first and second diaphragms 203, 204 having difference shapes allows for good sound range and performance whilst providing a small profile (e.g. thickness) to the speaker device 201. In particular, the first diaphragm 203 may have a first shape to meet first sound requirements and wherein the second diaphragm 204 may have a second shape to meet second sound requirements, the first and second shape being different to meet the first and second sound requirements respectively. Most advantageously, as will be discussed in further detail below, the different shapes for the first and second diaphragms 203, 204 also allow for a secondary speaker member 212, e.g. a tweeter, to be fitted next/adjacent to the first or second diaphragm 203, 204 in compact manner if so desired.
In the exemplary embodiment, the first diaphragm 203 may be a substantially flat diaphragm and wherein the second diaphragm 204 may be a concave diaphragm. The flat and concave diaphragms 203, 204 may be configured to meet different sound requirements whilst maintaining a low profile, such as a thickness, for the speaker device 201. Since the first diaphragm 203 may be substantially flat, this provides more space inside the speaker device 201 for receiving the concave second diaphragm 204. Furthermore, such a concave second diaphragm 204 provides a concave space in which at least in part the aforementioned secondary speaker member 212 may be received to further reduce the profile of the speaker device 201.
In an advantageous embodiment, a first diaphragm support member 207 is provided and connected to the first speaker driver 205 and extends along the first diaphragm 203 for support thereof. A second diaphragm support member 208 is further provided and connected to the second speaker driver 206 and extends along the second diaphragm 204 for support thereof. As shown, the first diaphragm support member 207 and the second diaphragm support member 208 are rotationally offset at an angle (a) between 45° and 90° as measured in a plane parallel to the first or the second side 201a, 201b.
In another advantageous embodiment, the first speaker driver 205 and the second speaker driver 206 may be arranged in a same plane, which also facilities a reduction of the profile (e.g. thickness) of the speaker device 201.
As can be inferred from
It is worth noting that the first diaphragm support member 207 in
In an advantageous embodiment, the first diaphragm support member 207 comprises one or more recessed center sections 209 extending along the first diaphragm 203 and wherein the second diaphragm support member 208 is movably received in the one or more recessed center sections 209. In this way it is possible to further lower/reduce the profile (e.g. thickness) of the speaker device 201 as the first diaphragm support member 207 provides space for the second diaphragm support member 208 to movably cross the first diaphragm support member 207 without interference whilst allowing the spacing between the first and second diaphragm 203, 204. i.e. the first and second side 201a, 201b, to be minimized.
In an advantageous embodiment, the second diaphragm support member 208 comprises one or more cut-outs 210 for movably receiving the first diaphragm support member 207. As can be inferred from
It is worth noting that the one or more recessed center sections 209 of the first diaphragm support member 207 and/or the one or more cut-outs 210 of the second diaphragm support member 208 also ensure that sufficient travel of the first and second diaphragms 203, 204 is possible when in use for achieving optimal performance of the speaker device 201.
In an embodiment as depicted in
In this embodiment the first diaphragm 203 is driven through the first diaphragm support member 207 which is connected between and to the opposing first driver parts 205a, 205b. In this way driving forces of the first driver parts 205a, 205b are optimally distributed across the first diaphragm 203. Likewise, the second diaphragm 204 is driven through the second diaphragm support member 208 which is connected between and to the opposing second driver parts 206a, 206b. In this way driving forces of the second driver parts 206a, 206b are optimally distributed across the second diaphragm 204.
In an exemplary embodiment, the first diaphragm support member 207 and the second diaphragm support member 208 are rotationally offset at an angle (a) of (substantially) 90° degrees. In this embodiment the first and second diaphragm support members 207, 208 may be viewed as being arranged substantially perpendicular as measured in a plane parallel to the first or second side 201a, 201b. In this way both a width and a length of the speaker device 201 as measured in this plane can be both minimized, for example, to achieve a compact square profile of the speaker device 201.
In a further embodiment, the speaker device 201 further comprises a first diaphragm assembly and a second diaphragm assembly. The first diaphragm assembly comprises the first diaphragm 203, the two moveable first driver parts 205a, 205b and the first diaphragm support member 207, and the second diaphragm assembly comprises the second diaphragm 204, the two moveable second driver parts 206a, 206b and the second diaphragm support member 208. Then, a weight of the first diaphragm assembly is substantially equal to a weight of the second diaphragm assembly, thereby allowing resonance and vibration free operation of the speaker device 201. It is noted that the equality of weight relates to the combination of moving parts in operation. In one embodiment, all three components of the first and second diaphragm assembly are substantially equal in weight. In a further embodiment, a higher or lower weight of e.g. the first diaphragm 203 as compared to the second diaphragm 204 can be offset by a lower or higher weight, respectively, of the first diaphragm support member 207 as compared to the second diaphragm support member 208.
Referring to
To further reduce the profile of the speaker device 201, an exemplary embodiment is provided wherein the second diaphragm 204 is a concave diaphragm providing a concave space, wherein the secondary speaker member 212 is at least in part arranged in the concave space. The concave space is understood to protrude/project into the speaker device 201. In this embodiment the secondary speaker member 212 is at least in part received in the concave space so that an even more compact design of the speaker device 201 is obtained.
It is worth noting that the one or more recessed center sections 209 of the first diaphragm support member 207 provide more internal space in the speaker device 201 for a concave second diaphragm 204, because the one or more recessed center sections 209 are able to receive in a nested manner at least in part the concave second diaphragm 204 and the rotationally offset second diaphragm support member 208 supporting the concave second diaphragm 204.
In the exemplary embodiment of
When the second diaphragm 204 is a concave diaphragm providing the concave space as mentioned earlier, then an advantageous embodiment is provided wherein each of the support legs 211a, 211b is an arched support leg comprising an arched section projecting away from the second side 201b. The plurality of arched support legs 211a, 211b facilitate the arrangement of the secondary speaker member 212 at least in part into the concave space without interfering with the second diaphragm 204, e.g. by avoiding a diaphragm rim 204a of the second diaphragm 204. The plurality of arched support legs 211a, 211b thus allow for an even more compact design of the speaker device 201.
Note that in an embodiment the first diaphragm support member 207 is configured to provide sufficient rigidity for support of a substantially flat first diaphragm 203 as mentioned above. In this embodiment, a depth of the one or more recessed center sections 209 can be increased to movably receive the second diaphragm support member 208. Such an increase in depth of the one or more recessed center sections 209 will be possible as a substantially flat first diaphragm 203 avoids a concave protrusion into the speaker device 201.
As mentioned above, the frame 202 may comprise a first frame part 202a and second frame part 202b, the first frame part 202a being provided with one or more first cavities 213 to receive at least in part the second speaker driver 206, and wherein the second frame part 202b is provided with one or more second cavities 214 to receive at least in part the first speaker driver 205. In the assembled state of the speaker device 201, the first and second diaphragm support members 207, 208 will be rotationally offset (crosswise) as inferred from
In an embodiment, the first speaker driver 205 may comprise two spaced apart first magnet parts 215 which may be received in two spaced apart corresponding second cavities 214 in the second frame part 202b of the frame 202. Likewise, the second speaker driver 206 may comprise two spaced apart second magnet parts 216 which may be received in two spaced apart corresponding first cavities 213 in the first frame part 202a of the frame 202. The aforementioned two spaced apart moveable first driver parts 205a, 205b, each comprising e.g. a coil, may be movably arranged along the corresponding two spaced apart first magnet parts 215. The two spaced apart moveable second driver parts 206a, 206b, each comprising e.g. a coil, may be movably arranged along the corresponding two second magnet parts 216.
Referring to
The speaker device 301 further comprises a first speaker driver 305 configured to drive the first diaphragm 303 and a second speaker driver 306 configured to drive the second diaphragm 304, i.e. the first and second speaker driver 305, 306 are configured for moving the first and second diaphragm 303, 304 for sound production.
As depicted in
Since the first frame side 302a and/or the second frame side 302b comprise the PCB 307 allows for a compact electrical arrangement for controlling the first and second speaker drivers 305, 306 as well as connecting the speaker device 301 to an external device. The PCB 307 further allows for compact and reliable routing of electrical connections between various electrical components of the speaker device 301. Moreover, the PCB 307 increases structural rigidity of the first and/or the second frame side 302a, 302b considerably and as such rigidity of the frame 302 is increased, thereby reducing resonance and other unwanted vibrations of the speaker device 301 that could potentially reduce overall performance.
In an embodiment, the PCB 307 comprises sensor electronics and/or or integrated chips. That is, in this embodiment, the PCB 307 allows various sensor electronics and/or integrated chips to be housed in the speaker device 301 in a space saving manner, where loose electrical wiring inside the speaker device 301 is minimized. In an exemplary embodiment, the sensor electronics and/or the integrated chips comprise at least one of: a temperature sensor, an accelerometer, a gyroscope, a magnetometer, a proximity sensor, a microphone, a frequency filtering element, a microprocessor, a barometer, a thermometer, an air humidity sensor. Therefore, in this embodiment the PCB 7 allows for high integration of many different types of electronic components and combinations thereof whilst improving structural rigidity of the speaker device 1 also.
To further improve structural rigidity and safety of the speaker device 301, in an exemplary embodiment the PCB 307 is made of a metal and/or Flame Retardant/Resistant materials, FR, such as FR-2, FR-4.
Various electronic components as mentioned above and combinations thereof may be provided on the PCB 307 in space saving manner. To that end there is provided an embodiment wherein the PCB 307 comprises a plurality of layers. Each of the layers may be utilized to accommodate one or more electronic components and may also be used for routing electrical connections between various electrical components.
As mentioned above, the first frame side 302a and/or the second frame side 302b comprise the PCB 307 to provide a compact electrical arrangement for controlling the first and second speaker drivers 305, 306 as well as connecting the speaker device 301 to an external device, e.g. one or more external devices. At the same time, the PCB 307 increases structural rigidity of the first and/or the second frame side 302a, 302b and as such the overall rigidity of the frame 302. Increasing structural rigidity in this way maintains a compact form factor of the speaker device 301 yet allows significant reduction of resonance and other unwanted vibrations of the speaker device 301 that could potentially reduce overall performance thereof.
The increased rigidity of the first and second frame sides 302a, 302b can be increased in an advantageous embodiment wherein the PCB 307 is integrally formed, e.g. in unitary manner, with the first frame side 302a and/or the second frame side 302b. That is, as shown, the first and/or the second frame sides 302a, 302b may be provided as the PCB 307 itself, so wherein the PCB 307 defines the front and/or back surface of the speaker device 301. In this way the number of structural components is minimized whist still providing all necessary electrical components for the speaker device 301.
In an alternative embodiment, the PCB 307 may be mechanically bonded to the first and/or second frame sides 302a, 302b. In this particular embodiment the first and/or second frame sides 302a, 302b may be provided as dedicated structural side/surface plates on which the PCB 307 is mechanically bonded. The first and second frame sides 302a, 302b may then be made of a material that maximizes structural rigidity. In another alternative embodiment, the PCB 307 is chemically bonded to the first and/or second frame side 302a, 302b, e.g. by means of an adhesive. This embodiment also allows the first and/or second frame sides 302a, 302b to be provided as dedicated structural side/surface plates to maximize structural rigidity and on which the PCB 307 is chemically bonded.
As depicted in
It is further shown in
In
As mentioned earlier, the speaker device 101, 201, 301 of the present invention allows for the first diaphragm 103, 203, 303 and the second diaphragm 104, 204, 304 to have different shapes, thereby allowing for good sound range and performance whilst providing a small or compact profile to the speaker device 101, 201, 301. This was explained in light of
To further clarify what such different shapes mean,
In contrast to the
The embodiments of
The present invention has been described above with reference to a number of exemplary embodiments as shown in the drawings. Modifications and alternative implementations of some parts or features are possible, and are included in the scope of protection as defined in the appended claims. Moreover, all features of the speaker device 101, the speaker device 102, and the speaker device 103 described above may be combined in a single speaker device.
In view of the above disclosure, the present invention and aspects thereof may now be defined and summarized by the following embodiments:
| Number | Date | Country | Kind |
|---|---|---|---|
| 21201399.9 | Oct 2021 | EP | regional |
| 21201404.7 | Oct 2021 | EP | regional |
| 21201405.4 | Oct 2021 | EP | regional |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/US2022/077272 | 9/29/2022 | WO |
